MY168372A - Resin-bond wire saw - Google Patents

Resin-bond wire saw

Info

Publication number
MY168372A
MY168372A MYPI2015001761A MYPI2015001761A MY168372A MY 168372 A MY168372 A MY 168372A MY PI2015001761 A MYPI2015001761 A MY PI2015001761A MY PI2015001761 A MYPI2015001761 A MY PI2015001761A MY 168372 A MY168372 A MY 168372A
Authority
MY
Malaysia
Prior art keywords
resin
wire saw
bond
bond wire
mass spectrometry
Prior art date
Application number
MYPI2015001761A
Inventor
Masahiko Ikeuchi
Original Assignee
Tkx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tkx Corp filed Critical Tkx Corp
Publication of MY168372A publication Critical patent/MY168372A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Abstract

A RESIN-BOND WIRE SAW IN WHICH ABRASIVE GRAINS ARE FIXED TO A SURFACE OF A WIRE WITH A RESIN BOND CONTAINING A NOVOLAK-TYPE PHENOL RESIN, A RESOL-TYPE PHENOL RESIN, AND AN AMINE-BASED SILANE COUPLING AGENT. THE RESIN BOND SHOWS A PLURALITY OF PEAKS AT INTERVALS OF 208 (M/Z) THAT REPRESENT FRAGMENTS IN CATIONS IN MATRIX-ASSISTED LASER DESORPTION IONIZATION-TIME OF FLIGHT-MASS SPECTROMETRY (MASS SPECTROMETRY) AND A PEAK THAT CORRESPONDS TO A SOFTENING POINT AT 175°C TO 182°C IN THERMOGRAVIMETRY AND DIFFERENTIAL THERMAL ANALYSIS (DIFFERENTIAL THERMAL ANALYSIS). (FIG. 4)
MYPI2015001761A 2013-01-10 2013-12-04 Resin-bond wire saw MY168372A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013002792A JP5792208B2 (en) 2013-01-10 2013-01-10 Resin bond wire saw

Publications (1)

Publication Number Publication Date
MY168372A true MY168372A (en) 2018-10-31

Family

ID=51166811

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015001761A MY168372A (en) 2013-01-10 2013-12-04 Resin-bond wire saw

Country Status (7)

Country Link
JP (1) JP5792208B2 (en)
KR (1) KR101594747B1 (en)
CN (1) CN104918752B (en)
MY (1) MY168372A (en)
SG (1) SG11201504210SA (en)
TW (1) TWI519366B (en)
WO (1) WO2014109149A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016171018A1 (en) * 2015-04-20 2016-10-27 株式会社Tkx Method for producing fine silicon powder, and method for producing fine silicon nitride powder
JP7002935B2 (en) * 2015-05-21 2022-01-20 三井化学東セロ株式会社 Manufacturing method of gas barrier laminate
SG11201804316UA (en) * 2016-05-24 2018-06-28 Tkx Corp Device for manufacturing coated wire

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940001070B1 (en) * 1990-12-29 1994-02-12 고려화학 주식회사 Preparation of epoxy resin compositions for encapsulating semiconductor
JP3734854B2 (en) 1995-07-18 2006-01-11 古河電気工業株式会社 Hot air circulation type individual multiple enamel wire baking furnace and method for producing enamel wire using the same
US6070570A (en) * 1997-02-14 2000-06-06 Sumitomo Electric Industries, Ltd. Wire-saw and its manufacturing method
JP2000263452A (en) 1999-03-12 2000-09-26 Osaka Diamond Ind Co Ltd Super-abrasive grain wire saw
JP2000271872A (en) 1999-03-23 2000-10-03 Osaka Diamond Ind Co Ltd Super abrasive grain resin bond wire saw
JP2001259993A (en) * 2000-03-10 2001-09-25 Noritake Diamond Ind Co Ltd Resin bond wire saw
JP2008006584A (en) * 2000-05-15 2008-01-17 Allied Material Corp Cutting method using super-abrasive grain wire saw
JP2003334763A (en) 2002-05-16 2003-11-25 Read Co Ltd Fixed abrasive grain wire saw
CN1784292A (en) * 2003-05-09 2006-06-07 戴蒙得创新股份有限公司 Abrasive particles having coatings with tortuous surface topography
JP2006123024A (en) 2004-10-26 2006-05-18 Nakamura Choko:Kk Fixed abrasive grain type wire saw and its manufacturing method
JP4703448B2 (en) * 2006-03-22 2011-06-15 株式会社ノリタケスーパーアブレーシブ Resin bond wire saw
JP2008103690A (en) 2007-08-24 2008-05-01 Mitsubishi Electric Corp Slurry used for cutting silicon ingot
CN101712135B (en) * 2008-09-30 2014-07-02 日本则武超精密磨料磨具有限公司 Resin bonder wire saw
CN101445587B (en) * 2008-12-26 2011-11-16 南京师范大学 Resin binding agent for a diamond wire saw and preparation method thereof
JP5443825B2 (en) 2009-05-15 2014-03-19 古河電気工業株式会社 Enamel wire printing equipment
CN102513609B (en) * 2011-12-28 2013-09-25 山东大学 Resin bond consolidation abrasive wire saw production system

Also Published As

Publication number Publication date
KR101594747B1 (en) 2016-02-16
CN104918752B (en) 2016-04-20
SG11201504210SA (en) 2015-07-30
TW201433391A (en) 2014-09-01
KR20150102946A (en) 2015-09-09
JP5792208B2 (en) 2015-10-07
CN104918752A (en) 2015-09-16
JP2014133288A (en) 2014-07-24
WO2014109149A1 (en) 2014-07-17
TWI519366B (en) 2016-02-01

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