MY122640A - Wire spring grip, lead frame carrier belt and plating system - Google Patents

Wire spring grip, lead frame carrier belt and plating system

Info

Publication number
MY122640A
MY122640A MYPI20002997A MYPI20002997A MY122640A MY 122640 A MY122640 A MY 122640A MY PI20002997 A MYPI20002997 A MY PI20002997A MY PI20002997 A MYPI20002997 A MY PI20002997A MY 122640 A MY122640 A MY 122640A
Authority
MY
Malaysia
Prior art keywords
lead frame
arms
grip
belt
angled
Prior art date
Application number
MYPI20002997A
Inventor
Lim Lek Teck
Original Assignee
Cem Machinery Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cem Machinery Pte Ltd filed Critical Cem Machinery Pte Ltd
Publication of MY122640A publication Critical patent/MY122640A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A WIRE SPRING GRIP FOR AN IC LEAD FRAME AND A LEAD FRAME CARRIER BELT ARE DESCRIBED. THE GRIP 20 COMPRISES A WIRE FORMED TO PROVIDE TWO PARALLEL ARMS EXTENDING FROM A CURVED, CENTRAL PORTION 22 OF THE WIRE. THE CURVED PORTION 22 IS ANGLED FROM THE PLANE INCLUDING THE PORTIONS OF THE ARMS IMMEDIATELY ADJACENT THE CURVED PORTION 22 TO FORM A GRIPPING PORTION. THE END OF EACH ARM IS ANGLED TO FORM AN ARM TIP PORTION 23 FOR ENGAGING WITH A BELT WEB 100 SO AS TO SUPPORT THE GRIP20. THE ARMS OF THE GRIP EXTEND FROM THEIR ENDS AND FORM A COIL 24 HAVING A PLURALITY OF TURNS. BETWEEN EACH COIL 24 AND THE CURVED PORTION 22, EACH ARM IS ANGLED TO FORM AN ENGAGEMENT PORTION 25 FOR BIASING THE ARMS AGAINST THE TENSION IN THE SPRING COILS. THE GRIPS ARE SUPPORTED ON THE BELT 100 WITH A PORTION OF THE ARMS SUBSTANTIALLY PARALLEL WITH THE BELT WEB.
MYPI20002997A 1999-10-25 2000-06-30 Wire spring grip, lead frame carrier belt and plating system MY122640A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9905316A SG80658A1 (en) 1999-10-25 1999-10-25 Wire spring grip, lead frame carrier belt & plating system

Publications (1)

Publication Number Publication Date
MY122640A true MY122640A (en) 2006-04-29

Family

ID=20430453

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20002997A MY122640A (en) 1999-10-25 2000-06-30 Wire spring grip, lead frame carrier belt and plating system

Country Status (5)

Country Link
KR (1) KR100423962B1 (en)
CN (1) CN1227394C (en)
MA (1) MA24634A1 (en)
MY (1) MY122640A (en)
SG (1) SG80658A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101268297B1 (en) * 2011-07-12 2013-05-28 주식회사 에이에스티젯텍 Feeding belt for strip-shaped elements
DE102014212155B4 (en) * 2014-06-25 2024-09-19 Vitesco Technologies GmbH Bearing device for a shaft of a turbocharger device
CN110316515A (en) * 2019-08-09 2019-10-11 山东晶导微电子股份有限公司 A kind of plating insulation transmission steel band
CN112626605B (en) * 2020-12-07 2022-01-14 北京泰杰伟业科技有限公司 Clamp capable of continuously processing electrochemical polishing anode electrode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1357447A (en) * 1971-06-10 1974-06-19 Plastestrip Ltd Spring clips for joint cover strips
EP0242962A1 (en) * 1986-04-25 1987-10-28 Inmos Corporation Offset pad semiconductor lead frame
US5264002A (en) * 1990-04-23 1993-11-23 Mitsubishi Danki Kabushiki Kaisha Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails
JPH0629328A (en) * 1992-07-08 1994-02-04 Ebara Corp Gripping jig for semiconductor lead frame

Also Published As

Publication number Publication date
SG80658A1 (en) 2001-05-22
MA24634A1 (en) 1999-04-01
CN1227394C (en) 2005-11-16
KR20010069219A (en) 2001-07-23
CN1296088A (en) 2001-05-23
KR100423962B1 (en) 2004-03-22

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