MX2017009453A - Composiciones que incluyen un acido de alto peso molecular adecuado para la formacion de polimero conductor sobre sustratos dielectricos. - Google Patents

Composiciones que incluyen un acido de alto peso molecular adecuado para la formacion de polimero conductor sobre sustratos dielectricos.

Info

Publication number
MX2017009453A
MX2017009453A MX2017009453A MX2017009453A MX2017009453A MX 2017009453 A MX2017009453 A MX 2017009453A MX 2017009453 A MX2017009453 A MX 2017009453A MX 2017009453 A MX2017009453 A MX 2017009453A MX 2017009453 A MX2017009453 A MX 2017009453A
Authority
MX
Mexico
Prior art keywords
ions
molecular weight
high molecular
conductive polymer
dielectric substrates
Prior art date
Application number
MX2017009453A
Other languages
English (en)
Inventor
Rietmann Christian
GLÖCKNER Andreas
Original Assignee
Macdermid Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Enthone Inc filed Critical Macdermid Enthone Inc
Publication of MX2017009453A publication Critical patent/MX2017009453A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La invención se refiere a una composición y un proceso para la deposición de polímeros conductores sobre sustratos dieléctricos. En particular, la invención se refiere a una composición para la formación de polímeros eléctricamente conductores en la superficie de un sustrato dieléctrico, la composición comprende al menos un monómero polimerizable que es capaz de formar un polímero conductor, un emulsificante y un ácido, en donde la composición comprende al menos un ion de metal seleccionado del grupo que consiste de iones de litio, iones de sodio, iones de aluminio, iones de berilio, iones de bismuto, iones de boro, iones de indio y iones de alquil imidazolio. El ácido es normalmente un ácido polimérico con alto peso molecular que tiene un peso molecular de al menos 500,000 Da incluyendo, por ejemplo, ácido poliestiren sulfónico con un peso molecular de aproximadamente 1,000,000 Da.
MX2017009453A 2015-01-20 2016-01-20 Composiciones que incluyen un acido de alto peso molecular adecuado para la formacion de polimero conductor sobre sustratos dielectricos. MX2017009453A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562105631P 2015-01-20 2015-01-20
PCT/IB2016/050277 WO2016116876A1 (en) 2015-01-20 2016-01-20 Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrates

Publications (1)

Publication Number Publication Date
MX2017009453A true MX2017009453A (es) 2018-01-16

Family

ID=55300734

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017009453A MX2017009453A (es) 2015-01-20 2016-01-20 Composiciones que incluyen un acido de alto peso molecular adecuado para la formacion de polimero conductor sobre sustratos dielectricos.

Country Status (8)

Country Link
US (1) US10508207B2 (es)
EP (1) EP3247752A1 (es)
JP (1) JP2018510254A (es)
CN (1) CN107969129A (es)
BR (1) BR112017015625A2 (es)
CA (1) CA2974312A1 (es)
MX (1) MX2017009453A (es)
WO (1) WO2016116876A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019098011A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
CN213522492U (zh) * 2017-11-16 2021-06-22 株式会社村田制作所 树脂多层基板、电子部件及其安装构造
CN109873197B (zh) * 2019-02-20 2021-12-14 苏州大学 一种固态锂离子电池用聚合物电解质及其制备方法
KR102545700B1 (ko) * 2020-12-08 2023-06-21 동아대학교 산학협력단 폴리스티렌설폰산 금속염, 이의 제조방법 및 이를 포함하는 조성물

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68918085T2 (de) 1988-03-03 1995-01-26 Blasberg Oberflaechentech Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.
DE4202337A1 (de) 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
JPH10303550A (ja) * 1997-04-25 1998-11-13 Hitachi Chem Co Ltd 導電性高分子膜を用いるめっきの前処理液
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
EP1897974B1 (en) 2006-09-07 2012-08-01 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
EP2447296B1 (en) 2010-10-29 2018-01-10 MacDermid Enthone Inc. Compostion and method for the deposition of conductive polymers on dielectric substrates

Also Published As

Publication number Publication date
US20190177556A9 (en) 2019-06-13
US20180002541A1 (en) 2018-01-04
CN107969129A (zh) 2018-04-27
EP3247752A1 (en) 2017-11-29
WO2016116876A1 (en) 2016-07-28
CA2974312A1 (en) 2016-07-28
JP2018510254A (ja) 2018-04-12
BR112017015625A2 (pt) 2019-11-12
US10508207B2 (en) 2019-12-17

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