MY160570A - A lead free solder alloy containing platinum particles as reinforcement - Google Patents

A lead free solder alloy containing platinum particles as reinforcement

Info

Publication number
MY160570A
MY160570A MYPI2012700980A MYPI2012700980A MY160570A MY 160570 A MY160570 A MY 160570A MY PI2012700980 A MYPI2012700980 A MY PI2012700980A MY PI2012700980 A MYPI2012700980 A MY PI2012700980A MY 160570 A MY160570 A MY 160570A
Authority
MY
Malaysia
Prior art keywords
platinum particles
solder alloy
reinforcement
sac
alloy containing
Prior art date
Application number
MYPI2012700980A
Inventor
Wong Mee Chu Karen
Yun Seng Lim
Yee Kai Tian
Meng Suan Liang
Original Assignee
Univ Tunku Abdul Rahman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Tunku Abdul Rahman filed Critical Univ Tunku Abdul Rahman
Priority to MYPI2012700980A priority Critical patent/MY160570A/en
Priority to CN201310583871.6A priority patent/CN103921010B/en
Publication of MY160570A publication Critical patent/MY160570A/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)

Abstract

A method of obtaining a solder alloy is provided. The method includes cutting Sn-Ag-Cu (SAC) alloy into pieces and cleaned with ethanol and dried, in step (102); melting cut pieces, obtained in step (102), in an alumina crucible under argon atmosphere at 350ºC, in step (104); coating Platinum (Pt) particles with Rosin Mildly Activated (RMA) flux in step (106) and adding RMA coated platinum particles into molten SAC pieces obtained from step (104), to obtain a mixture; stirring the mixture to obtain a homogeneous suspension of platinum particles in SAC alloy in step (108) and allowing the homogeneous suspension to stand at 350ºC for 30 minutes, in step (110).
MYPI2012700980A 2012-11-21 2012-11-21 A lead free solder alloy containing platinum particles as reinforcement MY160570A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI2012700980A MY160570A (en) 2012-11-21 2012-11-21 A lead free solder alloy containing platinum particles as reinforcement
CN201310583871.6A CN103921010B (en) 2012-11-21 2013-11-20 Welding alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2012700980A MY160570A (en) 2012-11-21 2012-11-21 A lead free solder alloy containing platinum particles as reinforcement

Publications (1)

Publication Number Publication Date
MY160570A true MY160570A (en) 2017-03-15

Family

ID=51139530

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012700980A MY160570A (en) 2012-11-21 2012-11-21 A lead free solder alloy containing platinum particles as reinforcement

Country Status (2)

Country Link
CN (1) CN103921010B (en)
MY (1) MY160570A (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428442A (en) * 1966-09-22 1969-02-18 Eutectic Welding Alloys Coated spray-weld alloy powders
RU2006106711A (en) * 2003-08-06 2006-09-10 Мичиган Стейт Юниверсити (Us) COMPOSITE CASTING WITH A METAL MATRIX AND COMPOSITIONS FOR SOLDER, AND ALSO WAYS
US8691143B2 (en) * 2005-06-03 2014-04-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
CN101351297A (en) * 2005-09-26 2009-01-21 美国铟泰公司 Low melting temperature compliant solders
JP2008004651A (en) * 2006-06-21 2008-01-10 Hitachi Ltd Bonding material using anisotropic fine particles
CN101474728B (en) * 2009-01-07 2011-06-01 高新锡业（惠州）有限公司 Leadless soft brazing material

Also Published As

Publication number Publication date
CN103921010B (en) 2019-01-22
CN103921010A (en) 2014-07-16

Similar Documents

Publication Publication Date Title
EP2540420A3 (en) Production of atomized powder for glassy aluminum-based alloys
MX2012008231A (en) Braze foil for high-temperature brazing and methods for repairing or producing components using said braze foil.
MY158123A (en) Mixed alloy solder paste
US10828731B2 (en) Pb-free solder alloy
EP2570591A3 (en) Method for repairing a ceramic fiber reinforced ceramic composite article and corresponding intermediate
EP2684981A3 (en) A coating/repairing process using electrospark with PSP rod
EP2868427A3 (en) Braze alloy compositions and brazing methods for superalloys
MX338598B (en) Isothermal structural repair of superalloy components including turbine blades.
PH12017501161A1 (en) Flux for fast-heating method, and solder paste for fast-heating method
WO2012047868A3 (en) Aluminum powder metal alloying method
WO2014013463A3 (en) Method of soldering an electronic component with a high lateral accuracy
JP2011147982A5 (en)
MY160570A (en) A lead free solder alloy containing platinum particles as reinforcement
CN105401026B (en) A kind of ultra-high-strength aluminum alloy powder
RU2011148044A (en) METHOD FOR PRODUCING POWDER PREPARATION OF NANOPARTICLES OF NOBLE METALS
CN104116133A (en) Application of polymers rich in amino groups in paper filter stick
CN104526186A (en) Novel scaling powder for SnZn series lead-free brazing filler metal
WO2012070803A3 (en) Aluminum-magnesium-silicon-copper alloy for automobile chassis and bodies and a casting method therefor
MX2017011314A (en) A method and a container for preparing a fused sample for analysis.
CN103433647A (en) Water-soluble flux and preparation method of water-soluble flux
GB201209221D0 (en) Solid material and method and composition for forming solid material
KR20140086129A (en) Apparatus and Method for manufacturing impeller
GB201315481D0 (en) Reflow method for lead-free solder
CN203409398U (en) Smoke exhausting mechanism of pin tin-soldering groove of LED (Light-Emitting Diode) circuit board
WO2012110421A8 (en) Method of producing a welded article of dispersion strengthened platinum based alloy with two steps welding