MX2017005179A - Métodos para generar sustratos impresos en 3d para electrónicos ensamblados de forma modular. - Google Patents

Métodos para generar sustratos impresos en 3d para electrónicos ensamblados de forma modular.

Info

Publication number
MX2017005179A
MX2017005179A MX2017005179A MX2017005179A MX2017005179A MX 2017005179 A MX2017005179 A MX 2017005179A MX 2017005179 A MX2017005179 A MX 2017005179A MX 2017005179 A MX2017005179 A MX 2017005179A MX 2017005179 A MX2017005179 A MX 2017005179A
Authority
MX
Mexico
Prior art keywords
module
generating
data
substrate
methods
Prior art date
Application number
MX2017005179A
Other languages
English (en)
Other versions
MX364106B (es
Inventor
Elmieh Baback
PALAN Saurabh
Alexander ROBBERTS Andrew
JAIS Alexandre
Original Assignee
Facebook Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Facebook Inc filed Critical Facebook Inc
Publication of MX2017005179A publication Critical patent/MX2017005179A/es
Publication of MX364106B publication Critical patent/MX364106B/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
    • G05B19/4099—Surface or curve machining, making 3D objects, e.g. desktop manufacturing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/35—Nc in input of data, input till input file format
    • G05B2219/35134—3-D cad-cam
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49007—Making, forming 3-D object, model, surface
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49023—3-D printing, layer of powder, add drops of binder in layer, new powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/80—Technologies aiming to reduce greenhouse gasses emissions common to all road transportation technologies
    • Y02T10/82—Elements for improving aerodynamics

Abstract

Sistemas, medios y métodos para el modelado de productos electrónicos para la impresión en 3D incluyen proporcionar una librería de módulos e interfaces de módulo; recibir al menos un conjunto de reglas; recibir los datos de la estructura del sustrato preliminar, los datos de la estructura del sustrato preliminar comprende los datos de la forma y volumen que definen al sustrato; proporcionar una interfaz que permita que el usuario coloque uno o más módulos en el sustrato; proporcionar una interfaz que permita al usuario colocar una o más interfaces de módulo, las interfaces de módulo están acopladas con uno o más módulos en conjunto a través del sustrato; advertir al usuario sobre si la ubicación del módulo o interfaces del módulo viola al menos un conjunto de reglas; generar el enrutamiento de interconexiones eléctricamente conductoras entre las interfaces de módulo colocadas; y generar un modelo de estructura de sustrato finalizado al combinar los datos de la estructura del sustrato preliminar con los datos de la ubicación del módulo y los datos del enrutamiento de interconexion.
MX2017005179A 2014-10-23 2015-10-23 Métodos para generar sustratos impresos en 3d para electrónicos ensamblados de forma modular. MX364106B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462067712P 2014-10-23 2014-10-23
PCT/US2015/057236 WO2016065332A1 (en) 2014-10-23 2015-10-23 Methods for generating 3d printed substrates for electronics assembled in a modular fashion

Publications (2)

Publication Number Publication Date
MX2017005179A true MX2017005179A (es) 2017-10-23
MX364106B MX364106B (es) 2019-04-12

Family

ID=55761668

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017005179A MX364106B (es) 2014-10-23 2015-10-23 Métodos para generar sustratos impresos en 3d para electrónicos ensamblados de forma modular.

Country Status (11)

Country Link
US (1) US10099429B2 (es)
EP (1) EP3210136A4 (es)
JP (1) JP6629314B2 (es)
KR (1) KR101956692B1 (es)
CN (1) CN107408136A (es)
AU (1) AU2015335609B2 (es)
BR (1) BR112017008412A2 (es)
CA (1) CA2965144C (es)
IL (1) IL251805B (es)
MX (1) MX364106B (es)
WO (1) WO2016065332A1 (es)

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KR102445973B1 (ko) * 2016-05-24 2022-09-21 디버전트 테크놀로지스, 인크. 수송 구조체들의 적층 제조를 위한 시스템들 및 방법들
DE102016117776A1 (de) * 2016-09-21 2017-10-05 Danfoss Silicon Power Gmbh Verfahren zum Herstellen einer Leistungsbaugruppe mit einem Halbleiter
US10866576B2 (en) 2017-05-16 2020-12-15 Proto Labs Inc Methods of manufacturing one or more discrete objects from a body of material created by additive manufacturing
US10795340B2 (en) 2017-07-10 2020-10-06 Proto Labs, INC Methods of manufacturing a plurality of discrete objects from a body of material created by additive manufacturing
US11453170B2 (en) * 2017-08-31 2022-09-27 General Electric Company Distribution of customized engineering models for additive manufacturing
CN107901424A (zh) * 2017-12-15 2018-04-13 北京中睿华信信息技术有限公司 一种图像采集建模系统
CN109710246A (zh) * 2018-12-07 2019-05-03 北京奇虎科技有限公司 数据管理系统及其控制方法、设备及存储介质
JP7400259B2 (ja) * 2019-08-14 2023-12-19 富士フイルムビジネスイノベーション株式会社 三次元形状データの生成装置、三次元造形装置、及び三次元形状データの生成プログラム
CN110534411B (zh) * 2019-08-21 2021-07-13 大同新成新材料股份有限公司 一种芯片硅的加工方法
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WO2022113213A1 (ja) * 2020-11-25 2022-06-02 株式会社Fuji 信号変換基板の製造方法、及び製造装置

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Also Published As

Publication number Publication date
JP6629314B2 (ja) 2020-01-15
EP3210136A4 (en) 2018-06-13
US10099429B2 (en) 2018-10-16
EP3210136A1 (en) 2017-08-30
WO2016065332A1 (en) 2016-04-28
KR101956692B1 (ko) 2019-03-11
IL251805B (en) 2019-05-30
BR112017008412A2 (pt) 2017-12-19
AU2015335609B2 (en) 2019-04-18
AU2015335609A1 (en) 2017-05-18
US20160144572A1 (en) 2016-05-26
IL251805A0 (en) 2017-06-29
JP2018500632A (ja) 2018-01-11
CN107408136A (zh) 2017-11-28
MX364106B (es) 2019-04-12
CA2965144C (en) 2019-06-04
CA2965144A1 (en) 2016-04-28
KR20170072314A (ko) 2017-06-26

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