MX9602682A - Metodo para encapsular un componente electronico, componente electronico adecuado para uso en realizar el metodo y componente encapsulado obtenido usando el metodo. - Google Patents

Metodo para encapsular un componente electronico, componente electronico adecuado para uso en realizar el metodo y componente encapsulado obtenido usando el metodo.

Info

Publication number
MX9602682A
MX9602682A MX9602682A MX9602682A MX9602682A MX 9602682 A MX9602682 A MX 9602682A MX 9602682 A MX9602682 A MX 9602682A MX 9602682 A MX9602682 A MX 9602682A MX 9602682 A MX9602682 A MX 9602682A
Authority
MX
Mexico
Prior art keywords
electronic component
encapsulating
obtained therefrom
tbf
ttf
Prior art date
Application number
MX9602682A
Other languages
English (en)
Inventor
Ireneus Johannes Theodorus Pas
Eltjo Vos
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Publication of MX9602682A publication Critical patent/MX9602682A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

Método para encapsular, en un molde, un componente electronico que tiene un numero de elementos de conexion alargados que se proyectan lateralmente situados uno enseguida del otro en un plano, estos elementos de conexion están sin una conexion metálica a través y tienen una cierta inclinacion mutua (PL), ancho (WL) y altura (TL), y con la insercion de dos películas, cada película tiene un espesor predeterminado, (TTF o TBF, respectivamente), se usa una película deformable y la encapsulacion se lleva a cabo bajo condiciones que son tales que, durante el proceso, se cumple la condicion: C . TL - { 1 - WL/PL } <- ( TTF + TBF) en la posicion de las orillas de abrazadera de sujecion de las partes de matriz, en donde C 2.5.
MX9602682A 1995-07-11 1996-07-09 Metodo para encapsular un componente electronico, componente electronico adecuado para uso en realizar el metodo y componente encapsulado obtenido usando el metodo. MX9602682A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1000777A NL1000777C2 (nl) 1995-07-11 1995-07-11 Werkwijze voor het inkapselen van een elektronische component, elektronische component geschikt te worden toegepast bij het uitvoeren van deze werkwijze en ingekapselde component verkregen onder toepassing der werkwijze.

Publications (1)

Publication Number Publication Date
MX9602682A true MX9602682A (es) 1997-06-28

Family

ID=19761297

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9602682A MX9602682A (es) 1995-07-11 1996-07-09 Metodo para encapsular un componente electronico, componente electronico adecuado para uso en realizar el metodo y componente encapsulado obtenido usando el metodo.

Country Status (7)

Country Link
EP (1) EP0753888A3 (es)
JP (1) JPH0936154A (es)
KR (1) KR970008502A (es)
CA (1) CA2180595A1 (es)
MX (1) MX9602682A (es)
NL (1) NL1000777C2 (es)
SG (1) SG55213A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1024248C2 (nl) * 2003-09-09 2005-03-10 Fico Bv Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten.

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2030271A1 (de) * 1969-06-25 1971-01-14 U.S. Electronic Services Corp. Isolierkörper mit eingebeten Zuleitungen für Mikroschaltkreise
US3754070A (en) * 1970-08-03 1973-08-21 Motorola Inc Flash free molding
US4504427A (en) * 1983-06-17 1985-03-12 At&T Bell Laboratories Solder preform stabilization for lead frames
US5106784A (en) * 1987-04-16 1992-04-21 Texas Instruments Incorporated Method of making a post molded cavity package with internal dam bar for integrated circuit
FR2667441B1 (fr) * 1990-09-27 1997-03-28 Sgs Thomson Microelectronics Procede de moulage pour boitiers de circuit integre et moule.
US5118271A (en) * 1991-02-22 1992-06-02 Motorola, Inc. Apparatus for encapsulating a semiconductor device
NL9400119A (nl) * 1994-01-27 1995-09-01 3P Licensing Bv Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.

Also Published As

Publication number Publication date
SG55213A1 (en) 1998-12-21
EP0753888A3 (en) 1997-07-09
KR970008502A (ko) 1997-02-24
CA2180595A1 (en) 1997-01-12
EP0753888A2 (en) 1997-01-15
NL1000777C2 (nl) 1997-01-14
JPH0936154A (ja) 1997-02-07

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