MY161519A - Pre-heating system for silicon dies - Google Patents

Pre-heating system for silicon dies

Info

Publication number
MY161519A
MY161519A MYPI2010003042A MYPI2010003042A MY161519A MY 161519 A MY161519 A MY 161519A MY PI2010003042 A MYPI2010003042 A MY PI2010003042A MY PI2010003042 A MYPI2010003042 A MY PI2010003042A MY 161519 A MY161519 A MY 161519A
Authority
MY
Malaysia
Prior art keywords
dies
heaters
heating system
desired temperature
silicon dies
Prior art date
Application number
MYPI2010003042A
Other languages
English (en)
Inventor
Amlan Sen
Chin Guan Khaw
Original Assignee
Orion Systems Integrated Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orion Systems Integrated Pte Ltd filed Critical Orion Systems Integrated Pte Ltd
Publication of MY161519A publication Critical patent/MY161519A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI2010003042A 2007-12-27 2007-12-27 Pre-heating system for silicon dies MY161519A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2007/000441 WO2009085009A1 (en) 2007-12-27 2007-12-27 Pre-heating system and method for silicon dies

Publications (1)

Publication Number Publication Date
MY161519A true MY161519A (en) 2017-04-28

Family

ID=40824560

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003042A MY161519A (en) 2007-12-27 2007-12-27 Pre-heating system for silicon dies

Country Status (5)

Country Link
CN (1) CN101933411B (zh)
MY (1) MY161519A (zh)
PH (1) PH12010501459A1 (zh)
TW (1) TWI451508B (zh)
WO (1) WO2009085009A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11069555B2 (en) * 2018-09-03 2021-07-20 Assembleon B.V. Die attach systems, and methods of attaching a die to a substrate
CN110116287A (zh) * 2019-05-09 2019-08-13 四川九州光电子技术有限公司 芯片上料焊接系统
CN110211899A (zh) * 2019-05-09 2019-09-06 四川九州光电子技术有限公司 一种芯片预热及焊接系统
CN110170720A (zh) * 2019-05-31 2019-08-27 广东瑞谷光网通信股份有限公司 一种定位加热台
CN111524842A (zh) * 2020-07-06 2020-08-11 宁波润华全芯微电子设备有限公司 一种渐进式烘烤加热装置
CN117594496B (zh) * 2024-01-11 2024-04-09 安徽众合半导体科技有限公司 一种半导体引线框架移动预热机构及预热方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1021877C (zh) * 1988-07-21 1993-08-18 日本电热计器株式会社 焊接装置
US5259545A (en) * 1991-12-20 1993-11-09 Vlsi Technology, Inc. Apparatus for bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequence
US6110805A (en) * 1997-12-19 2000-08-29 Micron Technology, Inc. Method and apparatus for attaching a workpiece to a workpiece support
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method

Also Published As

Publication number Publication date
CN101933411A (zh) 2010-12-29
TW200939373A (en) 2009-09-16
CN101933411B (zh) 2012-11-21
WO2009085009A1 (en) 2009-07-09
TWI451508B (zh) 2014-09-01
PH12010501459A1 (en) 2015-04-27

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