MY161519A - Pre-heating system for silicon dies - Google Patents
Pre-heating system for silicon diesInfo
- Publication number
- MY161519A MY161519A MYPI2010003042A MYPI2010003042A MY161519A MY 161519 A MY161519 A MY 161519A MY PI2010003042 A MYPI2010003042 A MY PI2010003042A MY PI2010003042 A MYPI2010003042 A MY PI2010003042A MY 161519 A MY161519 A MY 161519A
- Authority
- MY
- Malaysia
- Prior art keywords
- dies
- heaters
- heating system
- desired temperature
- silicon dies
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2007/000441 WO2009085009A1 (en) | 2007-12-27 | 2007-12-27 | Pre-heating system and method for silicon dies |
Publications (1)
Publication Number | Publication Date |
---|---|
MY161519A true MY161519A (en) | 2017-04-28 |
Family
ID=40824560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2010003042A MY161519A (en) | 2007-12-27 | 2007-12-27 | Pre-heating system for silicon dies |
Country Status (5)
Country | Link |
---|---|
CN (1) | CN101933411B (zh) |
MY (1) | MY161519A (zh) |
PH (1) | PH12010501459A1 (zh) |
TW (1) | TWI451508B (zh) |
WO (1) | WO2009085009A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11069555B2 (en) * | 2018-09-03 | 2021-07-20 | Assembleon B.V. | Die attach systems, and methods of attaching a die to a substrate |
CN110116287B (zh) * | 2019-05-09 | 2024-08-13 | 深圳九州光电子技术有限公司 | 芯片上料焊接系统 |
CN110211899A (zh) * | 2019-05-09 | 2019-09-06 | 四川九州光电子技术有限公司 | 一种芯片预热及焊接系统 |
CN110170720A (zh) * | 2019-05-31 | 2019-08-27 | 广东瑞谷光网通信股份有限公司 | 一种定位加热台 |
CN111524842A (zh) * | 2020-07-06 | 2020-08-11 | 宁波润华全芯微电子设备有限公司 | 一种渐进式烘烤加热装置 |
CN117594496B (zh) * | 2024-01-11 | 2024-04-09 | 安徽众合半导体科技有限公司 | 一种半导体引线框架移动预热机构及预热方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1021877C (zh) * | 1988-07-21 | 1993-08-18 | 日本电热计器株式会社 | 焊接装置 |
US5259545A (en) * | 1991-12-20 | 1993-11-09 | Vlsi Technology, Inc. | Apparatus for bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequence |
US6110805A (en) * | 1997-12-19 | 2000-08-29 | Micron Technology, Inc. | Method and apparatus for attaching a workpiece to a workpiece support |
US6911624B2 (en) * | 2002-08-23 | 2005-06-28 | Micron Technology, Inc. | Component installation, removal, and replacement apparatus and method |
-
2007
- 2007-12-27 WO PCT/SG2007/000441 patent/WO2009085009A1/en active Application Filing
- 2007-12-27 MY MYPI2010003042A patent/MY161519A/en unknown
- 2007-12-27 CN CN2007801021164A patent/CN101933411B/zh active Active
-
2008
- 2008-11-27 TW TW097145880A patent/TWI451508B/zh active
-
2010
- 2010-06-23 PH PH12010501459A patent/PH12010501459A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN101933411A (zh) | 2010-12-29 |
WO2009085009A1 (en) | 2009-07-09 |
CN101933411B (zh) | 2012-11-21 |
PH12010501459A1 (en) | 2015-04-27 |
TWI451508B (zh) | 2014-09-01 |
TW200939373A (en) | 2009-09-16 |
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