MY140165A - Mounting method for image sensor and adhesive tape used therefor - Google Patents
Mounting method for image sensor and adhesive tape used thereforInfo
- Publication number
- MY140165A MY140165A MYPI20051850A MY140165A MY 140165 A MY140165 A MY 140165A MY PI20051850 A MYPI20051850 A MY PI20051850A MY 140165 A MY140165 A MY 140165A
- Authority
- MY
- Malaysia
- Prior art keywords
- image sensor
- adhesive tape
- mounting method
- used therefor
- tape used
- Prior art date
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Facsimile Heads (AREA)
- Chemical Kinetics & Catalysis (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004133807 | 2004-04-28 | ||
JP2004223516A JP2005341520A (ja) | 2004-04-28 | 2004-07-30 | 映像センサの実装方法およびそれに用いる粘着テープ |
JP2004316103A JP4116606B2 (ja) | 2004-04-28 | 2004-10-29 | 映像センサの実装方法およびそれに用いる粘着テープ |
JP2004329598A JP4116612B2 (ja) | 2004-04-28 | 2004-11-12 | 映像センサの実装方法およびそれに用いる粘着テープ |
Publications (1)
Publication Number | Publication Date |
---|---|
MY140165A true MY140165A (en) | 2009-11-30 |
Family
ID=35542893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20051850 MY140165A (en) | 2004-04-28 | 2005-04-27 | Mounting method for image sensor and adhesive tape used therefor |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100922663B1 (zh) |
MY (1) | MY140165A (zh) |
SG (2) | SG152276A1 (zh) |
TW (1) | TWI407560B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101606414B1 (ko) * | 2014-06-02 | 2016-03-28 | (주)드림텍 | 보호테이프 제거가 용이한 모바일 기기의 홈키 모듈 제조방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4266106B2 (ja) * | 2001-09-27 | 2009-05-20 | 株式会社東芝 | 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法 |
JP3748799B2 (ja) * | 2001-10-11 | 2006-02-22 | シチズン電子株式会社 | 電子部品パッケージ及びその実装方法 |
JP3946509B2 (ja) * | 2001-12-17 | 2007-07-18 | リンテック株式会社 | 粘着テープ |
JP2003347532A (ja) | 2002-05-03 | 2003-12-05 | Eastman Kodak Co | テープカバー付き画像センサ |
JP4137551B2 (ja) * | 2002-08-09 | 2008-08-20 | 日東電工株式会社 | 透明導電性基板用表面保護フィルム及び表面保護フィルム付き透明導電性基板 |
-
2005
- 2005-03-24 TW TW94109066A patent/TWI407560B/zh not_active IP Right Cessation
- 2005-04-22 SG SG200902893-7A patent/SG152276A1/en unknown
- 2005-04-22 SG SG200502444A patent/SG116634A1/en unknown
- 2005-04-27 MY MYPI20051850 patent/MY140165A/en unknown
- 2005-04-27 KR KR1020050035040A patent/KR100922663B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20060047534A (ko) | 2006-05-18 |
SG152276A1 (en) | 2009-05-29 |
TW200536117A (en) | 2005-11-01 |
TWI407560B (zh) | 2013-09-01 |
KR100922663B1 (ko) | 2009-10-19 |
SG116634A1 (en) | 2005-11-28 |
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