MY162873A - Two Layered Gold Plating Method and Electronic Component - Google Patents

Two Layered Gold Plating Method and Electronic Component

Info

Publication number
MY162873A
MY162873A MYPI2014701950A MYPI2014701950A MY162873A MY 162873 A MY162873 A MY 162873A MY PI2014701950 A MYPI2014701950 A MY PI2014701950A MY PI2014701950 A MYPI2014701950 A MY PI2014701950A MY 162873 A MY162873 A MY 162873A
Authority
MY
Malaysia
Prior art keywords
gold
electronic component
plating method
plated layer
gold plating
Prior art date
Application number
MYPI2014701950A
Inventor
Shigeru Hayashi
Original Assignee
Nichiei Giken Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiei Giken Kk filed Critical Nichiei Giken Kk
Publication of MY162873A publication Critical patent/MY162873A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

A gold plating method with superior anticorrosion property at low cost and an electronic component produced by the method. A two layered gold plating method comprises the steps of forming a base gold-plated layer on a surface of a metal to be plated as a first plating, and forming a finish gold-plated layer as a second plating by depositing a gold crystal smaller than that of the base gold-plated layer on a surface of the base gold-plated layer by an electrolytic method.
MYPI2014701950A 2013-12-28 2013-12-28 Two Layered Gold Plating Method and Electronic Component MY162873A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/085281 WO2015097917A1 (en) 2013-12-28 2013-12-28 Double gold plating method and electronic component

Publications (1)

Publication Number Publication Date
MY162873A true MY162873A (en) 2017-07-20

Family

ID=53477843

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014701950A MY162873A (en) 2013-12-28 2013-12-28 Two Layered Gold Plating Method and Electronic Component

Country Status (4)

Country Link
JP (1) JP5869685B2 (en)
MY (1) MY162873A (en)
SG (1) SG11201404245YA (en)
WO (1) WO2015097917A1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217226A (en) * 1990-12-19 1992-08-07 Fujitsu Ltd Manufacture of light guide path type device
JP3898334B2 (en) * 1998-04-15 2007-03-28 日本エレクトロプレイテイング・エンジニヤース株式会社 Gold plating solution and plating method using the gold plating solution

Also Published As

Publication number Publication date
WO2015097917A1 (en) 2015-07-02
SG11201404245YA (en) 2015-08-28
JPWO2015097917A1 (en) 2017-03-23
JP5869685B2 (en) 2016-02-24

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