MX2018013328A - Materiales de fosforo para fuentes de luz y metodo para fluidizar los mismos. - Google Patents
Materiales de fosforo para fuentes de luz y metodo para fluidizar los mismos.Info
- Publication number
- MX2018013328A MX2018013328A MX2018013328A MX2018013328A MX2018013328A MX 2018013328 A MX2018013328 A MX 2018013328A MX 2018013328 A MX2018013328 A MX 2018013328A MX 2018013328 A MX2018013328 A MX 2018013328A MX 2018013328 A MX2018013328 A MX 2018013328A
- Authority
- MX
- Mexico
- Prior art keywords
- fluidizing
- pfs
- same
- light sources
- phosphor materials
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title abstract 3
- 239000000463 material Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 abstract 3
- 238000005243 fluidization Methods 0.000 abstract 2
- 239000000843 powder Substances 0.000 abstract 2
- -1 potassium hexafluorosilicate Chemical compound 0.000 abstract 1
- 239000012260 resinous material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/22—Luminous paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/80—Processes for incorporating ingredients
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
- C09K11/617—Silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/20—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Inorganic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Optical Filters (AREA)
Abstract
Un método incluye obtener un polvo a base de hexafluorosilicato de potasio (PFS), obtener un material de fluidización y mezclar el polvo a base de PFS con el material de fluidización para formar una mezcla a base de PFS; la mezcla a base de PFS está configurada para ser mezclada con un material resinoso para formar una mezcla de fósforo fluida configurada para ser colocada sobre una fuente de luz para formar un fósforo sobre la fuente de luz.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662330401P | 2016-05-02 | 2016-05-02 | |
US15/374,087 US10883045B2 (en) | 2016-05-02 | 2016-12-09 | Phosphor materials including fluidization materials for light sources |
PCT/US2017/029534 WO2017192322A1 (en) | 2016-05-02 | 2017-04-26 | Phosphor materials for light sources and method for fluidizing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2018013328A true MX2018013328A (es) | 2019-02-28 |
Family
ID=60157894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2018013328A MX2018013328A (es) | 2016-05-02 | 2017-04-26 | Materiales de fosforo para fuentes de luz y metodo para fluidizar los mismos. |
Country Status (10)
Country | Link |
---|---|
US (1) | US10883045B2 (es) |
JP (1) | JP7244277B2 (es) |
KR (1) | KR102379088B1 (es) |
CN (1) | CN109072074A (es) |
CA (1) | CA3021557A1 (es) |
DE (1) | DE112017002296T5 (es) |
MX (1) | MX2018013328A (es) |
MY (1) | MY186678A (es) |
TW (1) | TWI775752B (es) |
WO (1) | WO2017192322A1 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020019921A (ja) | 2018-02-06 | 2020-02-06 | 信越化学工業株式会社 | 蛍光体粒子 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040166234A1 (en) * | 2003-02-26 | 2004-08-26 | Chua Bee Yin Janet | Apparatus and method for coating a light source to provide a modified output spectrum |
US7857994B2 (en) * | 2007-05-30 | 2010-12-28 | GE Lighting Solutions, LLC | Green emitting phosphors and blends thereof |
JP5374857B2 (ja) * | 2007-10-23 | 2013-12-25 | 三菱化学株式会社 | 蛍光体含有組成物の製造方法、及び半導体発光デバイスの製造方法 |
US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
JP2011181793A (ja) * | 2010-03-03 | 2011-09-15 | Koito Mfg Co Ltd | 発光装置 |
JP5512888B2 (ja) * | 2010-06-29 | 2014-06-04 | クーレッジ ライティング インコーポレイテッド | 柔軟な基板を有する電子素子 |
JP2013135084A (ja) * | 2011-12-26 | 2013-07-08 | Nitto Denko Corp | 発光ダイオード装置の製造方法 |
RU2613963C2 (ru) | 2012-02-16 | 2017-03-22 | Конинклейке Филипс Н.В. | Имеющие покрытие фторсиликаты, излучающие красный узкополосный свет, для полупроводниковых светоизлучающих устройств |
JP2013211250A (ja) | 2012-02-27 | 2013-10-10 | Mitsubishi Chemicals Corp | 波長変換部材及びこれを用いた半導体発光装置 |
WO2013138347A1 (en) * | 2012-03-12 | 2013-09-19 | Nitto Denko Corporation | Emissive compacts and method of making the same |
US8933478B2 (en) * | 2013-02-19 | 2015-01-13 | Cooledge Lighting Inc. | Engineered-phosphor LED packages and related methods |
JP2014177511A (ja) * | 2013-03-13 | 2014-09-25 | Toshiba Corp | 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置 |
US9698314B2 (en) * | 2013-03-15 | 2017-07-04 | General Electric Company | Color stable red-emitting phosphors |
JP2014177586A (ja) * | 2013-03-15 | 2014-09-25 | Toshiba Corp | 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置 |
KR20150002361A (ko) * | 2013-06-28 | 2015-01-07 | 삼성전자주식회사 | 반도체 발광소자 장치 및 광원 모듈의 제조 방법 |
JPWO2015056590A1 (ja) * | 2013-10-15 | 2017-03-09 | シャープ株式会社 | 実装基板、発光装置及び発光装置の製造方法 |
WO2015056525A1 (ja) | 2013-10-18 | 2015-04-23 | シャープ株式会社 | 発光装置 |
US20150123153A1 (en) * | 2013-11-06 | 2015-05-07 | General Electric Company | Led package with red-emitting phosphors |
AU2014374223B2 (en) * | 2013-12-30 | 2018-01-04 | Current Lightning Solutions, LLC | Moisture-resistant phosphor compositions and associate methods |
JP5804149B2 (ja) * | 2014-01-30 | 2015-11-04 | 信越化学工業株式会社 | 複フッ化物蛍光体の製造方法及び処理方法 |
US9546318B2 (en) * | 2014-05-01 | 2017-01-17 | General Electric Company | Process for preparing red-emitting phosphors |
US10345688B2 (en) * | 2017-04-18 | 2019-07-09 | Unique Materials Co., Ltd. | Light emitting apparatus using composite material |
-
2016
- 2016-12-09 US US15/374,087 patent/US10883045B2/en active Active
-
2017
- 2017-04-26 WO PCT/US2017/029534 patent/WO2017192322A1/en active Application Filing
- 2017-04-26 DE DE112017002296.7T patent/DE112017002296T5/de active Pending
- 2017-04-26 CN CN201780027462.4A patent/CN109072074A/zh active Pending
- 2017-04-26 MX MX2018013328A patent/MX2018013328A/es unknown
- 2017-04-26 CA CA3021557A patent/CA3021557A1/en active Pending
- 2017-04-26 MY MYPI2018703719A patent/MY186678A/en unknown
- 2017-04-26 KR KR1020187034565A patent/KR102379088B1/ko active IP Right Grant
- 2017-04-26 JP JP2018557420A patent/JP7244277B2/ja active Active
- 2017-05-02 TW TW106114459A patent/TWI775752B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP7244277B2 (ja) | 2023-03-22 |
WO2017192322A1 (en) | 2017-11-09 |
US20170313937A1 (en) | 2017-11-02 |
TWI775752B (zh) | 2022-09-01 |
KR20190004738A (ko) | 2019-01-14 |
DE112017002296T5 (de) | 2019-03-28 |
TW201816081A (zh) | 2018-05-01 |
CA3021557A1 (en) | 2017-11-09 |
JP2019526063A (ja) | 2019-09-12 |
CN109072074A (zh) | 2018-12-21 |
US10883045B2 (en) | 2021-01-05 |
KR102379088B1 (ko) | 2022-03-28 |
MY186678A (en) | 2021-08-05 |
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