MXPA06006450A - Internally shielded energy conditioner - Google Patents

Abstract

An energy conditioner structure comprising a first electrode, a second electrode, and a shield structure provides improved energy conditioning in electrical circuits. The structures may exist as discrete components, as part of an interposer or a first level interconnects, or a part of an integrated circuit. The shield structure in the energy conditioner structure does not electrically connect to any circuit element.

Description

INTERNALLY PROTECTED ENERGY CONDITIONER BACKGROUND OF THE INVENTION This invention relates to electrical technology. More specifically, this invention relates to low inductance devices and power conditioning.

DISCUSSION OF THE BACKGROUND The word "terminal" means electrically conductive material at the point where an electrical device enters or exits. The terms capacitor "X" and "line-to-line capacitor" both mean one element of concentrated, passive, two-terminal parameter circuits, which have a capacitance value across the two terminals, where the two terminals are connected in a configuration in parallel with a circuit load device. The X capacitors are mainly used to prevent electrical drops through loads. That is, the X capacitors are typically used to provide a power source or sink. The terms "Y" capacitor and "line-to-ground capacitor" both mean a two-terminal, passive, concentrated parameter circuit element, which has a capacitance value across the two terminals where one of the two terminals is connected to the other terminals. a line which is located in the path of a circuit between one source and a load and the other terminal is connected to an electrically conductive structure which, in concentrated parameter circuit diagrams, is usually shown as a ground connection. However, the voltage potential of the alleged ground connection may vary depending on the amount of charge it receives or distributes. In applications, typically, the alleged ground connection is typically a physical ground or a ground. However, for the purposes of this application, the internal protective structure generally described below is not electrically connected to an external ground or ground. Y capacitors are mainly used to filter signal noise. One or more of the concentrated parameter circuit elements, including the X and / or Y capacitors, can be manufactured in a single, structurally integrated electrical device. The term "plate" is used to refer to the structure typically formed by stratification processes. The use of the term "plate" therefore does not imply structures that are not integrated during its formation. The term "plate" can refer to elements of structures that are integrated during its formation. The term "plate" as used herein means a structure with at least two surfaces larger than relatively large areas and one or more surface areas of relatively smaller areas. Each larger surface may but not necessarily be flat. Energy conditioning means at least one of filtering, uncoupling and transient suppression of electrical energy that propagates between a source and a charge. Filtering means modifying the frequency spectrum of a signal. Decoupling is a term typically applied to active circuits. In these circuits, active devices change their properties, such as transconductance, which affects the voltage in coupled elements. Decoupling means minimizing the effects of the voltage of the coupled elements due to changes in the active circuit. Transients include spikes due to external effects, such as static and parasitic discharges, such as induced induction in a circuit. A first level interconnect is a structure or device that provides an initial circuit connection to an integrated circuit. A mediator is a structure or device that provides a circuit connection to an integrated circuit. The United States Patents (USP) 6,018,448 and 6,373,673 describe a variety of devices that provide electrical power conditioning. The teachings of USP 6,018 ', 448 and 6,373,673 are incorporated herein by reference. The PCT application, PCT / US2004 / 000218, now published as publication WO 2004/07095, also describes a variety of devices that provide electrical power conditioning. The teachings of PCT / US2004 / 000218 published as WO 2004/07095 are also incorporated herein by reference. The novel inventions described herein are structures that have certain performance characteristics that significantly improve at least the decoupling aspect of the electrical power conditioning compared to the devices described above.

SUMMARY OF THE INVENTION An object of the invention is to provide a novel structure, a method for manufacturing the structure and a method of using the structure, and related circuit configurations and their use, where the structure has a certain capacitance and provides power conditioning which results in an ultra high insertion loss and better decoupling. Another object of the invention is to provide a circuit or a portion of a circuit that includes a novel structure of the invention, a method for manufacturing the circuit, and a method of using the circuit. The additional objects of the invention are to provide devices, circuits and methods of using them that provide improved power conditioning over a wide frequency range. These and other objects of the invention are provided by a novel energy conditioning structure comprising a first electrode including at least a first electrode plate, a second electrode including at least a second electrode plate, and an internal protective structure that is electrically conductive, the protective structure includes a central protective portion between the first electrode plate and the second electrode plate, and the protective structure includes conductive connecting structures, including any conductive pathways, holes filled with conductive material, and plates that Electrically connect the elements of the protective structure to electrically connect individual layers of the protective structure in a single conductive structure. The protective structure does not have or substantially form an external surface of the novel structure. The elements of the internally connected protective structures have certain geometric values, relative values, relative positions, and forms, related to each other and related to the other elements that form the novel structure. Generally speaking, the plates of an electrode receive electrical energy along any conductive path that connects that plate to the portion of the electrode that is part of the external surface of the energy conditioner. Each plate can be, generally, rectangular in shape, having two shorter side edges, and two longer side edges. The electrical connection of that plate to the outer surface of its electrode can be via the shorter or longer side edges of the plate. Similarly, the outer surface of each electrode may reside on a shorter side face or on a longer side of the energy conditioner. The inventors have determined that the relative location of the outer surface portion and the internal connection paths (along the shorter or longer sides of generally rectangular energy conditioners) affects the performance of the device. Preferably, substantially all plates of the first electrode have substantially the same shape and are vertically aligned stacked together. Preferably, substantially all of the plates of the second electrode also have substantially the same shape and are stacked substantially vertically in line with each other. However, the plates of the first electrode and the second electrode may have an axis or plane of symmetry and, if so, the plates of the second electrode may be oriented on the plate of the inverted plates about the plane axis of symmetry in relation to the plates of the first electrode. These and other objects of the invention are provided by a novel structure comprising: a first electrode including (A) a first plate of a first electrode, the first plate of the first electrode (1) defining an internal surface of a first plate of the first electrode first electrode, (2) an outer surface of the first plate of the first electrode, and (3) an edge surface of the first plate of the first electrode defined by the perimeters of the inner surface of the first plate of the first electrode and the surface external of the first plate of the first electrode and (B) a first contact region of the first electrode having a surface of the contact region of the first electrode to come into electrical contact with the first electrode; A second electrode including (A) a first plate of a second electrode, the first plate of the second electrode (1) defining an internal surface of the first plate of the second electrode (2) an outer surface of the first plate of the second electrode, and (3) an edge surface of the first plate of the second electrode defined by the perimeters of the inner surface of the first plate of the second electrode and the outer surface of the first plate of the second electrode and (B) a contact region of the second electrode. second electrode having a surface of the contact region of the second electrode for coming into electrical contact with the second electrode; A conductive protective structure that includes (a) a plurality of conductive protective plates that include at least (1) an internal protective plate, (2) a first external protective plate, (3) a second external protective plate, and (b) a plate contact structure. protective to come into electrical contact with another of the plurality of conductive protective plates; where the faces of the inner surface of the first plate of the first electrode faces the inner surface of the first plate of the second electrode; where (A) the inner protective plate is between an inner surface of the first plate of the first electrode and the inner surface of the first plate of the second electrode, (B) the first outer protective plate is faced by the external surface of the first plate of the first electrode, and (C) the second external protective plate is faced by the external surface of the first plate of the second electrode; and the conductive protective structure is designed to be electrically isolated from a circuit. The protective structure does not substantially have a portion having a surface that forms part of the surface of the novel structure. The surface of the novel structure substantially encloses the conductive protective structure. The elements of the novel structure may have certain geometric values, relative values, relative positions, and shapes. The novel structures may also include, in the stack of conductive layers, also known as conductive plates, first additional conductive layers as part of the first electrode, second additional conductive layers as part of the second electrode, and additional protective layers as part of the protective structure . Unlike other protected energy conditioners, the protective structure of this invention does not include electrodes for electrical connection to circuit elements. This absence of requirements for protective electrodes for connection to the elements of the circuit allows the novel structures of the invention to have substantially or totally one side thereof residing on a conductive surface, while maintaining the protective structure without electrical contact with all the elements of the circuit. The novel energy-conditioning structures may have some of their surface regions defined by electrically insulating material. The novel energy conditioning structures have surface regions formed by at least one contact surface of the first electrode and the second electrode. The novel structures may have several electrodes, each of which preferably has layers or plates within the structure that are substantially protected from the layers of the other electrodes of the structure. The structure preferably has an electrically insulating material between the conductive layers or plates whereby it substantially prevents the electrons from moving from one conductive layer through the insulating material to another conductive layer. The insulating material can be any material that has a dielectric constant. Examples of insulating material are air, which has a dielectric constant of one, and materials specified as X7R, which have a dielectric constant of about 4600, silicon, semiconductors III-V and II-VI, and SiN and semiconductors of Diamond. Preferably, the relatively large dielectric constant to maximize the capacitance by volume. However, the dielectric constant can be set at least in semiconductor applications by dielectric layers compatible with the semiconductor in question. Certain geometrical values, relative values, relative positions, and shapes of the structures of the invention include shapes of each of the plates in the plane defined by the larger surface of those plates, the relative locations and extensions of the contact regions of the conductive layer, where electrical power is connected to each plate, the thickness of each plate, the spacing between adjacent plates, and the alignment of the plates one in relation to another. The energy conditioning structures of the invention may include additional internal structural energies, such as electrically conductive wire lines, conductive conduit structures, and the edge interconnection structure of the conductive layer. The energy conditioning structures of the invention may include openings that define the interior surfaces on the plates through which electrically conductive lines extend. The openings may form part of tubular shaped channels or regions extending between the plates or layers in the structure. The tubular regions or channels can be filled with material, electric or conductive, or remain open, that is, not filled with material. These electrically conductive lines can electrically connect to plates of the same electrode or to the protective structure, extending at the same time through openings in the plates of other electrodes and remaining isolated from those of other electrodes or the protective structure as the case may be. The interconnection structure of the edge of the electrode, if present, serves to electrically interconnect plates from the same electrode to another, and electrically connect to a plate edge of the electrode. The plates of the protective structure are electrically connected to each other. The plates of the protective structure and the conductive structure electrically interconnect the plates of the protective structure with each other and substantially enclose the plates or inner layers of the electrodes of the structure of the invention. A structure of the invention can be formed as a discrete component, such as the component suitable for connecting to a PC card for connection to a connector. Alternatively, a structure of the invention can be formed into and form part of another structure, such as a PC card, a connector, a first level interconnect, a mediator, or an integrated circuit, including monolithic integrated circuits. In embodiments of discrete components of the invention, the first electrode includes a surface of the contact region defining a portion of a surface of the structure, the second electrode includes a surface of the contact region defining a portion of the surface of the the structure, and an energy conditioning structure and does not have a surface defined by a portion of the protective structure. In alternative embodiments, the protective structure may have a surface region that defines a recessed portion of the surface of the structure. The discrete components and PC cards incorporating the novel structures of the invention can be formed by conventional stratification and ignition techniques. The wire lines can be formed monolithically, or formed separately and then inserted into the openings or formed in the openings. In both PC card and integrated circuit modes, certain of the surfaces of the contact regions of the electrodes in the discrete component modes that define portions of the surface of the structure do not exist, per se. Instead, the regions where those surfaces would in other circumstances define the termination of a discrete component are formed in contact with electrically conductive material that is connected to the tracks and / or which extends from and / or through some portion of the card. of PC, substrate, first level interconnection, mediator and / or integrated circuit beyond the regions containing the first electrode, the second electrode and / or the protective structure. Preferably, the inner protective plate extends, in the plane defined by its larger surfaces, beyond the edges of adjacent plates of the first and second electrodes so that, with the possible exception noted below, any line passing through both of the adjacent plates (i.e. , a plate of the first electrode and a plate of the second electrode) also pass through and / or come into contact with the inner protective plate. There is an exception where, in some embodiments, relatively small regions of the plates of each of the first and second electrodes extend beyond the extent of the protective plates where they come into contact with one or more interconnecting structures of the conductive layer placed internally. The internal conductive layer interconnect structure functions to substantially electrically connect all of the plates of the first electrode to one another and / or substantially all of the plates of the second electrode to each other. In addition, or alternatively, at least a portion of the inner protective plate generally extends a distance beyond the adjacent plates of the first and second electrodes at least one, preferably at least 5, more preferably at least 10. and still more preferably at least 20 times the distance separating the inner protective plate from an adjacent plate. The interconnection structure of the electrode plate is a structure that comes into electrical contact with portions of all or substantially all of the electrode plates, thereby electrically connecting the plates to the electrode with each other. The interconnecting structure of the electrode plate for an electrode does not, within the energy conditioning structure, come into contact with the plates of any other electrode or protective structure. The interconnecting structure of the electrode typically exists within those discrete components. In embodiments of PC cards, connectors and integrated circuits of structures of the invention, there may be no interconnection structure of the edge of the electrode or protective structure. Instead, typically, there will be a structure that electrically interconnects all the plates of the same electrode or the protective structure that includes electrically conductive wire lines that connect to the plates of the same electrode or the protective structure. The electrically conductive wires that connect to the plates of an electrode do not electrically connect the plates of other electrodes. Wired lines do not connect to the protective structure. Preferably, the electrically conductive wire lines connected to the plates of an electrode pass through openings in the plates of other electrodes and the plates of the protective structure so that those wire lines do not electrically connect to the plates of the other electrode or the structure protective Furthermore, as shown in the figures here, in the power conditioner, to provide common, internally located protection, tracks are provided thereon arranged between the first and second electrode sheets and are used to electrically connect the protective conductive layers, located internally, each other. The conductive coupling or conductive connection is achieved by one or more track holes placed in the respective insulating sheets and coupling to and / or through each protective conductive layer when necessary. The structures of the tracks, whether full or not, are usually in a relationship that is not parallel to the conductive layers placed, protective or non-protective. The structures of the tracks are usually placed beyond the perimeter of any non-protective conductive layer, however it was easily contemplated that the track can be placed through the provided non-protective conductive layers in which an insulating area is placed ensuring a reliable direct, but not conductive, between the structures of the tracks and the different non-protective layers. The inventors also contemplate the use of the invention in the manufacture of the technology, where the invention provides reduced parasitic currents between very little separated conditioning electrodes. The parasitic energy that existed in the unprotected capacitors of the prior art is greatly reduced by containing each respective electrode within a portion of the conductive protective structure. The conductive protective structure can be referred to as a conductive protective structure similar to a cage. Fabricating the preferred embodiments of bulky devices includes providing insulating sheets having conductive patterns thereon and in some embodiments through-hole, laminar and burn holes. However, any other manufacturing method can be used.

For example, insulating sheets can be burned before being laminated. In addition, the composite component of several preferred embodiments of the present invention can be produced by the following method. After providing an insulating layer including a paste-insulating material, printing or other suitable methods, a paste-conductive material is applied to a surface of the insulating layer to provide a conductive pattern and a path orifice. Next, the paste insulating material is applied again on the layer to provide another insulating layer. Similarly, by applying the paste insulating material in sequence, a composite component having a multiple layer structure can be produced.

BRIEF DESCRIPTION OF THE FIGURES FIGURE 1A shows an exploded perspective view of the layers of a first embodiment of a novel energy conditioning structure of the invention; FIGURE IB shows a perspective view of the energy conditioning structure of FIGURE 1A; Figure 1C shows a perspective view of the partial exploded view of some elements of the power conditioning structure of FIGURE 1A illustrating the flow distances between certain layers; FIGURE 2A is an exploded perspective view of the layers of a second embodiment of a novel energy conditioning structure of the invention; FIGURE 2B is an exploded perspective view of the layers of a second embodiment of a novel energy conditioning structure of the invention, excluding the upper and lower dielectric layers; FIGURE 2C is an exploded perspective view of the layers of a second embodiment of a novel energy conditioning structure of the invention, excluding the upper and lower dielectric layers, and excluding the upper and lower layers of the protective structure; FIGURE 3A shows a filter array including an energy conditioner placed on a surface including a conductive line; FIGURE 3B shows a filter arrangement that includes an energy conditioner placed on a conductive line and having only a single electrode connected; FIGURE 3C shows a filter arrangement that includes an energy conditioner placed on a conductive line; FIGURE 3D shows a filter arrangement that includes an energy conditioner placed on a conductive line; FIGURE 4A shows a filter array including an energy conditioning circuit with electrode contacts A and B connected to separate conductive lines; FIGURE 4B shows a filter array including an energy conditioning circuit having another power conditioner with different geometric relationships of the electrode contacts A and B connected to separate conductive lines; FIGURE 5A shows a filter arrangement that includes an energy conditioner placed transversely on a conductive line over an opening in the line; FIGURE 5B shows a filter array that includes a power conditioner positioned longitudinally on a conductive line over an opening in the line; FIGURE 6 is a perspective view showing a filter array including a perspective view including an energy conditioner positioned over an opening in a rectangular conductive component. FIGURE 7 is a plan view showing a filter array including an energy conditioner positioned over a circular opening in an annular conductive component; FIGURE 8 is a plan view showing a filter array including three power conditioners placed through an aperture in a conductive part of generally elongated, elongated shape; FIGURE 9 is a plan view of a filter array that includes two power conditioners arranged symmetrically on opposite sides of a conductive circuit line; FIGURE 10 is a plan view of a portion of a circuit including a plurality of conductive lines and various arrays of energy conditioners on and near lines that condition energy for each line; FIGURE 11 is a plan view of a portion of a circuit including a plurality of conductive lines and various arrays of energy conditioners placed on lines that condition energy for each line; FIGURE 12 is a plan view of a portion of a circuit including a plurality of conductive lines and various arrays of power conditioners placed on the lines in which each power conditioner is connected to one or more lines; FIGURE 13A is an exploded perspective view of a filter array including an energy conditioner configured to be placed in and encompass an opening in a ring formed of conductive material; FIGURE 13B is a side view of the filter array of FIGURE 13A; FIGURE 14 is a schematic view of a filter array including an energy conditioner having a single electrode connected; FIGURE 15 is a schematic of a complete circuit including a filter array that includes an energy conditioner that spans an opening in a conductive loop circuit; FIGURE 16 is a schematic view of a complete circuit including an energy conditioner and a metal layer capacitively and inductively coupled and conductively isolated from the power conditioner; FIGURE 16 is a schematic view of a complete circuit including an energy conditioner and a capacitively and inductively coupled conductively isolated metal layer; FIGURE 17 is a schematic of a complete circuit including an energy conditioner connected through the source and the load; FIGURE 18 is a schematic of an energy conditioner connected through the generator and discharge electrodes of the Field Effect Transistor (FET); FIGURE 19A is a schematic of an energy conditioner having an electrode connected to the source or drain of an FET and without other connections to provide a fast charge store for the memory. FIGURE 19B is a schematic sectional view of a semiconductor plate showing the high level connection of the power conditioner to the FET of FIGURE 19A; FIGURE 20A is a schematic of an energy conditioner having both electrodes connected to the source or discharge of an FET and without other connections to provide a fast charge store for the memory; FIGURE 20B is a schematic sectional view of a semiconductor plate showing the high level connection of both terminals of the power conditioner to the FET of FIGURE 20A; FIGURES 21 and 22 are diagrams illustrating complete circuits with various filter arrays including the energy conditioners of the invention; FIGURES 23A-C are perspective views showing filter arrangements including another novel energy conditioner; FIGURE 24 is a perspective view showing a filter array including another novel power conditioner in a circuit array; FIGURE 25A is a schematic, side view of another novel energy filter; FIGURE 25B is a side sectional view of the energy filter of FIGURE 25A; FIGURE 25C is a schematic identifying the internal conductive layers shown in FIGURE 25B; FIGURE 26A is a side sectional view of a filter array including the novel energy conditioner illustrated in FIGS. 25A-25C; FIGURE 26B is a planar view of the filter array of FIGURE 26A; and FIGURE 27 is a plan view of a filter array including a variation of the novel energy filter of FIGURES 25A-25C.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGURE IB shows an energy conditioning structure 1 including a contact of a first electrode 10, a contact of a second electrode 20, and a central region 30. The central region 30 has surfaces formed of one or more dielectric materials 40. The contact surfaces of the first electrode, the contact of the second electrode and the dielectric material preferably define the entire surface of the energy conditioning structure. Figure 1A shows a sequence of internal layers for the energy conditioning structure 1.

Figure 1A shows the sequence of layers from top to bottom, the layer of electrical material 50 being the conductive layer of the first protected structure 60, the layer of dielectric material 70, the second inner conductive layer of the electrode 80, the layer of dielectric material 90, the second conductive layer of the protective structure 100, the layer of dielectric material 110, the first electrically connected conductive inner layer 120, the dielectric material layer 130, the third conductive layer of the protective structure 140, and the layer of dielectric material 150. Figure 1A shows the conductive paths extending between the layers that allow the electrical connection of the layers of the protective structure with each other. These trajectories are referred to as tracks, and Figure 1A shows tracks 160A, 160B. There must be at least one conductive path electrically connecting the layers of the protective structure together. Some of these conductive paths can pass through openings in the electrically connected conductive layers of the electrodes, remaining isolated in those layers by a region of dielectric material between the conductive material in the path and the electrical material that forms the internally connected conductive layers of the electrodes. Preferably, these conductive paths 160A, 160B extend along paths out of the flat extent of the electrically connected conductive layers of the electrodes. Preferably, there is a plurality of conductive pathways such as 160A, 160B positioned to kink to each of the internal conductive layers of the electrodes. Preferably, there is a sufficient density of conductive paths 160A, 160B curled to each of the internal conductive layers of the electrodes and connected to the conductive layers of the protective structure, so that the protective structure as a whole provides an effect of the type of Faraday cage for each internal conductive layer of each electrode. That is to say that, preferably, the protective structure protects against oscillations of the electromagnetic field at relevant frequencies located adjacent to each other from the conductive layers of the electrodes of other conductive layers of the conductive electrodes, and protects all conductive layers of the electrodes against oscillations electromagnetic that originate outside the protective structure. Figure 1C illustrates the entry / exit of the edges of the inner layers in the energy conditioner 1 with each other. Figure 1C shows the entry distance "A" on the side of the internally connected layer of the first electrode 120 of the layer of the protective structure 100, and a similar exit distance "A" on the right side of the internally connected layer of the first electrode 120 of the end of the right side of the layer of the protective structure 100. The layer 80 is also deflected, but in an opposite direction, in relation to the and right ends of the layer of the protective structure 100. The deviation of the end of the right side of the layer 120 in relation to the layer 100 allows the layer 120 to come into internal contact with the contact of the first electrode 10, without also contacting the layer 100 with the first electrode. The deviation of the side of the end of the layer 80 in relation to the layer 100 allows the layer 80 to come into internal contact with the contact of the second electrode 20 without also coming into contact with the layer 100 with the second electrode. Figures 1A-1C show that the protective structure does not come into contact with the first electrode, does not come into contact with the second electrode, and does not have an electrode to contact a circuit element. Figures 1A-1C show the protective structure included within the dielectric material, so that the surface of the energy conditioner 1 does not include any surface of the protective structure. Figures 1A-1C are exemplary in that they show only one conductive layer of each of electrodes A and B. In most applications, each power conditioner 1 includes a set of more than one conductive layer per electrode. In some applications, the first electrode and / or the second electrode do not form end layers that cover the right and / or left ends (as shown in Figure IB) of the energy conditioner 1. Instead, the electrodes are part of the a surface of the power conditioner on any of the front, back, left and right sides of the structure. In some applications, the first electrode and / or the second electrode do not form end layers that cover the right and / or left ends (as shown in Figure IB) of the energy conditioner 1, and do not form part of the surfaces left, right, front, or rear (as shown in Figure IB) instead, are part of the upper and / or lower surfaces of the power conditioner 1, and are connected to their respective internally conductive layers, via tracks additional (not shown) that extend therethrough and that are isolated from the layers of the protective structure and the layers connected to other electrodes. In some applications, each power conditioner 1 includes more than 2 electrodes. In those embodiments, each electrode comes in contact with at least one internal conductive layer to the energy conditioner, and each of those conductive layers has an exit or tongue portion extending in the planar direction beyond the extension of the layers. of protective structures. That tongue portion comes into contact with an electrode having a surface available for electrical contact with other elements of the circuit. The surface of this electrode can be located on any surface of the power conditioner; top side; lower; frontal; later; left; or right. Figures 1A-1C show embodiments of the protective structure formed of a series of conductive layers that are electrically connected to each other, so that each layer of each electrode is separated from a layer of any electrode by a layer of the protective structure. Preferably, the conductive layers of the protective structure are substantially integrated layers. However, the regions of the conductive layers of the protective structure can be removed, as long as there remain enough regions of each conductive layer of the protective structure to provide the protective structure with better performance, such as a decrease in internal inductance compared to structures. non-protected energy conditioners. For frequency ranges of up to about 10 gigahertz, this requires that the spacing between the conductive regions of the same conductive layer of the protective structure be less than one centimeter, preferably less than 5 millimeters, and more preferably less than about one millimeter Although not preferred, each conductive layer of the protective structure can be replaced by a grid or mesh or array (regular or irregular) of conductive lines having line spacings of no more than one centimeter, and preferably no more than one millimeter, widths and depths of lines not greater than 100 Angstroms, more preferably at least 1000 Angstroms wide, and most preferably at least one micrometer wide. Preferably, the separation or insulating distance between the conductors of any electrode and the conductor forming the protective structure is at least 100 Angstroms, preferably at least 1000 Angstroms, more preferably at least 1 micrometer, and most preferably at least 100 microns. The minimum separation is defined in part by the dielectric constant, dielectric strength, and voltage fluctuations of the intended use of the power conditioner 1. Thus, the embodiment of Figures 1A-1B is exemplary of only a simplified version of the air conditioner. energy of the invention. Figure 2A shows a sequence of layers of the energy conditioner 200 from top to bottom as the upper layer of dielectric material 210, the upper conductive outer protective layer 220 layer, the conductive inner upper protective structure 230 layer, the layer conductive of the first electrode 240, the conductive middle layer of the protective structure 250, the conductive layer of the second electrode 260, the inner conductive lower protective layer 270, the conductive outer lower protective layer 280, and the lower layer of dielectric material 290. No dielectric layers are shown between each pair of adjacent conductive layers. In the flat view, each layer of the protective structure extends beyond three sides of each electrode layer. In the plan view, the electrode layer 240 has a portion 240A that extends beyond the layers of the protective structure, and the electrode layer 260 has the portion 260a extending beyond the layers of the protective structure. The portions 260a and 240a lie on the opposite ends of the energy conditioner 200. The structure 200 differs from the structure 1 in the existence of layers of the adjacent upper protective structure 220, 230, which are separated only by a dielectric. The structure 200 differs from the structure 1 in the existence of the layers of the adjacent lower protective structure 270, 280, which are separated only from one another by the dielectric. Figure 2A also shows track structures 300 that traverse the layers of the protective structure 230, 250, 270. The tracks also pass through the intervening dielectric layers., which are not shown. The tracks 300 do not pass through the layers of dielectric material 200 or 290. Figure 2B shows the layers without the upper and lower dielectric material layers. Figure 2C shows the layers without the upper and lower dielectric material layers and without the two upper and outer protective layers 220, 280. Figure 2C shows the inlet distance B, which is the distance, in a flat view, which the layer of the protective structure 250 extends beyond an edge of the electrode layer 240. The energy conditioner 200 includes electrode contacts such as the electrode contacts 10, 20 of the energy conditioner 1, which is shown in FIGS. Figures 2A-2C. In an alternative embodiment, the outer protective layers 220, 280 are not electrically connected to other layers of the protective structure, and the outer protective layers are each electrically isolated individually. In another alternative embodiment, the outer protective layers 220, 208 are not electrically connected to the other layers of the protective structure, and the outer protective layers are each electrically connected to additional channels. In another alternative embodiment, the layered structure including the protective structure or structures shown in Figures 1A-2C is included in a monolithic layered structure comprising a PC card, a mediator, a semiconductor integrated circuit. In these modalities there may be no electrode contact surfaces. Instead, there may be an extension of at least one conductive layer of each electrode beyond the flat extension of cage-like protective structures, so that each electrode is connected to a line of a circuit. Various relationships between the portions of the circuits and the energy conditioners of the invention are shown in Figures 2-12. These Figures illustrate novel geometric interrelations between the energy conditioners and circuit elements that are within the scope of this invention. Hereinafter, the energy conditioners of the invention will be referred to as X2Y '. Figure 3A shows an X2Y 'having its electrodes in the form of end caps positioned longitudinally along a conducting line of a circuit. Both end caps are electrically connected to the conductive line of the circuit. Figure 3B shows an energy conditioner X2Y 'having one end of the electrode in contact with a conductive line of a circuit, and without other electrodes in contact with the circuit. In this embodiment, the power conditioner X2Y 'does not require a second electrode contact. Therefore, it can be manufactured with or without the surface contact portion of the second electrode. Figure 3C shows an X2Y 'having a smaller dimension than the width of the conductive line and its end caps of the electrode oriented transversely to the direction of the extension of the conductive line of a circuit. Figure 3D shows an X2Y 'having a smaller dimension than the width of the conductive line and its end caps of the electrode oriented at an angle that is between the transverse and longitudinal in relation to the direction of the extension of the conductive line of a circuit Figure 4A shows an X2Y 'having each of its electrode end caps connected to a different one of two side lines which each in turn connect to a different point along a conductive line of a circuit. Alternatively, the two lateral lines could be connected to the same point along the conductive line of the circuit. Figure 4B shows an alternative to Figure 4A where the length of each end cap of each electrode of X2Y 'is greater than the width of each lateral line. Figure 5A shows a conducting line of a circuit having an opening on which an X2Y 'is placed. The X2Y 'comes into contact with the circuit line on the opposite sides of the opening and the end caps of the X2Y' are oriented along the longitudinal direction of the circuit line. Figure 5B shows a conductive line with an opening and an X2Y 'transversely over the opening so that the end caps of the X2Y' lie along the same point along the length of the circuit line. Figure 6 shows a square-shaped metal part having an opening and a connecting arm, and an X2Y 'positioned over the opening so that the end caps of the X2Y' are in electrical contact with opposite sides of the opening. piece of metal. In alternative embodiments the metal piece is oblong, annular, or rectangular and the X2Y 'is oriented at various angles in relation to the arm extension to provide adequate phase cancellation. The arm is connected to a line of a circuit, to provide power conditioning. Alternatively, the X2Y 'may be placed in a seat or cavity of the opening, or may span a length of the opening and be placed in the opening and in contact with the opposing surfaces of the opening. Figures 7 and 8 show alternative annular shapes of multiple filters X2Y 'similar to those of Figure 6. Figure 9 shows a filter array in which the sidelines extend symmetrically from a circuit line, each side line in contact with one or more terminals of an X2Y '. Preferably, each lateral line forms an adapter on which the X2Y 'resides, so that both end caps of the X2Y' are electrically connected and connected to the adapter. Figure 10 shows portions of four circuit lines on a substrate, each as is frequently found in digital electronic devices or integrated semiconductor chips, PC cards, and other substrates. Figure 10 also shows several filter arrays that incorporate X2Y 'connected to several circuit lines. Figure 11 shows another arrangement of circuit lines on a substrate together with one or more X2Y 'in various orientations on each circuit line. Figure 12 is similar to Figures 10 and 11. However, Figure 12 shows some X2Y 'spanning two circuit lines, so that the extended X2Y' has one electrode connected to one circuit line and the other electrode connected to it. the other line of the circuit. Figure 12 also shows element C of X2Y 'having three electrodes, with one electrode connected to each of the three lines. Alternatively, a structure of X2Y '(a structure with a floating field structure internally), could have more than three electrodes, for example, one electrode for each parallel circuit line. In channel architectures this would allow a single X2Y 'device to span a series of channel lines and condition the power along all those lines. That X2Y 'multi-electrode device could be placed as shown in Figure 12 perpendicular to the extension of the wire lines. Alternatively, the multi-electrode X2Y 'could be placed at a different angle at a right angle relative to the extension of parallel circuit lines as required to register each X2Y electrode' on each channel line. Figure 13a shows an X2Y 'and an open conductive piece designed so that the X2Y' has the same dimension as the opening and can be placed in the opening as shown in Figure 13B. Figure 14 shows a circuit line with a lateral line projecting from it and connecting to an electrode of an X2Y '. Since no other electrode of the X2Y 'is required, the other external electrode for the X2Y 'does not need to be manufactured. Figure 15 shows a previously discussed filter arrangement connected to a complete circuit. Figure 16 shows a complete circuit with an X2Y 'through the source and the load. In addition, Figure 16 shows a metal layer of specific dimensions simultaneously separated by a specific distance from a surface of X2Y '. The size, shape and separation of the metal layer of the X2Y 'and the other components affect the inductive capacitive coupling to the metal layer. Therefore, the size, shape and separation of the metal layer of the X2Y 'and other components of the circuit provide the tuning of the frequency and phase of power conditioning provided by the X2Y'. Figure 17 shows a complete circuit with an X2Y 'having two electrodes across the load. Figures 18-20 illustrate schematically the application of structures from X2Y 'to FET and memories based on FET. FET means field effect transistor. However, the described circuits are equally applicable to bipolar transistors. Figure 18 depicts an X2Y 'connected through the source and discharge of an FET to provide, for example, filtration of high frequency components in the source discharge voltage. Figure 19A shows an X2Y 'having an electrode connected to the discharge (or to the source) of the FET. This allows the capacitive charging of the electrodes of the X2Y '~. The X2Y 'have a very small internal inductance. Therefore, the charging time is fast, providing a fast read or write memory of a voltage or charge state. Figure 19B shows a possible architecture for incorporating the structure of the X2Y 'and an FET structure in a semiconductor integrated microcircuit, in which a conductive line is placed on the surface of the source or discharge of the FET to a point of contact in the X2Y 'electrode layer. FIGS. 20A and 20B are analogous to FIGS. 19A and 19B showing the bulk (A) and integrated (B) formation of a memory having connection to both electrodes of an X2Y '. FIGURE 21 shows a complete circuit in which a series of X2Y 'is placed across the load. Additional X2Y '(3,4,5, etc.) can be added to the series. FIGURE 22 shows a complete circuit in which one X2Y 'was placed across the load and another X2Y' was placed connected to a lateral line, to provide power conditioning at both ends of the frequency spectrum. FIGURE 23A shows a portion of a filter arrangement of a circuit including another novel energy conditioner (X2Y ') of the invention. The X2Y 'of FIGURE 23A is the same as any of the energy conditioners described herein above except that it includes a conductive coating that encloses the structures of electrodes A and B, the protective grounding structure, and the dielectric material. Thus X2Y 'of FIGURE 23A includes an insulated, floating inner protective structure, an electrode A conductively connected to the conductive coating, and an electrode structure B also conductively connected to the conductive coating. As shown in the filter arrangement of FIGURE 23A, this X2Y 'is placed on and in conductive contact with a circuit line. The longest side of X2Y 'is parallel to the circuit line. FIGURE 23C shows the X2Y 'of FIGURE 23A arranged alternately, so that the shorter side is parallel to the circuit line. FIGURE 23B illustrates an alternative filter array including the X2Y 'of FIGURE 23A in which the conductive coating of the X2Y' forms the connection between the terminals of a circuit line. FIGURE 24 shows a circuit arrangement that includes another novel X2Y power conditioner. The power conditioner X2Y 'is, structurally speaking, internally the same as any of the X2Y' structures described above. However, it includes conductive externally symmetrical conductive connections of the right and left side electrode terminal contacts. The filter arrangement in FIGURE 24 shows portions of the terminating circuit line, and the externally symmetrical conductive connections of the X2Y 'completing the conductive path of the circuit line portions. Alternatively, the circuit line can not be interrupted, and this X2Y 'structure can be placed on the circuit line in the same configuration shown in FIGURE 24, or in the alternative orientation shown in FIGURE 23C. In any orientation, the internal electrode structures of X2Y 'are both electrically connected to the path of the circuit line on both sides of X2Y'. FIGURES 25A-25C illustrate another novel energy conditioning structure designed to be coupled without coming into electrical contact with the circuit line. FIGURE 25A shows a side view of this novel X2Y 'structure and schematically illustrates the internal location of the capacitive / inductive coupling adapters for two electrodes of this X2Y'. FIGURE 25B shows a side section of X2Y 'of FIGURE 25A that includes an optional metal armor on all sides, except the bottom side, a bottom electrode adapter A relaxed from the bottom, an electrode adapter B relaxed from the bottom, an electrode plate A, an electrode plate B, and three layers of the protective structure so that two layers of the protective structure surround each layer or plate of electrodes A and B. There is dielectric material between the conductive layers to fix them in relation to each other. Preferably, there is a dielectric layer of a well defined and uniform thickness below the electrode adapters A and B. As in all the above embodiments, the protective structure floats electrically to the potential. Differently to all the previous modalities, the electrode A and the electrode B also float; they do not come into electrical contact with any line of a circuit. Preferably, the bottom surface is of a material that will be wetted with a conductive metal such as conventional, indium or indium-tin solder. In use, the lower surface of the X2Y can be welded using those metals to a conducting line of a circuit. The use of a metal welding connection allows the dielectric separation defined by the thickness of the dielectric layer below the electrode adapters to define the distance between the metal of the circuit line and the adapters, thus providing an inductive coupling / reproducible capacitive. FIGURE 25C shows the sequence of conductive layers within X2Y 'of FIGURES 25A and 25B. The FIGURE 25C also shows the deviation of the ends of the layers on the left side of the layers shown in FIGURE 25B. However, as with other embodiments, tracks may be used, so that the protective layers may extend beyond the planar extension of the conductive layers of the electrodes. FIGURE 26A shows in a partial, side sectional view, a filter array including an X2Y 'of FIGURES 25A-25C where the power conditioner of X2Y' is placed on a conductive line of a circuit to a substrate. The internal location of the electrode adapter A and the electrode adapter B is illustrated in dotted lines. FIGURE 26B is a planar view of the filter array of FIGURE 26A that also shows the perimeters of the electrode adapters A and B in dotted lines. Figure 27 is a schematic plan view of a filter array having a variation of the novel energy filter of Figures 25A-25C. The energy filter of X2Y 'of Figure 27 similar to that of X2Y' of Figures 25A-25C since it includes adapters that are coupled capacitively / inductively and not in electrical contact with the circuit line, and the arrangement of filter includes this X2Y 'placed on the conductive line. In contrast to the X2Y 'of Figures 25A-25C, the X2Y' of Figure 27 includes more than 2 electrodes. Specifically, it includes three electrodes and three electrode adapters. Adapters 1 and 2 are oriented transversely to the extension of the circuit line. The adapter 3 is oriented longitudinally from the adapters 1 and 2 in relation to the extension of the circuit line. East X2Y 'includes the floating protective structure of the X2Y which substantially individually encloses each layer of the electrode structure to provide very low inductance and high differential impedance effects between the electrodes. If it is connected to a conductive line so that adapter 1 and adapter 2 are coupled to the lines as shown, you can experience time-dependent cross-voltage differences and filter out those voltage differences. In addition, the longitudinal voltage differences dependent on the time on the line should be filtered by the existence of the adapter 3 placed longitudinally in relation to the adapters 1 and 2. The capacitive / inductive coupling illustrated by the energy filter of the X2Y 'of the Figure 25A to Figure 27 is compatible with all filter arrays previously discussed here. The use of the structure of the type of the X2Y 'coupled capacitively / inductively in any of the filter arrays discussed above was contemplated. Although Figure 27 shows only 3 adapters and describes only three corresponding internally protected electrodes, the inventors contemplate that more contact adapters and electrodes may be useful. Specifically, the inventors recognize that high frequency propagation modes along a circuit line can be in various modes defined for example by solutions to limit value equations that define the dimension of the circuit line and the characteristics of the circuit. related transmission line. This suggests that an array of contact adapters at several spatial distances exist for the high frequency energy filtering modes or signals transmitted along a circuit line. These arrangements may include more than 3, such as 4 to 500 adapters and corresponding internally protected electrode structures. The combination of several electrodes and a conductive protective structure can create an effective differential state and a common mode of filtering electromagnetic interference and / or protection against transient voltages. Additionally, a circuit array using the invention will comprise at least one line conditioner circuit component constructed with formed electrode patterns that are provided by several surfaces of dielectric material with at least a portion of those respective electrode surfaces or edges operable to the conductive coupling for power transmissions electrically coupled to electrical conductors of the circuit. The different electrode patterns selected, the dielectric material used and the placement and use of the intervening conductive protective layer or structure create a community between paired electrodes, but placed opposite (one in relation to the other) that operate to produce a balanced circuit arrangement position (equal but opposite) ) within the electrical component when coupling line to line between the electrical conductors and the ground conduction line of the individual electrical conductors to the inner conductive protective layer, within the component of the circuit power conditioning operations. The particular electrical effects of the multifunctional energy conditioner are determined by the choice of material between the electrode plates and the use of an internally placed conductive protective layer or structure, which effectively accommodates a substantial portion of the electrode layers within one or more of the electrode layers. more protective structures, like those of Faraday. The dielectric material used in conjunction with at least two opposed electrode plates with a separate conductive protective layer or structure therebetween will combine to create a line-to-line capacitance value that is approximately? The value of the capacitance value of either from one of the two line-to-layer protective capacitors created, when energized. If a metal oxide varistor (MOV) is used, then the multifunctional power conditioner will have overcurrent or overvoltage protection characteristics provided by the MOV type material. The protective layer or structure in combination with the electrode plates will form at least one line-to-line capacitor and at least two line capacitors to ground connection, and will operate to provide differential or common mode filtering. During transient voltage conditions, the varistor material, which is essentially a non-linear resistor used to suppress high-voltage transitions, will operate to limit transient voltage conditions or surge spikes that may appear between electrical conductors.

The inventors contemplate embodiments in which the paths or openings are defined by conductive surfaces as those conductive surfaces that form a conductive path that can come into mechanical or electrical contact with one or more layers or conductive surfaces in the structures. The inventors also contemplate that the plates may be irregularly shaped as opposed to square, rectangular, or generally round, depending for example on the desired application. The inventors also contemplate that the tracks can pass through conductive layers, such as layers that form non-protective electrodes, and layers that form the protective electrode, without electrical contact with those layers for electrically connecting, for example, layers of an electrode structure. with another without shorting the electrode structure with another electrode structure. The inventors contemplate modifying the energy conditioning modalities described in USP 6,018,448 and 6,373,673 PCT / US2004 / 000218 (now published as WO 2004/07095) by modifying their conductive protective structure so that it is designed to be conductively isolated from a circuit for which The conditioning electrodes are designed to be connected in a conductive or capacitive / inductive manner. In this way, the protective protective structure of those embodiments can be modified to cover the entire outer surface of the conductive protective structure with electrical material. Optionally, some portion of the conductive protective structure can be discovered, but recessed from the adjacent surface regions of the structure. The number of plates or the protective structure can be 1, 3, at least 3, at least 5, at least 7, at least 9, or at least 21. The ratio of the total surface area of the protective structure to the total surface area An electrode of the structure can be at least 0.1, at least 0.5, at least 1, at least 3, at least 5, or at least 10. The number of electrodes in any structure can be at least 2, at least 3, at least 4, at least 6, at least 10, at least 16, at least 32, or at least 64. Preferably, the electrodes of the novel structures are designed to connect or couple capacitively / inductively to or be formed connected or coupled capacitively / inductively to conductive lines of a circuit, and the conductive protective structure is designed to be conductively isolated from lines of the circuit.

Claims (34)

1. NOVELTY OF THE INVENTION Having described the invention as above, property is claimed as contained in the following: CLAIMS 1. An energy conditioner, characterized in that it comprises: a protective structure that floats internally; a first electrode structure; a second electrode structure; where the first electrode structure comprises at least a first conductive layer of the first electrode structure, the second electrode structure comprises at least a first conductive layer of the second electrode structure; wherein the internally floating protective structure protects the first conductive layer to the first electrode structure of the second electrode structure layer, and the internally floating protective structure protects the first conductive layer of the second electrode structure of the first structure of electrode; and the first electrode structure includes a first electrode contact region.
2. 2. A filter array comprising the power conditioner according to claim 1 and a line segment conducting a circuit, characterized in that the contact region of the first electrode structure is electrically connected to the line conductor segment.
3. 3. An energy conditioner that is coupled capactive / inductively, characterized in that it comprises: a protective structure that floats internally; a first electrode structure; a second electrode structure; where the first electrode structure comprises at least a first first conductive layer of the first electrode structure, the second electrode structure comprises at least one first conductive layer of the second electrode structure; wherein the internally floating protective structure protects the first conductive layer to the first electrode structure of the second electrode structure layer, and the internally floating protective structure protects the first conductive layer of the second electrode structure of the first structure of electrode; and the first electrode structure includes a capacitive / inductive coupling adapter of the first electrode
4. 4. A filter arrangement comprising the energy conditioner that is coupled to the capacitor / inductively according to claim 3 and a line segment conducting a circuit , characterized in that the capacitive / inductive coupling adapter of the first electrode is coupled capacitively / inductively to the conductor line segment.
5. 5. An internally protected capacitor, characterized in that it comprises: a protective conductive layer; a first electrode containing at least one first electrode layer, wherein the first electrode layer is on top of the protective conductive layer; a second electrode defining at least a second electrode layer, wherein the second electrode layer is below the protective conductive layer; where the protection, the first electrode, and the second electrode are electrically isolated from each other; and wherein the first electrode, the second electrode, and the conductive layer are positioned and dimensioned one relative to the other so that any straight line passing through the first electrode and the second electrode makes contact with the protective conductive layer.
6. 6. An energy conditioner, characterized in that it comprises; a protection defining at least one upper protective conductive layer, a central protective conductive layer and a lower protective conductive layer, wherein the upper protective conductive layer is on top of the central protective conductor layer and the central protective conductive layer is on top of the protective layer. lower protective conductive layer; a first electrode defining at least a first electrode layer, where the first electrode layer is located below the upper protective conductor layer and on top of the central protective conductor layer; a second electrode defining at least a second electrode layer, wherein the second electrode layer is under the central protective conductor layer and on top of the lower protective conductor layer; and wherein the protection, the first electrode, and the second electrode are electrically isolated from each other; and wherein the first electrode, the second electrode, and the central protective conductive layer are positioned and dimensioned one in relation to the other, so that any straight line passing through the first electrode and the second electrode comes into contact with the layer central protective conductor.
7. The conditioner according to claim 6, characterized in that the protection comprises at least one conductive opening which operates to conductively couple all the protective conductive layers together.
8. The conditioner according to claim 6, characterized in that the protection further comprises at least one conductive track structure which operates to conductively couple all the protective conductive layers together.
9. The conditioner according to claim 6, characterized in that the protection comprises at least one conductive opening, wherein at least one conductive opening passes through at least one first electrode layer or the second electrode layer; and wherein at least one conductive opening operates to conductively couple all the protective conductive layers together.
10. 10. The conditioner according to claim 6, characterized in that the protection further comprises at least one conductive path structure, wherein at least one conductive path structure passes through at least one first electrode layer or the second electrode layer; and wherein at least one conductive track structure operates to conductively couple all the protective conductive layers together.
11. The power conditioner according to claim 7, characterized in that the protection operates to be physically coupled to the path of a circuit.
12. 12. The power conditioner according to claim 8, characterized in that the protection operates to be physically coupled to the path of a circuit.
13. 13. A method for manufacturing an energy conditioner, characterized in that it comprises: providing a protective structure that floats internally; provide a first electrode structure; provide a second electrode structure; where the first electrode structure comprises at least a first conductive layer of the first electrode structure, the second electrode structure comprises at least a first conductive layer of the second electrode structure; wherein the internally floating protective structure protects the first conductive layer of the first electrode structure of the second electrode structure, and the internally floating protective structure protects the first conductive layer of the second electrode structure of the first structure of the first electrode structure. electrode; The first electrode structure includes a first electrode contact region.
14. 14. A method for manufacturing a filter array comprising an energy conditioner comprising a protective structure that floats internally; a first electrode structure; a second electrode structure; where the first electrode structure comprises at least a first conductive layer of the first electrode structure, the second electrode structure comprises at least a first conductive layer of the second electrode structure; wherein the internally floating protective structure protects the first conductive layer of the first electrode structure of the second electrode structure, and the internally floating protective structure protects the first conductive layer of the second electrode structure of the first electrode structure; wherein the first electrode structure includes a first electrode contact region and a line conductive segment of a circuit, wherein the contact region of the first electrode structure is electrically connected to the conductive line segment, characterized in that it comprises the steps of : provide the power conditioner; provide the conductive line segment; and electrically connecting the conductive line segment to the power conditioner.
15. 15. A method for manufacturing an energy conditioner that is coupled in a capacitive / inductive manner, comprising: providing a protective structure that floats internally; provide a first electrode structure; provide a second electrode structure; where the first electrode structure comprises at least a first conductive layer of the first electrode structure, the second electrode structure comprises at least a first conductive layer of the second electrode structure; wherein the internally floating protective structure protects the first conductive layer of the first electrode structure of the second electrode structure, and the internally floating protective structure protects the second electrode structure of the first conductive layer of the first structure of the first electrode structure. electrode; and the first electrode structure comprises a first capacitor / inductive electrode coupling adapter.
16. 16. The method for manufacturing a circuit, characterized in that it includes the method according to claim 15, and in that it further comprises the capacitive / coupling of the power conditioner to a conductive line segment.
17. 17. A method for manufacturing an internally protected capacitor, characterized in that it comprises; provide a protective conductive layer; providing a first electrode defining at least one first electrode layer, wherein the first electrode layer is located above the protective conductive layer; providing a second electrode defining at least a second electrode layer, wherein the second electrode layer is below the conductive protective layer; where the protection, the first electrode, and the second electrode are electrically isolated from each other; and wherein the first electrode, the second electrode and the protective conductive layer are positioned and dimensioned one in relation to the other, so that any straight line passing through the first electrode and the second electrode come into contact with the protective conductive layer .
18. 18. A method for manufacturing an energy conditioner, characterized in that it comprises: providing a protection defining at least one upper protective conductive layer, a central protective conductive layer, a lower protective conductive layer, wherein the upper protective conductive layer is on top of the central protective conductive layer and the central protective conductive layer is on top of the lower protective conductive layer; provides a first electrode defining at least a first electrode layer, wherein the first electrode layer is under the upper protective conductor layer and on top of the central protective conductor layer; providing a second electrode defining at least a second electrode layer, wherein the second protective layer is located below the central conductive layer and on top of the lower protective conductive layer; and where the protection, the first electrode and the second electrode are electrically isolated from each other; where the first electrode, the second electrode, and the central protective conductor layer are placed and dimensioned one in relation to the other so that any straight line passing through an electrode and the second electrode comes into contact with the protective conductive layer central.
19. The method according to claim 18, characterized in that the protection further comprises at least one conductive opening which operates to conductively couple all the protective conductive layers together.
20. The method according to claim 18, characterized in that the protection further comprises at least one conductive track structure which operates to conductively couple together all the protective conductive layers together.
21. 21. The method according to claim 18, characterized in that the protection further comprises at least one conductive opening, wherein at least one conductive opening passes through at least one first electrode layer to the second electrode layer; and wherein at least one conductive opening operates to conductively couple all conductive layers together.
22. The method according to claim 18, characterized in that the protection further comprises at least one conductive path structure, wherein at least one conductive path structure passes through at least the first electrode layer or the second electrode layer.; and wherein at least one conductive track structure operates to conductively couple all the protective conductive layers together.
23. 23. The method according to claim 19, characterized in that the protection is designed to be physically isolated from a circuit path.
24. 24. The power conditioner according to claim 20, characterized in that the protection is designed to be physically isolated from a circuit path.
25. 25. A method of using an energy conditioner, wherein the energy conditioner comprises: a protective structure that floats internally; a first electrode structure; a second electrode structure where the first electrode structure comprises at least a first conductive layer of the first electrode structure, the second electrode structure comprises at least a first conductive layer of the second electrode structure; wherein the internally floating protective structure protects the first conductive layer of the first electrode structure of the second electrode structure, and the internally floating protective structure protects the first conductive layer of the second electrode structure of the first structure of the first electrode structure. electrode; and the first electrode structure comprises a first electrode contact region, the method is characterized in that it comprises: connecting the power conditioner in an electrical circuit.
26. 26. A method of using a capacitively / inductively coupled power conditioner, wherein the power conditioner comprises: a protective structure that floats internally; a first electrode structure; a second electrode structure where the first electrode structure comprises at least a first conductive layer of the first electrode structure, the second electrode structure comprises at least a first conductive layer of the second electrode structure; wherein the internally floating protective structure protects the first conductive layer of the first electrode structure of the second electrode structure, and the internally floating protective structure protects the first conductive layer of the second electrode structure of the first structure of the first electrode structure. electrode; and the first electrode structure comprises a first electrode contact region, the method is characterized in that it comprises: connecting the power conditioner in an electrical circuit.
27. 27. A method of using an internally protected capacitor, the internally protected capacitor comprises: a protective structure that floats internally; a first electrode structure; a second electrode structure where the first electrode structure comprises at least a first conductive layer of the first electrode structure, the second electrode structure comprises at least a first conductive layer of the second electrode structure; wherein the internally floating protective structure protects the first conductive layer of the first electrode structure of the second electrode structure, and the internally floating protective structure protects the first conductive layer of the second electrode structure of the first structure of the first electrode structure. electrode; and the first electrode structure comprises a first electrode contact region, the method is characterized in that it comprises: connecting the power conditioner in an electrical circuit.
28. 28. A method of using an energy conditioner, the power conditioner comprises: a protection defining at least one upper protective conductive layer, a central protective conductive layer, and a lower protective conductive layer, wherein the upper protective conductive layer is located above the central protective conductor layer and the central protective conductor layer is located above the lower protective conductor layer; a first electrode defining at least a first electrode layer, wherein the first electrode layer is located below the upper protective conductor layer and on top of the central protective conductor layer; a second electrode defining at least a second electrode layer, wherein the second electrode layer is under the central protective conductor layer and on top of the lower protective conductor layer; where the protection, the first electrode and the second electrode are electrically isolated from each other; and wherein the first electrode, the second electrode, and the central protective conductor layer are positioned and dimensioned one in relation to the other so that any straight line passing through the first electrode and the second one comes into contact with the protective conductive layer central, the method is characterized because it comprises: connecting the power conditioner in an electrical circuit.
29. 29. The method according to claim 28, characterized in that the protection comprises at least one conductive opening which operates to conductively couple all the protective conductive layers together.
30. 30. The method according to claim 28, characterized in that the protection comprises at least one conductive track structure that operates to conductively couple all the protective conductive layers together.
31. The method according to claim 28, characterized in that the protection further comprises at least one conductive opening where at least one conductive opening passes through at least one first electrode layer or the second electrode layer; and wherein at least one conductive opening operates to conductively couple all the protective conductive layers together.
32. The method according to claim 28, characterized in that the protection further comprises at least one conductive path structure where at least one conductive path structure passes through at least the first electrode layer or the second electrode layer; and wherein at least one conductive track structure operates to conductively couple all the protective conductive layers together.
33. 33. The method according to claim 29, characterized in that the protection is designed to be physically isolated from the path of a circuit.
34. 34. The method according to claim 30, characterized in that the protection comprises at least one conductive opening that operates to conductively couple all the protective conductive layers together.