MXPA03007652A - Materiales en lamina de superficie solida que contienen mica sintetica. - Google Patents

Materiales en lamina de superficie solida que contienen mica sintetica.

Info

Publication number
MXPA03007652A
MXPA03007652A MXPA03007652A MXPA03007652A MXPA03007652A MX PA03007652 A MXPA03007652 A MX PA03007652A MX PA03007652 A MXPA03007652 A MX PA03007652A MX PA03007652 A MXPA03007652 A MX PA03007652A MX PA03007652 A MXPA03007652 A MX PA03007652A
Authority
MX
Mexico
Prior art keywords
solid surface
sheet materials
surface sheet
materials containing
synthetic mica
Prior art date
Application number
MXPA03007652A
Other languages
English (en)
Inventor
Laura Anne Mccumber
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of MXPA03007652A publication Critical patent/MXPA03007652A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
MXPA03007652A 2001-02-27 2002-02-27 Materiales en lamina de superficie solida que contienen mica sintetica. MXPA03007652A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/794,812 US6515060B2 (en) 2001-02-27 2001-02-27 Solid surface sheet materials containing synthetic mica
PCT/US2002/006072 WO2002068514A2 (en) 2001-02-27 2002-02-27 Solid surface sheet materials containing synthetic mica

Publications (1)

Publication Number Publication Date
MXPA03007652A true MXPA03007652A (es) 2003-12-04

Family

ID=25163752

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA03007652A MXPA03007652A (es) 2001-02-27 2002-02-27 Materiales en lamina de superficie solida que contienen mica sintetica.

Country Status (10)

Country Link
US (1) US6515060B2 (es)
EP (1) EP1368417A2 (es)
JP (1) JP4037758B2 (es)
KR (1) KR20030080037A (es)
AU (1) AU2002254058B2 (es)
BR (1) BR0207622A (es)
CA (1) CA2432951A1 (es)
MX (1) MXPA03007652A (es)
NZ (1) NZ526889A (es)
WO (1) WO2002068514A2 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080264303A1 (en) * 2007-04-24 2008-10-30 The Diller Corporation Solid surface product containing oriented reflective particles and method of making same
US20080274343A1 (en) * 2007-05-01 2008-11-06 The Diller Corporation Thick solid surface laminate product and method of making same
US8114924B2 (en) * 2008-02-21 2012-02-14 E. I. Du Pont De Nemours And Company Pearlescent slurry concentrate for acrylic sheet
WO2023133021A1 (en) * 2022-01-10 2023-07-13 Dupont Safety & Construction Method for producing electrical circuitry on filled organic polymers

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3600490A (en) 1969-07-23 1971-08-17 Du Pont Process of forming a ripple-free structure from a polymerizable material that shrinks upon polymerization
US3570056A (en) 1969-07-24 1971-03-16 Du Pont Multi-colored plastic building product and its manufacture
US3847865A (en) 1972-04-28 1974-11-12 Du Pont Use of alumina trihydrate in a polymethyl methacrylate article
US4406662A (en) * 1982-03-05 1983-09-27 E. I. Du Pont De Nemours And Company Heat transfer printing on a filled polymethyl methacrylate article
US4413089A (en) 1982-03-10 1983-11-01 E. I. Du Pont De Nemours And Company Use of iron oxide pigments in a polymethyl methacrylate article
US4480060A (en) 1983-01-27 1984-10-30 Corning Glass Works Mica-resin composite material
WO1988005453A1 (en) 1987-01-26 1988-07-28 Shiseido Company Ltd. Synthetic mica powder, process for its production, and cosmetics containing said synthetic mica powder
JPH0720652B2 (ja) * 1988-03-24 1995-03-08 株式会社クラレ 真珠光沢を有するアクリル樹脂押出板およびその製造方法
JPH0693161A (ja) * 1992-06-18 1994-04-05 Sakamoto Yakuhin Kogyo Kk 石目調射出成形材料
US5741355A (en) * 1995-01-27 1998-04-21 Topy Industries, Limited Pearlescent pigment, and paint composition, cosmetic material, ink and plastics blended with the new pearlescent pigment
CA2251893C (en) * 1997-02-17 2007-05-01 Doppel Co., Ltd. Noctilucent or fluorescent artificial stone
US6040045A (en) 1997-02-28 2000-03-21 Formica Corporation Particle filled resinous product of improved appearance
US5947804A (en) 1998-04-27 1999-09-07 Ryobi North America, Inc. Adjustable eccentricity orbital tool

Also Published As

Publication number Publication date
BR0207622A (pt) 2004-01-13
NZ526889A (en) 2005-02-25
US6515060B2 (en) 2003-02-04
WO2002068514A2 (en) 2002-09-06
AU2002254058B2 (en) 2006-06-08
CA2432951A1 (en) 2002-09-06
WO2002068514A3 (en) 2003-01-09
JP4037758B2 (ja) 2008-01-23
JP2004524406A (ja) 2004-08-12
EP1368417A2 (en) 2003-12-10
US20020161094A1 (en) 2002-10-31
KR20030080037A (ko) 2003-10-10

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Legal Events

Date Code Title Description
FA Abandonment or withdrawal