MXPA03007685A - Metodo para producir un modulo para incorporar en una tarjeta de soporte de datos y el modulo y la tarjeta obtenidos. - Google Patents
Metodo para producir un modulo para incorporar en una tarjeta de soporte de datos y el modulo y la tarjeta obtenidos.Info
- Publication number
- MXPA03007685A MXPA03007685A MXPA03007685A MXPA03007685A MXPA03007685A MX PA03007685 A MXPA03007685 A MX PA03007685A MX PA03007685 A MXPA03007685 A MX PA03007685A MX PA03007685 A MXPA03007685 A MX PA03007685A MX PA03007685 A MXPA03007685 A MX PA03007685A
- Authority
- MX
- Mexico
- Prior art keywords
- module
- card body
- producing
- module support
- conductive structure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Nonmetallic Welding Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Se describe un metodo para producir un modulo que se debera incorporar en un cuerpo de tarjeta, conforme al cual se proporciona una estructura (7) conductora sobre una superficie de soporte (4, 5, 6) del modulo. Durante la produccion del soporte del modulo se usa al menos para una primera capa (1) del soporte del modulo, localizada en la superficie (9) opuesta a la estructura (7) conductora, un material cuyas propiedades esenciales para una determinada manera de conexion con la capa de material del cuerpo de la tarjeta tras la incorporacion del modulo en el cuerpo de la tarjeta se ajustan a dicha capa de material.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10109993A DE10109993A1 (de) | 2001-03-01 | 2001-03-01 | Verfahren zur Herstellung eines Moduls |
PCT/EP2002/002185 WO2002071329A1 (de) | 2001-03-01 | 2002-02-28 | Verfahren zur herstellung eines moduls |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA03007685A true MXPA03007685A (es) | 2004-03-16 |
Family
ID=7676014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA03007685A MXPA03007685A (es) | 2001-03-01 | 2002-02-28 | Metodo para producir un modulo para incorporar en una tarjeta de soporte de datos y el modulo y la tarjeta obtenidos. |
Country Status (9)
Country | Link |
---|---|
US (1) | US7038128B2 (es) |
EP (1) | EP1374162B1 (es) |
JP (1) | JP2004524623A (es) |
CN (1) | CN1226701C (es) |
AT (1) | ATE272239T1 (es) |
DE (2) | DE10109993A1 (es) |
MX (1) | MXPA03007685A (es) |
RU (1) | RU2280279C2 (es) |
WO (1) | WO2002071329A1 (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10207002A1 (de) * | 2002-02-19 | 2003-08-28 | Orga Kartensysteme Gmbh | Verfahren zum Implantieren von Chipmodulen in Datenträgerkarten |
DE10216163A1 (de) * | 2002-04-11 | 2003-11-06 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte |
WO2005027597A1 (ja) * | 2003-09-10 | 2005-03-24 | Unitika Ltd. | フレキシブルプリント配線板用基板及びその製造方法 |
DE102011050794A1 (de) * | 2011-06-01 | 2012-12-06 | Bundesdruckerei Gmbh | Sicherheits- oder Wertdokument und Verfahren zu dessen Herstellung |
DE102012003603A1 (de) * | 2012-02-21 | 2013-08-22 | Giesecke & Devrient Gmbh | Elektronisches Modul und portabler Datenträger mit elektronischem Modul |
DE102012003605A1 (de) * | 2012-02-21 | 2013-08-22 | Giesecke & Devrient Gmbh | Elektronisches Modul und portabler Datenträger mit elektronischem Modul |
DE102013109976B4 (de) | 2013-09-11 | 2017-06-22 | Infineon Technologies Ag | Chipkartenmodul-Anordnung, Chipkarte, Verfahren zum Herstellen einer Chipkartenmodul-Anordnung und Verfahren zum Herstellen einer Chipkarte |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4876441A (en) * | 1984-03-27 | 1989-10-24 | Casio Computer Co., Ltd. | Card-like electronic apparatus |
AT389793B (de) * | 1986-03-25 | 1990-01-25 | Philips Nv | Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
FR2636453B1 (fr) | 1988-09-14 | 1992-01-17 | Sgs Thomson Microelectronics | Procede d'encapsulation de circuits-integres notamment pour cartes a puces |
JPH0687484B2 (ja) * | 1989-04-06 | 1994-11-02 | 三菱電機株式会社 | Icカード用モジュール |
US5103293A (en) * | 1990-12-07 | 1992-04-07 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
DE4122049A1 (de) * | 1991-07-03 | 1993-01-07 | Gao Ges Automation Org | Verfahren zum einbau eines traegerelements |
DE9110057U1 (es) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
US5255430A (en) * | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
DE19528730A1 (de) * | 1995-08-04 | 1997-02-06 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Datenträgers |
DE19543427C2 (de) * | 1995-11-21 | 2003-01-30 | Infineon Technologies Ag | Chipmodul, insbesondere zum Einbau in eine Chipkarte |
JPH09315058A (ja) * | 1996-05-30 | 1997-12-09 | Mitsubishi Electric Corp | Icカード |
DE19632115C1 (de) | 1996-08-08 | 1997-12-11 | Siemens Ag | Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls |
DE19632813C2 (de) * | 1996-08-14 | 2000-11-02 | Siemens Ag | Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte |
FR2762115B1 (fr) * | 1997-04-10 | 1999-12-03 | Schlumberger Ind Sa | Procede d'insertion d'un module electronique dans un corps de carte a memoire electronique |
BR9804917A (pt) * | 1997-05-19 | 2000-01-25 | Hitachi Maxell Ltda | Módulo de circuito integrado flexìvel e processos para produzir um módulo de circuito integrado flexìvel e um portador de informação. |
DE19731737A1 (de) * | 1997-07-23 | 1998-09-17 | Siemens Ag | Chipmodul für einen kartenförmigen Datenträger, entsprechender Kartenkörper sowie Verfahren zur Befestigung des Chipmoduls im Kartenkörper |
DE19735387A1 (de) | 1997-08-14 | 1999-02-18 | Siemens Ag | Trägerkarte und Halbleitermodul für eine derartige Trägerkarte |
FR2769440B1 (fr) * | 1997-10-03 | 1999-12-03 | Gemplus Card Int | Procede pour la fabrication d'un dispositif electronique a puce et/ou a antenne et dispositif obtenu par le procede |
JP3199691B2 (ja) * | 1998-11-18 | 2001-08-20 | 日東電工株式会社 | フレキシブル配線板 |
EP1033677A1 (de) * | 1999-03-04 | 2000-09-06 | ESEC Management SA | Verfahren für die Herstellung eines Chipobjektes |
FR2797801B1 (fr) * | 1999-08-24 | 2001-10-12 | Schlumberger Systems & Service | Carte a module secable resistante aux contraintes en flexion |
US6730857B2 (en) * | 2001-03-13 | 2004-05-04 | International Business Machines Corporation | Structure having laser ablated features and method of fabricating |
US6849935B2 (en) * | 2002-05-10 | 2005-02-01 | Sarnoff Corporation | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
-
2001
- 2001-03-01 DE DE10109993A patent/DE10109993A1/de not_active Withdrawn
-
2002
- 2002-02-28 JP JP2002570175A patent/JP2004524623A/ja active Pending
- 2002-02-28 DE DE50200713T patent/DE50200713D1/de not_active Expired - Lifetime
- 2002-02-28 MX MXPA03007685A patent/MXPA03007685A/es active IP Right Grant
- 2002-02-28 WO PCT/EP2002/002185 patent/WO2002071329A1/de active IP Right Grant
- 2002-02-28 US US10/468,158 patent/US7038128B2/en not_active Expired - Lifetime
- 2002-02-28 EP EP02719972A patent/EP1374162B1/de not_active Expired - Lifetime
- 2002-02-28 AT AT02719972T patent/ATE272239T1/de not_active IP Right Cessation
- 2002-02-28 RU RU2003128886/09A patent/RU2280279C2/ru not_active IP Right Cessation
- 2002-02-28 CN CNB028052226A patent/CN1226701C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1493058A (zh) | 2004-04-28 |
WO2002071329A1 (de) | 2002-09-12 |
US20040099745A1 (en) | 2004-05-27 |
CN1226701C (zh) | 2005-11-09 |
EP1374162B1 (de) | 2004-07-28 |
DE50200713D1 (de) | 2004-09-02 |
ATE272239T1 (de) | 2004-08-15 |
JP2004524623A (ja) | 2004-08-12 |
EP1374162A1 (de) | 2004-01-02 |
DE10109993A1 (de) | 2002-09-05 |
US7038128B2 (en) | 2006-05-02 |
RU2003128886A (ru) | 2005-03-27 |
RU2280279C2 (ru) | 2006-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |