MXPA03004420A - Mitigacion de interferencia a traves de materiales de compuestos termoplasticos conductores. - Google Patents
Mitigacion de interferencia a traves de materiales de compuestos termoplasticos conductores.Info
- Publication number
- MXPA03004420A MXPA03004420A MXPA03004420A MXPA03004420A MXPA03004420A MX PA03004420 A MXPA03004420 A MX PA03004420A MX PA03004420 A MXPA03004420 A MX PA03004420A MX PA03004420 A MXPA03004420 A MX PA03004420A MX PA03004420 A MXPA03004420 A MX PA03004420A
- Authority
- MX
- Mexico
- Prior art keywords
- interference mitigation
- composite materials
- thermoplastic composite
- conductive thermoplastic
- cal
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title abstract 2
- 230000000116 mitigating effect Effects 0.000 title abstract 2
- 229920001169 thermoplastic Polymers 0.000 title 1
- 239000004416 thermosoftening plastic Substances 0.000 title 1
- 230000005670 electromagnetic radiation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0029—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials intermixed with electro-conductive particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/1355—Elemental metal containing [e.g., substrate, foil, film, coating, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
- Silicon Polymers (AREA)
- Laminated Bodies (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71736800A | 2000-11-20 | 2000-11-20 | |
| PCT/US2001/043624 WO2002043456A2 (en) | 2000-11-20 | 2001-11-20 | Interference mitigation through conductive thermoplastic composite materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MXPA03004420A true MXPA03004420A (es) | 2003-09-04 |
Family
ID=24881745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MXPA03004420A MXPA03004420A (es) | 2000-11-20 | 2001-11-20 | Mitigacion de interferencia a traves de materiales de compuestos termoplasticos conductores. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6866908B2 (es) |
| EP (1) | EP1352552B1 (es) |
| AT (1) | ATE315888T1 (es) |
| AU (1) | AU2002230453A1 (es) |
| CA (1) | CA2426548C (es) |
| DE (1) | DE60116666T2 (es) |
| DK (1) | DK1352552T3 (es) |
| MX (1) | MXPA03004420A (es) |
| WO (1) | WO2002043456A2 (es) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050025919A1 (en) * | 2001-02-15 | 2005-02-03 | Integral Technologies, Inc. | Low cost conductive containers manufactured from conductive loaded resin-based materials |
| US7459642B2 (en) * | 2002-09-30 | 2008-12-02 | Teradyne, Inc. | RIM slot filler module and method of manufacturing the same |
| WO2004075616A1 (en) * | 2003-02-13 | 2004-09-02 | Parker-Hannifin Corporation | Combination metal and plastic emi shield |
| US7326862B2 (en) * | 2003-02-13 | 2008-02-05 | Parker-Hannifin Corporation | Combination metal and plastic EMI shield |
| WO2005022603A2 (en) * | 2003-09-02 | 2005-03-10 | Integral Technologies, Inc. | Low cost conductive containers manufactured from conductive loaded resin-based materials |
| JP2006087523A (ja) * | 2004-09-21 | 2006-04-06 | Olympus Corp | 電子装置および被検体内導入システム |
| US20070012481A1 (en) * | 2005-07-18 | 2007-01-18 | Helmut Prager | Circuit board/envelope compound structure |
| US20070046408A1 (en) * | 2005-08-30 | 2007-03-01 | Youngtack Shim | Magnet-shunted systems and methods |
| US7189335B1 (en) * | 2005-08-31 | 2007-03-13 | Honeywell International Inc. | Conformal coverings for electronic devices |
| KR101329425B1 (ko) | 2006-03-31 | 2013-11-14 | 파커-한니핀 코포레이션 | 전기 전도성 물품 |
| US8999764B2 (en) | 2007-08-10 | 2015-04-07 | International Business Machines Corporation | Ionizing radiation blocking in IC chip to reduce soft errors |
| US7609530B2 (en) | 2007-11-08 | 2009-10-27 | Delphi Technologies, Inc. | Conductive elastomeric shielding device and method of forming same |
| WO2010102280A2 (en) * | 2009-03-06 | 2010-09-10 | Saint-Gobain Performance Plastics Corporation | Overlap helical conductive spring |
| US9148497B2 (en) * | 2009-04-22 | 2015-09-29 | Nokia Technologies Oy | Display with improved electromagnetic compatibility characteristics |
| US8138864B2 (en) * | 2009-06-01 | 2012-03-20 | Eaton Corporation | Circuit interrupter including a molded case made of liquid crystal polymer |
| US9293420B2 (en) * | 2009-06-29 | 2016-03-22 | Cypress Semiconductor Corporation | Electronic device having a molding compound including a composite material |
| JP2013504895A (ja) * | 2009-10-02 | 2013-02-07 | サン−ゴバン パフォーマンス プラスティックス コーポレイション | モジュール式ポリマーｅｍｉ／ｒｆｉシール |
| TW201218731A (en) * | 2010-10-28 | 2012-05-01 | Hon Hai Prec Ind Co Ltd | Mobile phone with metal hinge |
| US8885360B2 (en) * | 2011-11-30 | 2014-11-11 | Lear Corporation | Charger assembly and electromagnetic interference shield assembly |
| US9035597B2 (en) | 2011-11-30 | 2015-05-19 | Lear Corporation | Charger assembly with heat transfer duct |
| US8742255B2 (en) | 2011-11-30 | 2014-06-03 | Lear Corporation | Housing assembly to enclose and ground an electrical subassembly |
| CN103367331B (zh) * | 2012-03-27 | 2016-12-14 | 南亚科技股份有限公司 | 封装结构 |
| US8946663B2 (en) | 2012-05-15 | 2015-02-03 | Spansion Llc | Soft error resistant circuitry |
| US9357683B2 (en) | 2014-09-26 | 2016-05-31 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam |
| US11229147B2 (en) | 2015-02-06 | 2022-01-18 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide |
| US10157855B2 (en) * | 2015-06-03 | 2018-12-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor device including electric and magnetic field shielding |
| US9836095B1 (en) * | 2016-09-30 | 2017-12-05 | Intel Corporation | Microelectronic device package electromagnetic shield |
| US11056441B2 (en) | 2019-12-05 | 2021-07-06 | Apple Inc. | Electromagnetic shielding of compact electronic modules |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4575578A (en) * | 1983-01-05 | 1986-03-11 | Keene Corporation | Radiation shielding and thermally conductive gasket with internal bonding agent |
| US5639989A (en) * | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
| US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
| US5998867A (en) * | 1996-02-23 | 1999-12-07 | Honeywell Inc. | Radiation enhanced chip encapsulant |
| US5761053A (en) * | 1996-05-08 | 1998-06-02 | W. L. Gore & Associates, Inc. | Faraday cage |
| AU5777598A (en) * | 1997-01-30 | 1998-08-25 | Space Electronics, Inc. | Methods and compositions for ionizing radiation shielding |
| US5867371A (en) * | 1997-09-29 | 1999-02-02 | Ericsson Inc. | Cover member for sealed circuit board assembly |
| SE9800488L (sv) * | 1998-02-19 | 1999-08-20 | Nolato Silikonteknik Ab | Skärmning |
| US6384128B1 (en) * | 2000-07-19 | 2002-05-07 | Toray Industries, Inc. | Thermoplastic resin composition, molding material, and molded article thereof |
-
2001
- 2001-11-20 DE DE60116666T patent/DE60116666T2/de not_active Expired - Lifetime
- 2001-11-20 AU AU2002230453A patent/AU2002230453A1/en not_active Abandoned
- 2001-11-20 EP EP01990688A patent/EP1352552B1/en not_active Expired - Lifetime
- 2001-11-20 WO PCT/US2001/043624 patent/WO2002043456A2/en not_active Application Discontinuation
- 2001-11-20 DK DK01990688T patent/DK1352552T3/da active
- 2001-11-20 CA CA2426548A patent/CA2426548C/en not_active Expired - Fee Related
- 2001-11-20 AT AT01990688T patent/ATE315888T1/de not_active IP Right Cessation
- 2001-11-20 MX MXPA03004420A patent/MXPA03004420A/es active IP Right Grant
-
2003
- 2003-03-12 US US10/387,808 patent/US6866908B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6866908B2 (en) | 2005-03-15 |
| WO2002043456A2 (en) | 2002-05-30 |
| DE60116666T2 (de) | 2006-11-16 |
| CA2426548C (en) | 2010-01-26 |
| EP1352552B1 (en) | 2006-01-11 |
| CA2426548A1 (en) | 2002-05-30 |
| AU2002230453A1 (en) | 2002-06-03 |
| WO2002043456A3 (en) | 2003-05-22 |
| DK1352552T3 (da) | 2006-03-06 |
| DE60116666D1 (de) | 2006-04-06 |
| EP1352552A2 (en) | 2003-10-15 |
| ATE315888T1 (de) | 2006-02-15 |
| US20030175454A1 (en) | 2003-09-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |