MX9708509A - Procesador termico para plaquitas semiconductoras. - Google Patents
Procesador termico para plaquitas semiconductoras.Info
- Publication number
- MX9708509A MX9708509A MX9708509A MX9708509A MX9708509A MX 9708509 A MX9708509 A MX 9708509A MX 9708509 A MX9708509 A MX 9708509A MX 9708509 A MX9708509 A MX 9708509A MX 9708509 A MX9708509 A MX 9708509A
- Authority
- MX
- Mexico
- Prior art keywords
- reactor chamber
- coating
- semiconductor wafer
- thermal processor
- nanometers
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 235000012431 wafers Nutrition 0.000 title 1
- 239000011248 coating agent Substances 0.000 abstract 4
- 238000000576 coating method Methods 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 2
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 229910001507 metal halide Inorganic materials 0.000 abstract 1
- 150000005309 metal halides Chemical class 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
Abstract
Un procesador térmico para por lo menos una plaquita semiconductora que incluye una cámara de reactor que tiene un material substancialmente transparente a la luz que incluye una longitud de onda dentro de la escala de aproximadamente 200 nanometros hasta aproximadamente 800 nanometros para sostener por lo menos una plaquita semiconductora. Un recubrimiento que incluye un material substancialmente reflejante de radiacion infrarroja puede estar presente sobre por lo menos una porcion de la cámara de reactor. Una fuente de luz proporciona energía radiante hacia por lo menos una plaquita semiconductora a través del recubrimiento y la cámara de reactor. La fuente de luz puede incluir una lámpara de descarga ultravioleta, una lámpara incandescente infrarroja de halogeno o, una lámpara de descarga visible de haluro metálico. El recubrimiento puede esta situado sobre una superficie interna o externa de la cámara de reactor. Si la cámara de reactor tiene paredes internas y externas, el recubrimiento puede estar colocada sobre la pared interna o la pared externa.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/743,587 US6067931A (en) | 1996-11-04 | 1996-11-04 | Thermal processor for semiconductor wafers |
US08743587 | 1996-11-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
MX9708509A true MX9708509A (es) | 1998-05-31 |
MXPA97008509A MXPA97008509A (es) | 1998-10-23 |
Family
ID=
Also Published As
Publication number | Publication date |
---|---|
US6067931A (en) | 2000-05-30 |
IL122034A0 (en) | 1998-03-10 |
KR19980041866A (ko) | 1998-08-17 |
CA2216464A1 (en) | 1998-05-04 |
EP0840359A2 (en) | 1998-05-06 |
JPH10256171A (ja) | 1998-09-25 |
TW457594B (en) | 2001-10-01 |
SG55398A1 (en) | 1998-12-21 |
RU2185682C2 (ru) | 2002-07-20 |
IL122034A (en) | 2001-05-20 |
EP0840359A3 (en) | 2002-04-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration | ||
MM | Annulment or lapse due to non-payment of fees |