MX385692B - Carcasa para un componente electrónico, en particular un chip semiconductor. - Google Patents

Carcasa para un componente electrónico, en particular un chip semiconductor.

Info

Publication number
MX385692B
MX385692B MX2019003941A MX2019003941A MX385692B MX 385692 B MX385692 B MX 385692B MX 2019003941 A MX2019003941 A MX 2019003941A MX 2019003941 A MX2019003941 A MX 2019003941A MX 385692 B MX385692 B MX 385692B
Authority
MX
Mexico
Prior art keywords
housing
cover
base
electronic component
semiconductor chip
Prior art date
Application number
MX2019003941A
Other languages
English (en)
Other versions
MX2019003941A (es
Inventor
Dietmar Kurzeja
Original Assignee
Possehl Electronics Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE202016006195.0U external-priority patent/DE202016006195U1/de
Priority claimed from DE102016011934.9A external-priority patent/DE102016011934A1/de
Application filed by Possehl Electronics Deutschland Gmbh filed Critical Possehl Electronics Deutschland Gmbh
Publication of MX2019003941A publication Critical patent/MX2019003941A/es
Publication of MX385692B publication Critical patent/MX385692B/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

La invención se refiere a una carcasa para acomodar un componente electrónico (B) de un ensamblaje electrónico (100, 100a-100e), en donde la carcasa (1) tiene una base (10) y una cubierta (20), en donde la base 810) y la cubierta (20) están conectadas entre sí a través de un elemento de bisagra (30) y la base (10) y la cubierta (20) de la carcasa (1) se pueden doblar juntas por medio del elemento de bisagra (30). De acuerdo con la invención, se establece que al menos un marco de conexión (4) que tiene carriles conductores (5; 5a; 5b; 5c) esté acomodado en la carcasa (1), en donde al menos un carril conductor (5) del marco de conexión (4) está acomodado en la base (10) de la carcasa (1) y al menos un carril conductor adicional (5a; 5b; 5c) está acomodado en la cubierta (20) de la carcasa (1), y en donde al menos un carril conductor adicional (5a; 5b; 5c) se extiende iniciando desde la base (10) de la carcasa (1), a través del elemento de bisagra (30), a la cubierta (20) de la carcasa (1).
MX2019003941A 2016-10-06 2017-10-06 Carcasa para un componente electrónico, en particular un chip semiconductor. MX385692B (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202016006195.0U DE202016006195U1 (de) 2016-10-06 2016-10-06 Gehäuse für ein elektronisches Bauteil, insbesondere einen Halbleiter-Chip
DE102016011934.9A DE102016011934A1 (de) 2016-10-06 2016-10-06 Gehäuse für ein elektronisches Bauteil, insbesondere einen Halbleiter-Chip
PCT/EP2017/025302 WO2018065121A1 (de) 2016-10-06 2017-10-06 Gehäuse für ein elektronisches bauteil, insbesondere einen halbleiter-chip

Publications (2)

Publication Number Publication Date
MX2019003941A MX2019003941A (es) 2019-06-10
MX385692B true MX385692B (es) 2025-03-18

Family

ID=60201497

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019003941A MX385692B (es) 2016-10-06 2017-10-06 Carcasa para un componente electrónico, en particular un chip semiconductor.

Country Status (6)

Country Link
US (1) US10903160B2 (es)
EP (1) EP3523824B1 (es)
CN (1) CN109863595B (es)
ES (1) ES2881235T3 (es)
MX (1) MX385692B (es)
WO (1) WO2018065121A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113747695B (zh) * 2020-05-27 2023-02-28 台达电子工业股份有限公司 电子装置及其绝缘片
CN113410180A (zh) * 2021-07-06 2021-09-17 西安电子科技大学芜湖研究院 一种可开帽碳化硅功率器件封装外壳

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3813435A1 (de) 1988-04-21 1989-11-02 Siemens Ag Bauelement in chip-bauweise zum befestigen auf einer schaltplatte, mit einem elektrischen oder elektronischen funktionskoerper
JP2751518B2 (ja) * 1990-01-25 1998-05-18 日本電気株式会社 半導体素子の実装方法
NO911774D0 (no) 1991-05-06 1991-05-06 Sensonor As Anordning ved innkapsling av et funksjonsorgan, samt fremgangsmaate for fremstilling av samme.
DE19800928B4 (de) * 1997-10-07 2009-05-07 Pac Tech-Packaging Technologies Gmbh Gehäuse, insbesondere stapelbares Gehäuse, zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung
US6300679B1 (en) * 1998-06-01 2001-10-09 Semiconductor Components Industries, Llc Flexible substrate for packaging a semiconductor component
JP3882471B2 (ja) 2000-06-20 2007-02-14 セイコーエプソン株式会社 半導体装置
JP2002237568A (ja) * 2000-12-28 2002-08-23 Texas Instr Inc <Ti> 基板上垂直組立体用の折り曲げた相互接続体上にスタックしたチップスケールパッケージ
US7358444B2 (en) 2004-10-13 2008-04-15 Intel Corporation Folded substrate with interposer package for integrated circuit devices
CN101395715B (zh) 2006-03-07 2010-10-13 日本电气株式会社 电子器件封装、模块以及电子器件
DE102014203306A1 (de) * 2014-02-25 2015-08-27 Siemens Aktiengesellschaft Herstellen eines Elektronikmoduls

Also Published As

Publication number Publication date
EP3523824A1 (de) 2019-08-14
WO2018065121A1 (de) 2018-04-12
EP3523824B1 (de) 2021-05-05
WO2018065121A9 (de) 2018-07-19
CN109863595A (zh) 2019-06-07
CN109863595B (zh) 2023-07-18
ES2881235T3 (es) 2021-11-29
MX2019003941A (es) 2019-06-10
US10903160B2 (en) 2021-01-26
US20190229041A1 (en) 2019-07-25

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