MY161352A - Electrolytic copper foil and production method of electrolytic copper foil - Google Patents

Electrolytic copper foil and production method of electrolytic copper foil

Info

Publication number
MY161352A
MY161352A MYPI2013003543A MYPI2013003543A MY161352A MY 161352 A MY161352 A MY 161352A MY PI2013003543 A MYPI2013003543 A MY PI2013003543A MY PI2013003543 A MYPI2013003543 A MY PI2013003543A MY 161352 A MY161352 A MY 161352A
Authority
MY
Malaysia
Prior art keywords
copper foil
electrolytic copper
sulfur concentration
production method
ppm
Prior art date
Application number
MYPI2013003543A
Inventor
Michiya Kohiki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY161352A publication Critical patent/MY161352A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38—Chromatising
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

THE PRESENT INVENTION PROVIDES AN ELECTROLYTIC COPPER FOIL THAT HAS A HIGH NORMAL TENSILE STRENGTH, A LOW DECREASE IN TENSILE STRENGTH AFTER A THERMAL HISTORY, AND A LOW CONCENTRATION OF IMPURITIES IN THE COPPER FOIL AND A METHOD FOR PRODUCING THE COPPER FOIL. SPECIFICALLY, THE ELECTROLYTIC COPPER FOIL IN WHICH A SULFUR CONCENTRATION OF THE COPPER FOIL IS NOT LESS THAN 10 PPM BY MASS BUT NO MORE THAN 50 PPM BY MASS, WHEREIN WHEN LATTICES WITH A SPACING OF 10 NM IN A STEM IMAGE OBSERVED WITH A SCANNING TRANSMISSION ELECTRON MICROSCOPE AT A MAGNIFICATION OF 1 MILLION TIMES ARE FORMED AND INTERSECTIONS OF EACH LATTICE ARE USED AS A MEASUREMENT POINT FOR DETERMINING A SULFUR CONCENTRATION, THERE IS A MEASUREMENT POINT AT WHICH THE SULFUR CONCENTRATION IS HIGHER AS COMPARED TO THE SULFUR CONCENTRATION OF THE COPPER FOIL.
MYPI2013003543A 2011-03-30 2012-03-28 Electrolytic copper foil and production method of electrolytic copper foil MY161352A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011076638A JP5148726B2 (en) 2011-03-30 2011-03-30 Electrolytic copper foil and method for producing electrolytic copper foil

Publications (1)

Publication Number Publication Date
MY161352A true MY161352A (en) 2017-04-14

Family

ID=46931272

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013003543A MY161352A (en) 2011-03-30 2012-03-28 Electrolytic copper foil and production method of electrolytic copper foil

Country Status (8)

Country Link
US (1) US20140318973A1 (en)
EP (1) EP2692904A1 (en)
JP (1) JP5148726B2 (en)
KR (2) KR20130132634A (en)
CN (1) CN103429793B (en)
MY (1) MY161352A (en)
TW (1) TWI460313B (en)
WO (1) WO2012133565A1 (en)

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* Cited by examiner, † Cited by third party
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JP5722813B2 (en) * 2012-03-02 2015-05-27 Jx日鉱日石金属株式会社 Electrode copper foil and negative electrode current collector for secondary battery
JP5362922B1 (en) * 2012-10-12 2013-12-11 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminate using the same
JP5432357B1 (en) * 2012-09-10 2014-03-05 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminated board, copper-clad laminated board, printed wiring board and electronic device using the same
JP5362923B1 (en) * 2012-10-12 2013-12-11 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminate using the same
TWI482882B (en) * 2012-09-10 2015-05-01 Ｊｘ日鑛日石金屬股份有限公司 Surface treatment of copper foil and the use of its laminated board
WO2014038717A1 (en) * 2012-09-10 2014-03-13 Jx日鉱日石金属株式会社 Surface-treated copper foil and laminated board using same
JP5362921B1 (en) 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminate using the same
JP5362899B1 (en) * 2012-09-10 2013-12-11 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminate using the same
JP2014070263A (en) * 2012-09-28 2014-04-21 Jx Nippon Mining & Metals Corp Electrolytic copper foil and production method of electrolytic copper foil
WO2014073696A1 (en) * 2012-11-09 2014-05-15 Jx日鉱日石金属株式会社 Surface-treated copper foil and laminate using same
JP5362898B1 (en) 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil, laminate using the same, printed wiring board, and copper-clad laminate
CN104769165B (en) * 2012-11-09 2017-08-25 Jx日矿日石金属株式会社 Surface treatment copper foil and use its laminated plates, copper-cover laminated plate, printing distributing board and e-machine
JP5362924B1 (en) * 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminate using the same
WO2014156638A1 (en) * 2013-03-26 2014-10-02 古河電気工業株式会社 All-solid-state secondary battery
KR20150086222A (en) * 2013-04-30 2015-07-27 후루카와 덴키 고교 가부시키가이샤 Copper foil for lithium-ion secondary battery negative electrode collector
MY183375A (en) * 2013-12-10 2021-02-18 Jx Nippon Mining & Metals Corp Surface treated copper foil, copper clad laminate, printed wiring board, electronic apparatus and method for manufacturing printed wiring board
CN105814242B (en) * 2013-12-10 2018-08-10 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, and method for producing printed wiring board
KR101897474B1 (en) * 2015-06-26 2018-09-12 케이씨에프테크놀로지스 주식회사 Electrolytic copper foil for lithium secondary battery and Lithium secondary battery comprising the same
JP6821370B2 (en) * 2016-09-29 2021-01-27 Ｊｘ金属株式会社 Metal foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic equipment
US12170375B2 (en) * 2019-10-30 2024-12-17 Chang Chun Petrochemical Co., Ltd. Copper foil having excellent heat resistance property
WO2023057067A1 (en) * 2021-10-07 2023-04-13 Circuit Foil Luxembourg Copper foil with high engery at break and secondary battery comprising the same
LU501353B1 (en) * 2022-01-28 2023-07-28 Circuit Foil Luxembourg Electrodeposited copper foil and method for producing same
JP2025144558A (en) * 2024-03-19 2025-10-02 長春石油化學股▲分▼有限公司 Copper foil, current collector and lithium-ion secondary battery
EP4621086A1 (en) * 2024-03-19 2025-09-24 Chang Chun Petrochemical Co., Ltd. Copper foil, current collector and lithium ion secondary battery

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
JPH1036992A (en) * 1996-07-19 1998-02-10 Japan Energy Corp Electrolytic copper foil and method for producing the same
JP3850155B2 (en) 1998-12-11 2006-11-29 日本電解株式会社 Electrolytic copper foil, copper foil for current collector of secondary battery and secondary battery
JP2001011685A (en) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil and method for producing the same
JP2002053993A (en) * 2000-08-04 2002-02-19 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil and method for producing the same
JP2005113183A (en) * 2003-10-06 2005-04-28 Fujikura Ltd Electrolytic copper foil, method for producing the same, and copper-clad laminate
KR100975491B1 (en) * 2005-03-31 2010-08-11 미쓰이 긴조꾸 고교 가부시키가이샤 Manufacturing method of electrolytic copper foil and electrolytic copper foil
JP5255229B2 (en) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 Electrolytic copper foil, surface-treated copper foil using the electrolytic copper foil, copper-clad laminate using the surface-treated copper foil, and method for producing the electrolytic copper foil
JP2008285727A (en) * 2007-05-18 2008-11-27 Furukawa Circuit Foil Kk High tensile strength electrolytic copper foil and manufacturing method thereof
JP5588607B2 (en) * 2007-10-31 2014-09-10 三井金属鉱業株式会社 Electrolytic copper foil and method for producing the electrolytic copper foil
JP5301886B2 (en) 2008-06-10 2013-09-25 三井金属鉱業株式会社 Electrolytic copper foil and method for producing the electrolytic copper foil

Also Published As

Publication number Publication date
US20140318973A1 (en) 2014-10-30
TWI460313B (en) 2014-11-11
JP5148726B2 (en) 2013-02-20
KR101967022B1 (en) 2019-04-08
JP2012211351A (en) 2012-11-01
KR20130132634A (en) 2013-12-04
EP2692904A1 (en) 2014-02-05
WO2012133565A1 (en) 2012-10-04
CN103429793B (en) 2019-03-05
TW201245498A (en) 2012-11-16
KR20150080024A (en) 2015-07-08
CN103429793A (en) 2013-12-04

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