MY140165A - Mounting method for image sensor and adhesive tape used therefor - Google Patents

Mounting method for image sensor and adhesive tape used therefor

Info

Publication number
MY140165A
MY140165A MYPI20051850A MY140165A MY 140165 A MY140165 A MY 140165A MY PI20051850 A MYPI20051850 A MY PI20051850A MY 140165 A MY140165 A MY 140165A
Authority
MY
Malaysia
Prior art keywords
image sensor
adhesive tape
mounting method
used therefor
tape used
Prior art date
Application number
Other languages
English (en)
Inventor
Hiroyuki Kondo
Hitoshi Takano
Tadashi Terashima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004223516A external-priority patent/JP2005341520A/ja
Priority claimed from JP2004316103A external-priority patent/JP4116606B2/ja
Priority claimed from JP2004329598A external-priority patent/JP4116612B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of MY140165A publication Critical patent/MY140165A/en

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Facsimile Heads (AREA)
  • Chemical Kinetics & Catalysis (AREA)
MYPI20051850 2004-04-28 2005-04-27 Mounting method for image sensor and adhesive tape used therefor MY140165A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004133807 2004-04-28
JP2004223516A JP2005341520A (ja) 2004-04-28 2004-07-30 映像センサの実装方法およびそれに用いる粘着テープ
JP2004316103A JP4116606B2 (ja) 2004-04-28 2004-10-29 映像センサの実装方法およびそれに用いる粘着テープ
JP2004329598A JP4116612B2 (ja) 2004-04-28 2004-11-12 映像センサの実装方法およびそれに用いる粘着テープ

Publications (1)

Publication Number Publication Date
MY140165A true MY140165A (en) 2009-11-30

Family

ID=35542893

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20051850 MY140165A (en) 2004-04-28 2005-04-27 Mounting method for image sensor and adhesive tape used therefor

Country Status (4)

Country Link
KR (1) KR100922663B1 (zh)
MY (1) MY140165A (zh)
SG (2) SG152276A1 (zh)
TW (1) TWI407560B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101606414B1 (ko) * 2014-06-02 2016-03-28 (주)드림텍 보호테이프 제거가 용이한 모바일 기기의 홈키 모듈 제조방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4266106B2 (ja) * 2001-09-27 2009-05-20 株式会社東芝 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法
JP3748799B2 (ja) * 2001-10-11 2006-02-22 シチズン電子株式会社 電子部品パッケージ及びその実装方法
JP3946509B2 (ja) * 2001-12-17 2007-07-18 リンテック株式会社 粘着テープ
JP2003347532A (ja) 2002-05-03 2003-12-05 Eastman Kodak Co テープカバー付き画像センサ
JP4137551B2 (ja) * 2002-08-09 2008-08-20 日東電工株式会社 透明導電性基板用表面保護フィルム及び表面保護フィルム付き透明導電性基板

Also Published As

Publication number Publication date
KR20060047534A (ko) 2006-05-18
SG152276A1 (en) 2009-05-29
TW200536117A (en) 2005-11-01
TWI407560B (zh) 2013-09-01
KR100922663B1 (ko) 2009-10-19
SG116634A1 (en) 2005-11-28

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