JPS60262777A - Detection device for solder feeding - Google Patents

Abstract

PURPOSE:To detect no feeding action of solder so as to prevent a product from being incorrectly assembled by configuratingf a device in such a manner that arotary angle of a driven roller which feeds out solder jointly with a driving roller, is detected and is fed back to a control unit of the device. CONSTITUTION:Solder 3 is fed from a solder-hole spool 4 through a space between a driving roller 1 and a driven roller 2. In this device a rotary encoder is attached to a shaft 10 which is directly connected with the driven roller 2, and a feed back unit 7 is arranged to transmit signals from the encoder to a control unit of this device. When a large tension force is not sufficient enough to feed out solder 3, only the driving roller 1 rotates together with a motor 5 leaving the driven roller 2 stationary. Accordingly, the shaft of the rotary encoder 6 does not rotate indicating the rotation step of ''zero or almost zero'' reading which is a sign of an error in feeding action. Based on the detected sitnal, an assembly work in a work 9 is suspended for the time being.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a device for detecting the amount of wire-shaped and tape-shaped solder fed out by rollers in a semiconductor assembly process.

[Prior art]

Conventionally, in a device for feeding out solder using a roller, the amount of solder to be fed out is determined by the rotation angle, rotation speed, etc. of the drive roller. In this roller-feeding device, the solder is usually in the form of a wire or tape wound around a spool, and if it is wire-shaped during the feeding process,
Tension is applied to the solder due to entanglement of the wire itself, back tension in the case of a tape-like wire, and as a result, the solder may not be fed out.

In the past, there was no check in the case where the solder was not fed out, and semiconductors were assembled without the solder being fed out, resulting in a series of defective products.

[Purpose of the invention]

An object of the present invention is to provide an apparatus that can check if the solder is not delivered due to the tension applied to the solder, and can deliver the solder by a predetermined amount.

[Structure of the invention]

The present invention provides a solder feeding device consisting of a driving rotary roller and a driven rotary roller, which is equipped with an angle detector coaxially with the driven rotary roller, and includes a feedback unit that feeds back a signal from the angle detector to a control section of the device. This is a solder delivery detection device characterized by the following.

[Principle of the invention]

When feeding out solder with a roller, if the solder is not fed out due to the tension applied to the solder, only the driving roller rotates, and the driven roller does not rotate because the solder is not fed out.

Therefore, the present invention utilizes the fact that the driven roller does not rotate when the solder is not fed out, and detects the feeding of the resolder using a rotary encoder and its feedback unit.

〔Example〕

Next, one embodiment of the present invention will be described using the drawings.

In FIG. 1, the present invention provides a solder hold spool 4 which is passed between a driving rotating roller 1 and a driven rotating roller 2.
In the solder feeding device that feeds out the solder 3 from the rotary roller 2, a rotary encoder 6 is attached directly to the shaft 10 of the driven rotary roller 2, and a feedback unit 7 is used to transmit the signal from the rotary encoder 6 to the control section 8 of the device. be. When the driving roller 1 rotates to feed out the solder 3 by the motor 5, if it is normal, the driven roller 2 also rotates as shown in FIGS. 2(a) and 2(b). However, if the solder 3 is not fed out due to strong tension, only the i-driven roller 1 rotates together with the motor 5, and the driven roller 2 does not feed out the solder 3.
It does not rotate as shown in (b).

Therefore, since the shaft of the rotary encoder 6 also does not rotate, the rotation step of the encoder indicates O or a value close to it, and the feed-out point is detected. The signal is outputted to the control section 8 through the entire unit 7, and the control section 8 issues a command to the apparatus to temporarily stop the semiconductor assembly operation of the workpiece 9.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to quickly detect a feed-out error, and even when an accurate feed-out amount is required, the feed-out amount can be checked depending on the setting, and the solder can be reliably This has the effect that semiconductor assembly can be carried out by sending it out to other countries.

[Brief explanation of drawings]

Fig. 1 is a configuration diagram showing an embodiment of the present invention, Fig. 2(a)
, (b) are diagrams showing a state in which the solder is correctly fed out by the roller, and FIGS. 3(a) and (b) are diagrams showing a state in which a strong tension is applied to the solder and the solder is not fed out. DESCRIPTION OF SYMBOLS 1... Drive rotating roller, 2... Driven rotating roller, 3... Solder, 4... Solder hold spool, 5... Solder feeding motor, 6 - Rotary encoder, 7... Feedback unit, 8
...Device control unit, 9...Work Patent applicant NEC Corporation ((0) (Fig. 2(b) Fig. 3(b)

Claims (1)

[Claims] (1) In a solder feeding device that feeds solder between a driving rotating roller and a driven rotating roller, there is an angle detector that detects the rotation angle of the driven rotating roller, and an output signal of the detector is sent to a control section of the device. A solder feed-out detection device characterized by having a feedback unit that provides feedback to the solder feed-out detection device.