MY153895A - Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw - Google Patents

Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw

Info

Publication number
MY153895A
MY153895A MYPI2014003341A MYPI2014003341A MY153895A MY 153895 A MY153895 A MY 153895A MY PI2014003341 A MYPI2014003341 A MY PI2014003341A MY PI2014003341 A MYPI2014003341 A MY PI2014003341A MY 153895 A MY153895 A MY 153895A
Authority
MY
Malaysia
Prior art keywords
resin
adhesive composition
wire saw
bonded wire
producing
Prior art date
Application number
MYPI2014003341A
Other languages
English (en)
Inventor
Ikeuchi Masahiko
Endo Tadashi
Original Assignee
Tkx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tkx Corp filed Critical Tkx Corp
Publication of MY153895A publication Critical patent/MY153895A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
MYPI2014003341A 2012-06-01 2012-07-02 Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw MY153895A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012126091 2012-06-01

Publications (1)

Publication Number Publication Date
MY153895A true MY153895A (en) 2015-04-08

Family

ID=49672746

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014003341A MY153895A (en) 2012-06-01 2012-07-02 Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw

Country Status (7)

Country Link
JP (1) JP5778864B2 (zh)
KR (1) KR101563456B1 (zh)
CN (1) CN104379695B (zh)
MY (1) MY153895A (zh)
SG (1) SG11201407954VA (zh)
TW (1) TWI527666B (zh)
WO (1) WO2013179498A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017209242A1 (ja) * 2016-06-01 2019-01-17 株式会社Tkx レジンボンドワイヤーソーとその製造方法
CN106826598A (zh) * 2016-12-21 2017-06-13 河南易成新能源股份有限公司 树脂涂层金刚石线及其制备方法
CN106826597A (zh) * 2016-12-21 2017-06-13 河南易成新能源股份有限公司 连续长距离树脂金刚石线锯的生产方法
JP7103305B2 (ja) * 2019-05-29 2022-07-20 信越半導体株式会社 インゴットの切断方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232171A (ja) * 1989-03-06 1990-09-14 Gun Ei Chem Ind Co Ltd レジノイド砥石
JP2000271872A (ja) 1999-03-23 2000-10-03 Osaka Diamond Ind Co Ltd 超砥粒レジンボンドワイヤソー
JP3604319B2 (ja) * 2000-03-30 2004-12-22 株式会社ノリタケスーパーアブレーシブ レジンボンドワイヤソー
JP2002254285A (ja) * 2001-02-28 2002-09-10 Allied Material Corp ワイヤソーによる多孔質金属の切断方法
US6949129B2 (en) * 2002-01-30 2005-09-27 Saint-Gobain Abrasives, Inc. Method for making resin bonded abrasive tools
AU2003261749A1 (en) * 2003-08-27 2005-03-29 Nok Corporation Vulcanizable adhesive composition
JP5011886B2 (ja) * 2006-08-22 2012-08-29 Ｎｏｋ株式会社 ボンデッドピストンシール
CN101088659B (zh) * 2007-08-09 2010-11-17 山东圣泉化工股份有限公司 低氮覆膜砂及其制备方法
FR2921666B1 (fr) * 2007-10-01 2012-11-09 Saint Gobain Abrasives Inc Composition resinique liquide pour articles abrasifs
PL2052798T3 (pl) * 2008-11-25 2012-05-31 Huettenes Albertus Chemische Werke Gmbh Alkaliczne kompozycje wiążące rezolowej żywicy fenolowo-aldehydowej
JP5515646B2 (ja) 2009-11-05 2014-06-11 株式会社中村超硬 ワイヤソー及びワイヤソーの製造方法

Also Published As

Publication number Publication date
CN104379695A (zh) 2015-02-25
WO2013179498A1 (ja) 2013-12-05
TWI527666B (zh) 2016-04-01
SG11201407954VA (en) 2015-01-29
TW201350270A (zh) 2013-12-16
CN104379695B (zh) 2016-08-17
KR101563456B1 (ko) 2015-10-26
KR20150005689A (ko) 2015-01-14
JPWO2013179498A1 (ja) 2016-01-18
JP5778864B2 (ja) 2015-09-16

Similar Documents

Publication Publication Date Title
EA030358B9 (ru) Винилфункционализованные уретановые смолы для композиций порошковых покрытий
WO2013153183A3 (de) Kompositharz-zusammensetzung und deren verwendung, verfahren zur herstellung dentaler bauteile mittels stereolithographie
MX2015002339A (es) Pelicula de adhesivo estructural.
EP3015486A4 (en) POLYISOCYANATE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF, BLOCK POLYISOCYANATE COMPOSITION AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, CURABLE RESIN COMPOSITION AND CURED ARTICLE
EP2388280A4 (en) The heat-treatable composition, the hardened article obtained therefrom and the method for the production thereof
EP2829579A4 (en) HARDENABLE COMPOSITION, HARDENED PRODUCT, AND METHOD FOR USE OF A HARDENABLE COMPOSITION
MY169025A (en) Liquid hardeners for hardening epoxide resins (ii)
EP3015487A4 (en) Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and led device
HK1177945A1 (zh) 在塗料固化後產生消光表面的在加熱時固化的粉末塗料組合物及其簡單製造方法
EP2692776A4 (en) ORGANOPOLYSILOXAN, PRODUCTION PROCESS THEREFOR, AND CURABLE COMPOSITION WITH THE ORGANOPOLYSILOXANE
EP2878398A4 (en) CURING AGENT COMPOSITION FOR USE IN MANUFACTURING MOLD, USE THEREOF, PROCESS FOR PREPARING SAME, AND METHOD FOR MANUFACTURING MOLD
EP2733159A4 (en) HARDENABLE RESIN COMPOSITION AND METHOD FOR MANUFACTURING HARDENED PRODUCTS THEREWITH
EP2902441A4 (en) A HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR THE PRODUCTION THEREOF, METHOD FOR THE PRODUCTION OF A CURED RESIN PRODUCT, AND DEVICE FOR DETERMINING THE SELF-POLYMERIZATION OF AN EPOXY COMPOUND
MY153895A (en) Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw
EP2907833A4 (en) HARDENABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
TW201612271A (en) Film adhesive, semiconductor package using film adhesive and method for manufacturing same
EP2871182A4 (en) NOVOLAC-BASED EPOXY COMPOUND, METHOD OF MANUFACTURING THEREOF, COMPOSITION AND HARDENED OBJECT, AND USE THEREOF
MX2015012531A (es) Materiales termoestables epoxi endurecidos que contienen un nucleo protector de caucho y polioles.
EP2824145A4 (en) POLYESTER RESIN COMPOSITION, PROCESS FOR PREPARING THE SAME, AND MOLDING USING THE RESIN COMPOSITION
MX2015008173A (es) Recubrimiento para mejorar la resistencia del vidrio.
GB2513037A (en) Precoating methods and compositions
MY163380A (en) Radiation-induced thickening for set-on-command sealant compositions and methods of use
EP2868679A4 (en) A CATALYST COMPOSITION FOR PREPARING POLYURETHANE RESIN AND METHOD FOR PRODUCING POLYURETHANE RESIN USING THIS CATALYST COMPOSITION
HK1211971A1 (zh) 適用於環氧樹脂的硬化劑或增塑劑的苯乙烯酚
EP2837660A4 (en) CURABLE COMPOSITION, AND HARDENED SYNTHETIC RESIN USING THE SAME