MY160570A - A lead free solder alloy containing platinum particles as reinforcement - Google Patents

A lead free solder alloy containing platinum particles as reinforcement

Info

Publication number
MY160570A
MY160570A MYPI2012700980A MYPI2012700980A MY160570A MY 160570 A MY160570 A MY 160570A MY PI2012700980 A MYPI2012700980 A MY PI2012700980A MY PI2012700980 A MYPI2012700980 A MY PI2012700980A MY 160570 A MY160570 A MY 160570A
Authority
MY
Malaysia
Prior art keywords
platinum particles
solder alloy
reinforcement
sac
alloy containing
Prior art date
Application number
MYPI2012700980A
Other languages
English (en)
Inventor
Wong Mee Chu Karen
Yun Seng Lim
Yee Kai Tian
Meng Suan Liang
Original Assignee
Univ Tunku Abdul Rahman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Tunku Abdul Rahman filed Critical Univ Tunku Abdul Rahman
Priority to MYPI2012700980A priority Critical patent/MY160570A/en
Priority to CN201310583871.6A priority patent/CN103921010B/zh
Publication of MY160570A publication Critical patent/MY160570A/en

Links

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI2012700980A 2012-11-21 2012-11-21 A lead free solder alloy containing platinum particles as reinforcement MY160570A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI2012700980A MY160570A (en) 2012-11-21 2012-11-21 A lead free solder alloy containing platinum particles as reinforcement
CN201310583871.6A CN103921010B (zh) 2012-11-21 2013-11-20 焊接合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2012700980A MY160570A (en) 2012-11-21 2012-11-21 A lead free solder alloy containing platinum particles as reinforcement

Publications (1)

Publication Number Publication Date
MY160570A true MY160570A (en) 2017-03-15

Family

ID=51139530

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012700980A MY160570A (en) 2012-11-21 2012-11-21 A lead free solder alloy containing platinum particles as reinforcement

Country Status (2)

Country Link
CN (1) CN103921010B (zh)
MY (1) MY160570A (zh)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428442A (en) * 1966-09-22 1969-02-18 Eutectic Welding Alloys Coated spray-weld alloy powders
US7572343B2 (en) * 2003-08-06 2009-08-11 Board Of Trustees Of Michigan State University Composite metal matrix castings and solder compositions, and methods
US8691143B2 (en) * 2005-06-03 2014-04-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
CN101351297A (zh) * 2005-09-26 2009-01-21 美国铟泰公司 低熔化温度柔性焊剂
JP2008004651A (ja) * 2006-06-21 2008-01-10 Hitachi Ltd 異方性微粒子を用いた接合材料
CN101474728B (zh) * 2009-01-07 2011-06-01 高新锡业（惠州）有限公司 无铅软钎焊料

Also Published As

Publication number Publication date
CN103921010B (zh) 2019-01-22
CN103921010A (zh) 2014-07-16

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