MXPA06001109A - Ensamble mejorado de puente rectificador. - Google Patents

Ensamble mejorado de puente rectificador.

Info

Publication number
MXPA06001109A
MXPA06001109A MXPA06001109A MXPA06001109A MXPA06001109A MX PA06001109 A MXPA06001109 A MX PA06001109A MX PA06001109 A MXPA06001109 A MX PA06001109A MX PA06001109 A MXPA06001109 A MX PA06001109A MX PA06001109 A MXPA06001109 A MX PA06001109A
Authority
MX
Mexico
Prior art keywords
rectifier bridge
heat sink
bridge assembly
improved rectifier
bridge circuit
Prior art date
Application number
MXPA06001109A
Other languages
English (en)
Inventor
Joe C Y Hsieh
Original Assignee
Joe C Y Hsieh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joe C Y Hsieh filed Critical Joe C Y Hsieh
Publication of MXPA06001109A publication Critical patent/MXPA06001109A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
    • H02K11/05—Rectifiers associated with casings, enclosures or brackets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Rectifiers (AREA)
  • Synchronous Machinery (AREA)

Abstract

Un ensamble de puente rectificador que incluye un circuito de puente rectificador adaptado para conectar por lo menos una fuente de corriente alterna con por lo menos dos compartimientos de diodo conectados al circuito del puente rectificador de manera operativa y una salida de corriente directa para convertir la corriente alterna en corriente directa. Un disipador de calor se forma a partir de por lo menos dos aberturas para recibir a los por lo menos dos compartimientos de diodos separados en relacion de espacio y en contacto substancialmente con el disipador de calor, donde el calor del compartimiento de diodo se disipa eventualmente hacia el disipador de calor.
MXPA06001109A 2003-07-30 2004-07-16 Ensamble mejorado de puente rectificador. MXPA06001109A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/632,050 US6970357B2 (en) 2003-07-30 2003-07-30 Rectifier bridge assembly
PCT/US2004/022975 WO2005013660A1 (en) 2003-07-30 2004-07-16 Improved rectifier bridge assembly

Publications (1)

Publication Number Publication Date
MXPA06001109A true MXPA06001109A (es) 2006-04-11

Family

ID=34104265

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA06001109A MXPA06001109A (es) 2003-07-30 2004-07-16 Ensamble mejorado de puente rectificador.

Country Status (11)

Country Link
US (1) US6970357B2 (es)
JP (1) JP4495728B2 (es)
KR (1) KR100919693B1 (es)
AU (1) AU2004301785B2 (es)
BR (1) BRPI0413026A (es)
CA (1) CA2533490C (es)
CR (1) CR8214A (es)
MX (1) MXPA06001109A (es)
MY (1) MY135636A (es)
TW (1) TWI283508B (es)
WO (1) WO2005013660A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7352583B2 (en) * 2005-10-03 2008-04-01 Remy Technologies, L.L.C. Flexible lead for a pressfit diode bridge
US7531925B2 (en) * 2007-04-24 2009-05-12 Remy International, Inc. High current capacity rectifier package
US20090052134A1 (en) * 2007-08-22 2009-02-26 Casteel Jordan B Liquid-cooled grounded heatsink for diode rectifier system
JP5439430B2 (ja) * 2011-05-17 2014-03-12 日立オートモティブシステムズ株式会社 車両用交流発電機
CN102623445B (zh) * 2012-03-09 2014-01-15 华中科技大学 一种整流桥臂
US9312742B2 (en) 2013-03-01 2016-04-12 Hamilton Sundstrand Corporation Connector and spring assembly for a generator
CN114497009A (zh) * 2021-12-24 2022-05-13 太仓市晨启电子精密机械有限公司 一种基于矩阵式料片的gbpc方桥加工工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697814A (en) * 1971-06-21 1972-10-10 Gen Motors Corp Bridge rectifier heat sink assembly
US4493018A (en) * 1982-09-30 1985-01-08 Mega International, Inc. Conductor separator, wiring harness, and rectifier assembly for an alternator including same
US4809057A (en) * 1986-12-18 1989-02-28 Motorola, Inc. Electrical component assembly and method of manufacture thereof
JP3230829B2 (ja) * 1992-01-14 2001-11-19 株式会社日立製作所 車両用交流発電機と整流器
US5712517A (en) * 1992-09-15 1998-01-27 Ford Motor Company Epoxy insulator coating on an alternator heat sink
US5473208A (en) * 1994-06-08 1995-12-05 Stihi; Edward Cooling structure for alternator rectifier
US5838544A (en) * 1997-05-13 1998-11-17 Mobiletron Electronics Co., Ltd. Heat dissipating structure for rectifiers of car alternators
US6327128B1 (en) * 1998-10-07 2001-12-04 Electro-Dyn Electronics Corporation Automotive bridge rectifier assembly with thermal protection
DE19946255A1 (de) * 1999-09-27 2001-03-29 Philips Corp Intellectual Pty Gleichrichteranordnung
JP4284860B2 (ja) * 2000-11-21 2009-06-24 株式会社デンソー 車両用交流発電機
US6731030B2 (en) * 2001-08-30 2004-05-04 Integral Ro Design Ltd. High performance bridge rectifier for diode-rectified alternating current generator

Also Published As

Publication number Publication date
US6970357B2 (en) 2005-11-29
CA2533490C (en) 2011-12-20
MY135636A (en) 2008-05-30
AU2004301785B2 (en) 2009-07-30
BRPI0413026A (pt) 2006-10-03
AU2004301785A1 (en) 2005-02-10
WO2005013660A1 (en) 2005-02-10
JP2007500101A (ja) 2007-01-11
TWI283508B (en) 2007-07-01
TW200525873A (en) 2005-08-01
US20050024833A1 (en) 2005-02-03
KR100919693B1 (ko) 2009-10-06
JP4495728B2 (ja) 2010-07-07
CA2533490A1 (en) 2005-02-10
CR8214A (es) 2006-10-04
KR20060054401A (ko) 2006-05-22

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Legal Events

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