CR8214A - Ensamblaje mejorado de puente rectificador - Google Patents

Ensamblaje mejorado de puente rectificador

Info

Publication number
CR8214A
CR8214A CR8214A CR8214A CR8214A CR 8214 A CR8214 A CR 8214A CR 8214 A CR8214 A CR 8214A CR 8214 A CR8214 A CR 8214A CR 8214 A CR8214 A CR 8214A
Authority
CR
Costa Rica
Prior art keywords
bridge rectifier
rectifier assembly
improved bridge
rectifier bridge
bridge circuit
Prior art date
Application number
CR8214A
Other languages
English (en)
Inventor
Joe C Y Hsieh
Original Assignee
Joe C Y Hsieh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joe C Y Hsieh filed Critical Joe C Y Hsieh
Publication of CR8214A publication Critical patent/CR8214A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
    • H02K11/05—Rectifiers associated with casings, enclosures or brackets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Rectifiers (AREA)
  • Synchronous Machinery (AREA)

Abstract

Se refiere a un ensamble de puente rectificador que incluye un circuito de puente rectificador para conectar al menos una fuente de corriente alterna con por los menos dos comparimientos de diodo conectados al circuito del puente rectificador de manera operativa y una salida de corriente directa para convertir la corriente alterna en corriente directa.
CR8214A 2003-07-30 2006-01-24 Ensamblaje mejorado de puente rectificador CR8214A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/632,050 US6970357B2 (en) 2003-07-30 2003-07-30 Rectifier bridge assembly

Publications (1)

Publication Number Publication Date
CR8214A true CR8214A (es) 2006-10-04

Family

ID=34104265

Family Applications (1)

Application Number Title Priority Date Filing Date
CR8214A CR8214A (es) 2003-07-30 2006-01-24 Ensamblaje mejorado de puente rectificador

Country Status (11)

Country Link
US (1) US6970357B2 (es)
JP (1) JP4495728B2 (es)
KR (1) KR100919693B1 (es)
AU (1) AU2004301785B2 (es)
BR (1) BRPI0413026A (es)
CA (1) CA2533490C (es)
CR (1) CR8214A (es)
MX (1) MXPA06001109A (es)
MY (1) MY135636A (es)
TW (1) TWI283508B (es)
WO (1) WO2005013660A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7352583B2 (en) * 2005-10-03 2008-04-01 Remy Technologies, L.L.C. Flexible lead for a pressfit diode bridge
US7531925B2 (en) * 2007-04-24 2009-05-12 Remy International, Inc. High current capacity rectifier package
US20090052134A1 (en) * 2007-08-22 2009-02-26 Casteel Jordan B Liquid-cooled grounded heatsink for diode rectifier system
JP5439430B2 (ja) * 2011-05-17 2014-03-12 日立オートモティブシステムズ株式会社 車両用交流発電機
CN102623445B (zh) * 2012-03-09 2014-01-15 华中科技大学 一种整流桥臂
US9312742B2 (en) 2013-03-01 2016-04-12 Hamilton Sundstrand Corporation Connector and spring assembly for a generator
CN114497009A (zh) * 2021-12-24 2022-05-13 太仓市晨启电子精密机械有限公司 一种基于矩阵式料片的gbpc方桥加工工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697814A (en) * 1971-06-21 1972-10-10 Gen Motors Corp Bridge rectifier heat sink assembly
US4493018A (en) * 1982-09-30 1985-01-08 Mega International, Inc. Conductor separator, wiring harness, and rectifier assembly for an alternator including same
US4809057A (en) * 1986-12-18 1989-02-28 Motorola, Inc. Electrical component assembly and method of manufacture thereof
JP3230829B2 (ja) * 1992-01-14 2001-11-19 株式会社日立製作所 車両用交流発電機と整流器
US5712517A (en) * 1992-09-15 1998-01-27 Ford Motor Company Epoxy insulator coating on an alternator heat sink
US5473208A (en) * 1994-06-08 1995-12-05 Stihi; Edward Cooling structure for alternator rectifier
US5838544A (en) * 1997-05-13 1998-11-17 Mobiletron Electronics Co., Ltd. Heat dissipating structure for rectifiers of car alternators
US6327128B1 (en) * 1998-10-07 2001-12-04 Electro-Dyn Electronics Corporation Automotive bridge rectifier assembly with thermal protection
DE19946255A1 (de) * 1999-09-27 2001-03-29 Philips Corp Intellectual Pty Gleichrichteranordnung
JP4284860B2 (ja) * 2000-11-21 2009-06-24 株式会社デンソー 車両用交流発電機
US6731030B2 (en) * 2001-08-30 2004-05-04 Integral Ro Design Ltd. High performance bridge rectifier for diode-rectified alternating current generator

Also Published As

Publication number Publication date
US6970357B2 (en) 2005-11-29
CA2533490C (en) 2011-12-20
MY135636A (en) 2008-05-30
AU2004301785B2 (en) 2009-07-30
BRPI0413026A (pt) 2006-10-03
AU2004301785A1 (en) 2005-02-10
WO2005013660A1 (en) 2005-02-10
JP2007500101A (ja) 2007-01-11
TWI283508B (en) 2007-07-01
TW200525873A (en) 2005-08-01
US20050024833A1 (en) 2005-02-03
KR100919693B1 (ko) 2009-10-06
MXPA06001109A (es) 2006-04-11
JP4495728B2 (ja) 2010-07-07
CA2533490A1 (en) 2005-02-10
KR20060054401A (ko) 2006-05-22

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Legal Events

Date Code Title Description
FA Abandonment or withdrawal (granting procedure)