MY167461A - Dicing die bonding film packaging structure and packing method - Google Patents

Dicing die bonding film packaging structure and packing method

Info

Publication number
MY167461A
MY167461A MYPI2013002645A MYPI2013002645A MY167461A MY 167461 A MY167461 A MY 167461A MY PI2013002645 A MYPI2013002645 A MY PI2013002645A MY PI2013002645 A MYPI2013002645 A MY PI2013002645A MY 167461 A MY167461 A MY 167461A
Authority
MY
Malaysia
Prior art keywords
roll
side plates
die bonding
dicing die
bonding film
Prior art date
Application number
MYPI2013002645A
Other languages
English (en)
Inventor
Masami Aoyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY167461A publication Critical patent/MY167461A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22—Details
    • B65D77/24—Inserts or accessories added or incorporated during filling of containers
    • B65D77/26—Elements or devices for locating or protecting articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D71/00—Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material
    • B65D71/50—Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material comprising a plurality of articles held together only partially by packaging elements formed otherwise than by folding a blank
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/053—Corner, edge or end protectors
    • B65D81/058—Protectors contacting five surfaces of the packaged article, e.g. five-sided end protectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/67—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
    • B65D85/671—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form
    • B65D85/672—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form on cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2581/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D2581/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D2581/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/051—Details of packaging elements for maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/057—Edge protectors adapted to protect the circular edge of rolls of material, e.g. coils of sheet metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Of Machine Parts And Wound Products (AREA)
  • Packages (AREA)
  • Buffer Packaging (AREA)
MYPI2013002645A 2011-09-09 2012-09-05 Dicing die bonding film packaging structure and packing method MY167461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011196753 2011-09-09

Publications (1)

Publication Number Publication Date
MY167461A true MY167461A (en) 2018-08-28

Family

ID=47832192

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002645A MY167461A (en) 2011-09-09 2012-09-05 Dicing die bonding film packaging structure and packing method

Country Status (7)

Country Link
US (1) US20140034532A1 (ja)
JP (1) JP5778244B2 (ja)
KR (1) KR20130126935A (ja)
CN (1) CN103476682B (ja)
MY (1) MY167461A (ja)
TW (1) TWI485094B (ja)
WO (1) WO2013035749A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5739782B2 (ja) * 2011-10-11 2015-06-24 古河電気工業株式会社 ダイシングダイボンディングフィルムの梱包構造、およびこの梱包方法
TW201408552A (zh) * 2012-08-27 2014-03-01 Hon Hai Prec Ind Co Ltd 包裝裝置
JPWO2015159647A1 (ja) * 2014-04-17 2017-04-13 コニカミノルタ株式会社 光反射フィルムロール及び光反射フィルムロール包装体
JP6005108B2 (ja) * 2014-08-01 2016-10-12 古河電気工業株式会社 ダイシングダイボンディングフィルムまたはダイボンドフィルムの梱包構造
CN109592478A (zh) * 2017-09-30 2019-04-09 中航光电科技股份有限公司 一种带包装线缆及其线缆包装组件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS572568B2 (ja) * 1974-04-16 1982-01-18
US4033454A (en) * 1976-07-06 1977-07-05 Greif Bros. Corporation Method and structure for retaining shipping drums on pallets
US4287991A (en) * 1979-04-02 1981-09-08 Donnelly Bernard P Modularized unit load and disposable pallet therefor
JPS5846765U (ja) * 1981-09-24 1983-03-29 大森機械工業株式会社 積重状の紙葉状物品の把束体
US4730732A (en) * 1982-09-30 1988-03-15 Continental Fibre Drum, Inc. Pallet and top frame for scrolled drum palletized package
US4821880A (en) * 1987-07-27 1989-04-18 Essex Group, Inc. Palletized structure containing spools
JP2604907Y2 (ja) * 1993-12-01 2000-06-12 村▲ずみ▼株式会社 ロール製品用プロテクター
EP1434088B1 (en) * 2002-12-27 2006-08-30 Fuji Photo Film Co., Ltd. Roll support member and recording material package employing same
US20040251156A1 (en) * 2003-06-12 2004-12-16 Bell Norman H. Roll end support
ATE479604T1 (de) * 2003-10-14 2010-09-15 Kyowa Ltd Nichtmetallischer bindestreifen
JP2007161286A (ja) * 2005-12-12 2007-06-28 Asahi Kasei Electronics Co Ltd 感光性フィルムロールの梱包材
JP5322609B2 (ja) * 2008-12-01 2013-10-23 日東電工株式会社 半導体装置製造用フィルムロール
JP4956560B2 (ja) * 2009-01-14 2012-06-20 古河電気工業株式会社 ウエハ加工用テープのロール体の包装方法
JP5349111B2 (ja) * 2009-03-30 2013-11-20 村角株式会社 ロール製品用プロテクター
JP5683078B2 (ja) * 2009-04-10 2015-03-11 村角株式会社 ロール製品用プロテクター

Also Published As

Publication number Publication date
CN103476682A (zh) 2013-12-25
TW201318934A (zh) 2013-05-16
KR20130126935A (ko) 2013-11-21
TWI485094B (zh) 2015-05-21
WO2013035749A1 (ja) 2013-03-14
JP5778244B2 (ja) 2015-09-16
US20140034532A1 (en) 2014-02-06
JPWO2013035749A1 (ja) 2015-03-23
CN103476682B (zh) 2015-05-13

Similar Documents

Publication Publication Date Title
USD724286S1 (en) Cleaning cloth
USD691221S1 (en) Exercise weight
USD683072S1 (en) Hair wrap
MY167461A (en) Dicing die bonding film packaging structure and packing method
WO2014015996A3 (de) Wasserlösliche verpackung und verfahren dessen herstellung
CL2014003100A1 (es) Un articulo absorbente que comprende un estructura que comprende, un lienzo superior e inferior, un nucleo dispuesto entre ambos lienzos, una primera y una segunda porcion de extremo, una porcion de cinturon con una primera y una segunda zona de textura, donde la segunda zona comprende una segunda porcion de sustratos y elementos elasticos.
WO2013190517A3 (en) Improvements to continuous motion rotatable forming of soluble pouches
IL231994A0 (en) A machine for packing rolls of paper and the like
AR088417A1 (es) Envases para productos de consumo y metodos para el uso de los mismos
CA150915S (en) Mattress
CA150916S (en) Mattress
USD701286S1 (en) Container
CA141525S (en) Hose reel enclosure
CL2014001398A1 (es) Papel de cubierta de boquilla para un articulo de fumar, provisto con una estructura de elevaciones, donde entre las elevaciones se encuentran zonas superficiales del papel de cubierta, sobre las que sobresalen las elevaciones al menos en 5 µm en la direccion perpendicularmente al plano del papel de cubierta de la boquilla; y procedimiento de fabricacion.
MY154602A (en) Absorbent article package
CA150917S (en) Mattress
ZA201402792B (en) Packaging material, package and packaging blank
CA135186S (en) Floatation inner-tube
CL2014001477A1 (es) Producto de chocolate con una cobertura tropicalizada, que comprende chocolate y un liquido humectante y un nucleo de chocolate no-tropicalizado; y metodo para elaborar un producto de chocolateria.
USD694520S1 (en) Racquet equipment bag
PL2490970T3 (pl) Rdzeń do produktu w postaci arkusza nawiniętego wokół tego rdzenia oraz rolka z takim rdzeniem
CA148800S (en) Container
USD651824S1 (en) Roll wrap display
USD683055S1 (en) Inter-locking construction block
USD674164S1 (en) Pallet frame