MY143259A - Dispensing solder for mounting semiconductor chips - Google Patents

Dispensing solder for mounting semiconductor chips

Info

Publication number
MY143259A
MY143259A MYPI20084950A MYPI20084950A MY143259A MY 143259 A MY143259 A MY 143259A MY PI20084950 A MYPI20084950 A MY PI20084950A MY PI20084950 A MYPI20084950 A MY PI20084950A MY 143259 A MY143259 A MY 143259A
Authority
MY
Malaysia
Prior art keywords
substrate
solder
wire
onto
semiconductor chips
Prior art date
Application number
MYPI20084950A
Inventor
Lam Kui Kam
Ip Chun Hung Samuel
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40417608&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY143259(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of MY143259A publication Critical patent/MY143259A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

DISPENSING SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS A METHOD FOR MOUNTING A SEMICONDUCTOR CHIP ONTO A SUBSTRATE COMPRISES THE STEPS OF POSITIONING A SOLDER DISPENSER OVER THE SUBSTRATE AND PASSING A LENGTH OF SOLDER WIRE THROUGH THE SOLDER DISPENSER TO THE SUBSTRATE. THE FEEDING OF THE WIRE TO THE SUBSTRATE IS A FEEDING DIRECTION IS CONTROLLED WITH A WIRE FEEDER. THE SOLDER DISPENSER IS MOVED RELATIVE TO THE SUBSTRATE WITH A POSITIONING DEVICE ALONG AT 0 LEAST ONE OF TWO ORTHOGONAL AXES THAT ARE SUBSTANTIALLY PERPENDICULAR TO THE FEEDING DIRECTION CONTEMPORANEOUSLY WITH FEEDING THE SOLDER WIRE TO THE SURFACE OF THE SUBSTRATE TO DISPENSE A LINE OF MOLTEN SOLDER ONTO THE SUBSTRATE. THE SEMICONDUCTOR CHIP IS THEN MOUNTED ONTO THE MOLTEN SOLDER THAT HAS BEEN DISPENSED ONTO THE SUBSTRATE. 5 (FIG. 2)
MYPI20084950A 2007-12-07 2008-12-05 Dispensing solder for mounting semiconductor chips MY143259A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/952,296 US7735715B2 (en) 2007-12-07 2007-12-07 Dispensing solder for mounting semiconductor chips

Publications (1)

Publication Number Publication Date
MY143259A true MY143259A (en) 2011-04-15

Family

ID=40417608

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20084950A MY143259A (en) 2007-12-07 2008-12-05 Dispensing solder for mounting semiconductor chips

Country Status (8)

Country Link
US (1) US7735715B2 (en)
EP (1) EP2067561B1 (en)
JP (1) JP4855459B2 (en)
KR (1) KR101044565B1 (en)
CN (1) CN101452865B (en)
MY (1) MY143259A (en)
SG (1) SG153017A1 (en)
TW (1) TWI381465B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101122138B1 (en) * 2010-02-24 2012-03-20 주식회사 프로텍 Chip bonding apparatus
US20110272452A1 (en) * 2010-05-04 2011-11-10 Kui Kam Lam System for dispensing soft solder for mounting semiconductor chips using multiple solder wires
CN102184874B (en) * 2011-04-02 2012-12-26 何永基 Chip bonding method
CH705035B1 (en) 2011-05-23 2016-03-31 Esec Ag Method for dispensing solder on a substrate and method for mounting a semiconductor chip.
JP5800778B2 (en) 2011-11-25 2015-10-28 三菱電機株式会社 Bonding method and semiconductor device manufacturing method
CH706712A1 (en) * 2012-07-05 2014-01-15 Besi Switzerland Ag Method and apparatus for dispensing solder onto a substrate.
CH708278A1 (en) * 2013-07-08 2015-01-15 Besi Switzerland Ag Device for applying and spreading of solder to a substrate.
CN105772938A (en) * 2016-03-18 2016-07-20 浙江大学 Nano-welding method adopting welding fluxes on basis of photothermal effect
DE102019103140A1 (en) * 2019-02-08 2020-08-13 Jenoptik Optical Systems Gmbh Method for soldering one or more components
CN113319398B (en) * 2021-06-10 2022-07-22 浙江凯友照明科技有限公司 High-efficient chip soldering tin equipment for LED lamp based on digital linear dimming technology
CN115831829B (en) * 2023-02-16 2023-04-25 山东睿芯半导体科技有限公司 Soft solder chip mounting machine for electronic chip

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3797725A (en) * 1971-04-14 1974-03-19 M Ind Co Ltd Automatic soldering machine
JPS6054270A (en) 1983-08-31 1985-03-28 Sanyo Electric Co Ltd Soldering device
JPS60262777A (en) 1984-06-08 1985-12-26 Nec Corp Detection device for solder feeding
US5104689A (en) 1990-09-24 1992-04-14 International Business Machines Corporation Method and apparatus for automated solder deposition at multiple sites
GB9126530D0 (en) * 1991-12-13 1992-02-12 Spirig Ernest Soldering device
JP3205423B2 (en) 1993-03-25 2001-09-04 黒田電気株式会社 Soldering method and equipment
JP3307777B2 (en) * 1994-07-07 2002-07-24 栄修 永田 Soldering method and device
EP0970774B1 (en) * 1995-07-01 2002-07-24 ESEC Trading SA Molding die for dispensing liquid solder
DE59708121D1 (en) 1997-01-08 2002-10-10 Esec Trading Sa Device for forming liquid portions of solder when soldering semiconductor chips
JP2000012567A (en) * 1998-06-19 2000-01-14 Sanyo Electric Co Ltd Junction material supply method of die bonder and its device
SG91867A1 (en) * 2000-05-24 2002-10-15 Casem Asia Pte Ltd Improved apparatus and method for dispensing solder
JP2002033339A (en) * 2000-07-18 2002-01-31 Matsushita Electric Ind Co Ltd Method for applying bonding paste
JP3607185B2 (en) 2000-09-29 2005-01-05 松下電器産業株式会社 Bonding paste application method
JP2002273567A (en) * 2001-03-16 2002-09-25 Nidec Tosok Corp Spanker tool
SG106126A1 (en) * 2002-03-08 2004-09-30 Esec Trading Sa Method and apparatus for dispensing solder on a substrate
JP4080326B2 (en) * 2002-12-27 2008-04-23 キヤノンマシナリー株式会社 Brazing material supply nozzle
US7131565B2 (en) * 2003-11-25 2006-11-07 International Business Machines Corporation Feed devices and methods for injection molded solder systems
EP1750883A1 (en) * 2004-06-01 2007-02-14 Elpatronic Ag Hard-soldering method and device
US20070164089A1 (en) * 2006-01-19 2007-07-19 Nordson Corporation Method of dispensing small amounts of liquid material
JP2007311653A (en) * 2006-05-19 2007-11-29 Canon Machinery Inc Solder coating method, solder coating unit, and die bonder

Also Published As

Publication number Publication date
EP2067561A1 (en) 2009-06-10
CN101452865B (en) 2010-09-08
TWI381465B (en) 2013-01-01
EP2067561B1 (en) 2013-04-10
KR20090060193A (en) 2009-06-11
US7735715B2 (en) 2010-06-15
KR101044565B1 (en) 2011-06-28
CN101452865A (en) 2009-06-10
JP2009177142A (en) 2009-08-06
SG153017A1 (en) 2009-06-29
US20090145950A1 (en) 2009-06-11
JP4855459B2 (en) 2012-01-18
TW200935532A (en) 2009-08-16

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