MY180005A - Manufacturing apparatus, conveyance method, and storage medium storing conveyance program - Google Patents

Manufacturing apparatus, conveyance method, and storage medium storing conveyance program

Info

Publication number
MY180005A
MY180005A MYPI2016700697A MYPI2016700697A MY180005A MY 180005 A MY180005 A MY 180005A MY PI2016700697 A MYPI2016700697 A MY PI2016700697A MY PI2016700697 A MYPI2016700697 A MY PI2016700697A MY 180005 A MY180005 A MY 180005A
Authority
MY
Malaysia
Prior art keywords
holding members
conveyance
main body
arrangement
manufacturing apparatus
Prior art date
Application number
MYPI2016700697A
Inventor
Imai Ichiro
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY180005A publication Critical patent/MY180005A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • General Factory Administration (AREA)

Abstract

There is a demand for a configuration in which more efficient workpiece conveyance can be implemented even in the case where a plurality of workpieces arranged in accordance with a certain arrangement rule need to be rearranged in accordance with various arrangement rules that are different from an arrangement rule at a conveyance source. A manufacturing apparatus includes: a main body (82) including a plurality of holding members (84) arranged at regular intervals in a first direction; a movement mechanism (23) for moving the main body from a first position to a second position; and a controller (100) for controlling the main body and the movement mechanism. The main body is configured such that a distance between the holding members can be adjusted in the first direction while maintaining equal intervals according to a command from the controller. The controller selects in a regular manner in accordance with a second arrangement rule, at least one of: one or more holding members used for holding one or more workpieces from among the plurality of holding members; and one or more arrangement positions where one or more workpieces are to be arranged from among a plurality of arrangement positions included in the second arrangement rule, and determines a distance between the holding members according to the regular selection.
MYPI2016700697A 2015-03-04 2016-02-29 Manufacturing apparatus, conveyance method, and storage medium storing conveyance program MY180005A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015042348A JP6382132B2 (en) 2015-03-04 2015-03-04 Cutting device, conveying method, conveying program, and recording medium storing conveying program

Publications (1)

Publication Number Publication Date
MY180005A true MY180005A (en) 2020-11-19

Family

ID=56847569

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016700697A MY180005A (en) 2015-03-04 2016-02-29 Manufacturing apparatus, conveyance method, and storage medium storing conveyance program

Country Status (5)

Country Link
JP (1) JP6382132B2 (en)
KR (1) KR101800111B1 (en)
CN (1) CN105936417B (en)
MY (1) MY180005A (en)
TW (1) TWI607521B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3315309B1 (en) * 2016-10-31 2021-08-04 HP Scitex Ltd Vacuum within a pallet conveyor for a printing system
JP2022110183A (en) * 2021-01-18 2022-07-29 Ｔｏｗａ株式会社 Conveyance mechanism, cutting device, and manufacturing method of cut product

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3341324B2 (en) * 1992-12-01 2002-11-05 日立電子エンジニアリング株式会社 Work transfer device and work transfer method
JPH08264993A (en) * 1995-03-28 1996-10-11 Advantest Corp Device carrying device for ic handler
JP2008186981A (en) * 2007-01-30 2008-08-14 Towa Corp Work carrying method and apparatus
KR100923252B1 (en) * 2007-08-22 2009-10-27 세크론 주식회사 Method and apparatus for transferring semiconductor devices in test handler
DE102007039850B4 (en) * 2007-08-23 2016-09-15 Khs Gmbh packers head
JP5108481B2 (en) * 2007-11-30 2012-12-26 Ｔｏｗａ株式会社 Device and method for conveying individualized electronic components
KR101210302B1 (en) * 2010-08-24 2012-12-10 세크론 주식회사 Method for sorting a semiconductor device
JP6007141B2 (en) * 2013-03-22 2016-10-12 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, program, and computer storage medium
JP6017382B2 (en) * 2013-07-29 2016-11-02 Ｔｏｗａ株式会社 Device and method for conveying individualized electronic components

Also Published As

Publication number Publication date
KR20160108154A (en) 2016-09-19
CN105936417B (en) 2018-10-26
JP6382132B2 (en) 2018-08-29
TWI607521B (en) 2017-12-01
JP2016162953A (en) 2016-09-05
TW201703179A (en) 2017-01-16
CN105936417A (en) 2016-09-14
KR101800111B1 (en) 2017-11-21

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