MX2017006909A - Metodo para producir una parte de conexion electrica. - Google Patents

Metodo para producir una parte de conexion electrica.

Info

Publication number
MX2017006909A
MX2017006909A MX2017006909A MX2017006909A MX2017006909A MX 2017006909 A MX2017006909 A MX 2017006909A MX 2017006909 A MX2017006909 A MX 2017006909A MX 2017006909 A MX2017006909 A MX 2017006909A MX 2017006909 A MX2017006909 A MX 2017006909A
Authority
MX
Mexico
Prior art keywords
connection part
conductor
producing
electric conductor
strip
Prior art date
Application number
MX2017006909A
Other languages
English (en)
Other versions
MX367421B (es
Inventor
Lorenz Thomas
Dören Jens
Original Assignee
Auto Kabel Man Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auto Kabel Man Gmbh filed Critical Auto Kabel Man Gmbh
Publication of MX2017006909A publication Critical patent/MX2017006909A/es
Publication of MX367421B publication Critical patent/MX367421B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

La materia objeto de la invención se relaciona con un método para producir una parte de conexión eléctrica, en la cual se proporciona un conductor eléctrico (2), el conductor eléctrico (2) es galvanizado y un área de contacto (4) del conductor (2) es expuesta al remover el galvanizado (6). Un método también se especifica con la materia objeto de la invención el cual permite que un galvanizado (6) provisto en la parte de conexión (22) sea removido en una forma que es particularmente redituable y confiable. Esto se logra de acuerdo con la materia objeto de la invención al remover el galvanizado (6) en el área de contacto (4) usando una fuente radiante (8).
MX2017006909A 2014-12-04 2015-09-17 Metodo para producir una parte de conexion electrica. MX367421B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014017886.2A DE102014017886A1 (de) 2014-12-04 2014-12-04 Verfahren zum Herstellen eines elektrischen Anschlussteils
PCT/EP2015/071276 WO2016087067A1 (de) 2014-12-04 2015-09-17 Verfahren zum herstellen eines elektrischen anschlussteils

Publications (2)

Publication Number Publication Date
MX2017006909A true MX2017006909A (es) 2017-08-15
MX367421B MX367421B (es) 2019-08-21

Family

ID=54150398

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017006909A MX367421B (es) 2014-12-04 2015-09-17 Metodo para producir una parte de conexion electrica.

Country Status (7)

Country Link
US (1) US20170331212A1 (es)
EP (1) EP3227969B1 (es)
CN (1) CN107002267A (es)
DE (2) DE102014017886A1 (es)
ES (1) ES2911716T3 (es)
MX (1) MX367421B (es)
WO (1) WO2016087067A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016123472C5 (de) * 2016-12-05 2021-07-01 Lisa Dräxlmaier GmbH Verfahren und vorrichtung zum schweissen eines kontaktteils an eine leitung
DE102018114627B4 (de) * 2018-06-19 2024-02-15 Auto-Kabel Management Gmbh Verfahren und Vorrichtung zur Herstellung eines Kabels
DE102018215025A1 (de) * 2018-09-04 2020-03-05 Te Connectivity Germany Gmbh Elektrischer Kontakt zum Zusammenstecken mit einem Gegenkontakt
DE102019103614B4 (de) * 2019-02-13 2021-01-07 Bayerische Motoren Werke Aktiengesellschaft Überstromschutzvorrichtung für eine Energiespeicherzelle, Elektrode für eine Energiespeicherzelle, Energiespeicherzelle und Verfahren zur Herstellung einer Elektrode für eine Energiespeicherzelle
DE102019122591A1 (de) * 2019-08-22 2021-02-25 Auto-Kabel Management Gmbh Verbindung eines Crimpkontakts mit einem Leiter sowie Verfahren zur Herstellung eines Crimpkontaktes
DE102020106742A1 (de) 2020-03-12 2021-09-16 Auto-Kabel Management Gmbh Elektrisches Kontaktteil sowie Verfahren zur Herstellung eines elektrischen Kontaktteils
DE102020131954A1 (de) 2020-12-02 2022-06-02 Auto-Kabel Management Gmbh Verfahren zur Folienbeschichtung mittels Laser

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283259A (en) * 1979-05-08 1981-08-11 International Business Machines Corporation Method for maskless chemical and electrochemical machining
US4432855A (en) * 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
DE10131225B4 (de) * 1983-12-29 2012-07-05 Tyco Electronics Amp Gmbh Kontaktelement von zur Oberflächenmontage geeigneten Bauteilen sowie Verfahren zum Anbringen von Lot an diese Kontaktelemente
DE69418698T2 (de) * 1994-04-14 1999-10-07 Hewlett-Packard Gmbh Verfahren zur Herstellung von Leiterplatten
US6631558B2 (en) * 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
DE10060917A1 (de) * 2000-12-07 2002-06-13 Integrated Magnesium Technolog Abschirmung gegen elektromagnetische Strahlung
TWI227579B (en) * 2002-10-10 2005-02-01 Matsushita Electric Works Ltd Contact used in a connector, and method for manufacturing an element to be soldered
CN1692529B (zh) * 2002-10-10 2010-04-28 松下电工株式会社 被软钎焊的零件的制造方法
CN100413061C (zh) * 2004-06-07 2008-08-20 鸿富锦精密工业（深圳）有限公司 一种热管及其制造方法
JP4395038B2 (ja) * 2004-09-22 2010-01-06 富士フイルム株式会社 微細構造体およびその製造方法
KR100912181B1 (ko) * 2007-09-20 2009-08-14 노승백 레이져 표면처리단계를 이용한 납오름 방지용 부분도금방법
EP2273621A4 (en) * 2008-03-19 2011-07-13 Furukawa Electric Co Ltd TERMINAL FOR CONNECTOR AND METHOD FOR PRODUCING TERMINAL FOR CONNECTOR
WO2009116601A1 (ja) * 2008-03-19 2009-09-24 古河電気工業株式会社 コネクタ用金属材料およびその製造方法
DE202008017220U1 (de) 2008-08-01 2009-03-19 Auto-Kabel Managementgesellschaft Mbh Kraftfahrzeugleiteranschlusselement
CN101736371A (zh) * 2009-12-24 2010-06-16 冯翀 塑料零件局部电镀的方法
TWI445139B (zh) * 2010-06-11 2014-07-11 Advanced Semiconductor Eng 晶片封裝結構、晶片封裝模具與晶片封裝製程
EP2644744A1 (en) * 2012-03-29 2013-10-02 Atotech Deutschland GmbH Method for promoting adhesion between dielectric substrates and metal layers
US9258907B2 (en) * 2012-08-09 2016-02-09 Lockheed Martin Corporation Conformal 3D non-planar multi-layer circuitry
TWI452955B (zh) * 2012-10-08 2014-09-11 Subtron Technology Co Ltd 基板結構的製作方法
TWI590726B (zh) * 2013-12-09 2017-07-01 群成科技股份有限公司 電子封裝件、封裝載板及此封裝載板的製造方法

Also Published As

Publication number Publication date
ES2911716T3 (es) 2022-05-20
MX367421B (es) 2019-08-21
US20170331212A1 (en) 2017-11-16
EP3227969B1 (de) 2022-04-13
CN107002267A (zh) 2017-08-01
DE102014017886A1 (de) 2016-06-09
DE202015009520U1 (de) 2018-02-26
WO2016087067A1 (de) 2016-06-09
EP3227969A1 (de) 2017-10-11

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