MX2021016072A - Composición de resina y celdas de flujo que las incorporan. - Google Patents

Composición de resina y celdas de flujo que las incorporan.

Info

Publication number
MX2021016072A
MX2021016072A MX2021016072A MX2021016072A MX2021016072A MX 2021016072 A MX2021016072 A MX 2021016072A MX 2021016072 A MX2021016072 A MX 2021016072A MX 2021016072 A MX2021016072 A MX 2021016072A MX 2021016072 A MX2021016072 A MX 2021016072A
Authority
MX
Mexico
Prior art keywords
photoacid generator
resin composition
same
flow cells
cells incorporating
Prior art date
Application number
MX2021016072A
Other languages
English (en)
Inventor
Yekaterina Rokhlenko
Timothy J Merkel
Original Assignee
Illumina Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illumina Inc filed Critical Illumina Inc
Publication of MX2021016072A publication Critical patent/MX2021016072A/es

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G03F7/0217—Polyurethanes; Epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03—Cuvette constructions
    • G01N21/05—Flow-through cuvettes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6428—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Una composición de resina ilustrativa incluye una matriz de resina epoxídica, un primer generador de fotoácidos, y un segundo generador de fotoácidos. El primer generador de fotoácidos incluye un anión que tiene un peso molecular menor que aproximadamente 250 g/mol. El segundo generador de fotoácidos incluye un anión que tiene un peso molecular mayor que aproximadamente 300 g/mol. En un ejemplo, i) un catión del primer generador de fotoácidos tiene, 0 ii) un catión del segundo generador de fotoácidos tiene, 0 iii) los cationes del primer y segundo generadores de fotoácidos tienen un coeficiente de atenuación de masa de al menos 0.1 l/(g*cm) a una longitud de onda de luz incidente para curar la composición de resina.
MX2021016072A 2019-12-23 2020-12-21 Composición de resina y celdas de flujo que las incorporan. MX2021016072A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962952821P 2019-12-23 2019-12-23
PCT/US2020/066438 WO2021133735A1 (en) 2019-12-23 2020-12-21 Resin composition and flow cells incorporating the same

Publications (1)

Publication Number Publication Date
MX2021016072A true MX2021016072A (es) 2022-04-01

Family

ID=74191935

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021016072A MX2021016072A (es) 2019-12-23 2020-12-21 Composición de resina y celdas de flujo que las incorporan.

Country Status (11)

Country Link
US (1) US20220404699A1 (es)
EP (1) EP4081862A1 (es)
JP (1) JP2023508801A (es)
KR (1) KR20220120448A (es)
CN (1) CN114207519A (es)
AU (1) AU2020412469A1 (es)
BR (1) BR112021026677A2 (es)
CA (1) CA3144766A1 (es)
IL (1) IL289319A (es)
MX (1) MX2021016072A (es)
WO (1) WO2021133735A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230042267A1 (en) * 2021-07-02 2023-02-09 Illumina, Inc. Flow cells
CN117813553A (zh) * 2021-09-24 2024-04-02 因美纳有限公司 可固化树脂组合物
AU2022351372A1 (en) * 2021-09-24 2024-01-18 Illumina, Inc. Curable resin compositions
WO2024119441A1 (en) * 2022-12-08 2024-06-13 Henkel Ag & Co. Kgaa Radiation-curable adhesive composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040234898A1 (en) * 2002-02-06 2004-11-25 Batishko Charles R. Magnetic flowcell systems and methods
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
CN102597116B (zh) * 2009-07-21 2013-12-11 3M创新有限公司 可固化组合物、涂覆底片的方法、以及被涂覆的底片
EP2530098A4 (en) * 2010-01-26 2015-09-09 Nissan Chemical Ind Ltd HARDENABLE EPOXY RESIN COMPOSITION WITH LOW-CHAIN ALKYLENE
RU2495468C1 (ru) * 2010-02-05 2013-10-10 Кэнон Кабусики Кайся Негативная фоточувствительная полимерная композиция, способ формирования паттерна и головка для выбрасывания жидкости
JP5473645B2 (ja) * 2010-02-05 2014-04-16 キヤノン株式会社 感光性樹脂組成物及び液体吐出ヘッド
US20120040288A1 (en) * 2010-08-11 2012-02-16 Microchem Corp. Epoxy formulations with controllable photospeed
CN109844638B (zh) * 2016-09-27 2024-03-15 伊鲁米那股份有限公司 压印基板

Also Published As

Publication number Publication date
AU2020412469A1 (en) 2022-01-06
EP4081862A1 (en) 2022-11-02
US20220404699A1 (en) 2022-12-22
CN114207519A (zh) 2022-03-18
IL289319A (en) 2022-02-01
BR112021026677A2 (pt) 2022-07-05
KR20220120448A (ko) 2022-08-30
WO2021133735A1 (en) 2021-07-01
CA3144766A1 (en) 2021-07-01
JP2023508801A (ja) 2023-03-06

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