MX2014013720A - Compuesto adhesivo activable con calor, absorbente de la luz, y cinta adhesiva que contiene tal compuesto adhesivo. - Google Patents

Compuesto adhesivo activable con calor, absorbente de la luz, y cinta adhesiva que contiene tal compuesto adhesivo.

Info

Publication number
MX2014013720A
MX2014013720A MX2014013720A MX2014013720A MX2014013720A MX 2014013720 A MX2014013720 A MX 2014013720A MX 2014013720 A MX2014013720 A MX 2014013720A MX 2014013720 A MX2014013720 A MX 2014013720A MX 2014013720 A MX2014013720 A MX 2014013720A
Authority
MX
Mexico
Prior art keywords
adhesive
adhesive compound
compound
light
activable
Prior art date
Application number
MX2014013720A
Other languages
English (en)
Spanish (es)
Inventor
Roger Teng
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of MX2014013720A publication Critical patent/MX2014013720A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J115/00—Adhesives based on rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2415/00—Presence of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
MX2014013720A 2012-05-21 2013-05-07 Compuesto adhesivo activable con calor, absorbente de la luz, y cinta adhesiva que contiene tal compuesto adhesivo. MX2014013720A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202012004946U DE202012004946U1 (de) 2012-05-21 2012-05-21 Lichtabsorbierende hitzeaktivierbare Klebemasse und Klebeband enthaltend solche Klebemasse
PCT/EP2013/059508 WO2013174650A1 (de) 2012-05-21 2013-05-07 Lichtabsorbierende hitzeaktivierbare klebemasse und klebeband enthaltend solche klebemasse

Publications (1)

Publication Number Publication Date
MX2014013720A true MX2014013720A (es) 2015-02-10

Family

ID=48289219

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014013720A MX2014013720A (es) 2012-05-21 2013-05-07 Compuesto adhesivo activable con calor, absorbente de la luz, y cinta adhesiva que contiene tal compuesto adhesivo.

Country Status (9)

Country Link
US (1) US20150159052A1 (enExample)
EP (1) EP2852648A1 (enExample)
JP (1) JP6211071B2 (enExample)
KR (1) KR20150018829A (enExample)
BR (1) BR112014028938A2 (enExample)
DE (1) DE202012004946U1 (enExample)
MX (1) MX2014013720A (enExample)
TW (1) TW201406912A (enExample)
WO (2) WO2013174647A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104494250B (zh) * 2014-12-18 2017-04-26 杭州临安天宏电讯材料有限公司 一种热熔聚酯带及其制备方法
EP3645645A1 (en) 2017-06-30 2020-05-06 H. B. Fuller Company Apparatus and method for applying an adhesive tape with activable adhesive compositions to an article
DE102017127618A1 (de) * 2017-11-22 2019-05-23 Faist Chemtec Gmbh Klebeelement, Öffnung, wie ein Konstruktionsloch, ein Karosserieloch, ein Lackablaufloch und/oder eine Lackablauföffnung, und System aus Klebeelement und Trägerelement
DE102021207161A1 (de) * 2021-07-07 2023-01-12 Tesa Se Lösbares Folienlaminat und Verfahren zum Lösen dauerhafter Verklebungen
DE102022105185A1 (de) 2022-03-04 2023-09-07 Tesa Se Lösbares Laminat und Verfahren zum Lösen dauerhafter struktureller Verklebungen
EP4276155A1 (en) 2022-05-11 2023-11-15 tesa SE Multilayered tape and process for debonding the multilayered tape
DE102022126654A1 (de) * 2022-10-13 2024-04-18 Tesa Se Klebeband und Verfahren zum Ummanteln von langgestrecktem Gut insbesondere Leitungen
DE102023104755A1 (de) 2023-02-27 2024-08-29 Tesa Se Reaktivklebeband zum einfachen Lösen
EP4506430A1 (de) 2023-08-11 2025-02-12 Tesa Se Klebeband, verklebter verbund und verfahren zum elektrischen lösen des verklebten verbundes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0530402B1 (de) * 1991-09-06 1996-03-06 HUBER & SUHNER AG Wärmehärtbare Reaktionsklebstoffe
JPH05171115A (ja) * 1991-12-19 1993-07-09 Toyo Kooteingu Kk スピーカーネット固定用両面粘着テープ
JPH07126584A (ja) * 1993-11-05 1995-05-16 Hitachi Kasei Polymer Co Ltd つや消しテープ
JP2767199B2 (ja) * 1994-05-12 1998-06-18 日立化成ポリマー株式会社 化粧材固定用両面接着テープ
EP1262532B1 (en) * 2001-05-30 2005-04-20 3M Innovative Properties Company Weatherstrip tape and method for producing the same
DE102004057650A1 (de) * 2004-11-29 2006-06-01 Tesa Ag Hitzeaktivierbares Klebeband auf Basis carboxylierter Nitrilkautschuke für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102004057651A1 (de) * 2004-11-29 2006-06-01 Tesa Ag Hitzeaktivierbares Klebeband auf der Basis von Nitrilkautschuk und Polyvinylbutyral für die Verklebung von elektronischen Bauteilen und Leiterbahnen
EP1861475A2 (en) * 2005-03-03 2007-12-05 3M Innovative Properties Company Thermosettable adhesive tape, articles and methods
DE102005025056A1 (de) * 2005-05-30 2006-12-07 Tesa Ag Nitrilkautschuk-Blends zur Fixierung von Metallteilen auf Kunststoffen
DE102006026761A1 (de) * 2006-06-09 2008-01-10 Evonik Degussa Gmbh Universalpigmentpräparationen
DE102007019131A1 (de) * 2007-04-20 2008-10-23 Tesa Ag Doppelseitiges Haftklebeband
DE102009025641A1 (de) * 2009-06-17 2010-12-23 Tesa Se Verwendung von hitzeaktivierbaren Klebebändern für die Verklebung von flexiblen Leiterplatten

Also Published As

Publication number Publication date
EP2852648A1 (de) 2015-04-01
KR20150018829A (ko) 2015-02-24
BR112014028938A2 (pt) 2017-06-27
JP6211071B2 (ja) 2017-10-11
JP2015520788A (ja) 2015-07-23
US20150159052A1 (en) 2015-06-11
WO2013174650A1 (de) 2013-11-28
DE202012004946U1 (de) 2013-08-26
TW201406912A (zh) 2014-02-16
WO2013174647A1 (de) 2013-11-28

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