MX169166B - Regeneracion de un baño de procesamiento quimico de cobre - Google Patents

Regeneracion de un baño de procesamiento quimico de cobre

Info

Publication number
MX169166B
MX169166B MX011081A MX1108188A MX169166B MX 169166 B MX169166 B MX 169166B MX 011081 A MX011081 A MX 011081A MX 1108188 A MX1108188 A MX 1108188A MX 169166 B MX169166 B MX 169166B
Authority
MX
Mexico
Prior art keywords
chemical processing
processing bath
regeneration
copper chemical
percent
Prior art date
Application number
MX011081A
Other languages
English (en)
Inventor
Kestutis F Petraitis
Walter W Bandauf
Original Assignee
Harshaw Filtrol Partnership
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harshaw Filtrol Partnership filed Critical Harshaw Filtrol Partnership
Publication of MX169166B publication Critical patent/MX169166B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

La presente invención se refiere a el metodo para eliminar sulfato de cobre de un baño de procesamiento químico de cobre operado normalmente a una temperatura aproximadamente entre 75ºF (23ºC) y 140ªF (60ºC) y compuesto de peróxido de hidrógeno y ácido sulfúrico, que comprende enfriar el baño para cristalizar el sulfato de cobre, comprendiendo la mejora la inclusión en el baño de procesamiento químico de aproximadamente 0.02 por ciento y aproximadamente 0.2 por ciento de agente de control de cristalización que se selecciona del grupo que consiste en goma arábiga y un glicol de peso molecular bajo que tiene la fórmula HOCH2 (CH2)X CH2 OH, en que X es un entero que tiene un valor entre 0 y 1.
MX011081A 1987-04-13 1988-04-12 Regeneracion de un baño de procesamiento quimico de cobre MX169166B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/037,477 US4880495A (en) 1987-04-13 1987-04-13 Regeneration of copper etch bath

Publications (1)

Publication Number Publication Date
MX169166B true MX169166B (es) 1993-06-23

Family

ID=21894556

Family Applications (1)

Application Number Title Priority Date Filing Date
MX011081A MX169166B (es) 1987-04-13 1988-04-12 Regeneracion de un baño de procesamiento quimico de cobre

Country Status (6)

Country Link
US (1) US4880495A (es)
JP (1) JPS6447884A (es)
CA (1) CA1309324C (es)
GB (1) GB2203387B (es)
MX (1) MX169166B (es)
NL (1) NL8800887A (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04320088A (ja) * 1991-04-18 1992-11-10 Cmk Corp プリント配線板の製造方法
US5630950A (en) * 1993-07-09 1997-05-20 Enthone-Omi, Inc. Copper brightening process and bath
US5472618A (en) * 1994-02-07 1995-12-05 Great Western Chemical Company Method for recovering metals from solutions
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
JP3284057B2 (ja) * 1996-06-27 2002-05-20 ワイケイケイ株式会社 スライドファスナー又はそのチェーンの製造方法
US6372055B1 (en) 1999-10-29 2002-04-16 Shipley Company, L.L.C. Method for replenishing baths
JP4756435B2 (ja) * 2001-06-22 2011-08-24 Ｔｏｔｏ株式会社 便器の掃除口蓋
DE10326767B4 (de) * 2003-06-13 2006-02-02 Atotech Deutschland Gmbh Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben
US7232478B2 (en) 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
TWI228104B (en) * 2003-07-29 2005-02-21 Min-Shing Tsai Sludge-free wastewater treatment process and apparatus
US11512406B2 (en) * 2019-10-17 2022-11-29 Rohm And Haas Electronic Materials Llc Method of enhancing copper electroplating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556883A (en) * 1967-07-21 1971-01-19 Mitsubishi Edogawa Kagaku Kk Method for chemically polishing copper or copper alloy
US3773557A (en) * 1972-03-01 1973-11-20 Wurlitzer Co Solid state battery
US4141850A (en) * 1977-11-08 1979-02-27 Dart Industries Inc. Dissolution of metals

Also Published As

Publication number Publication date
CA1309324C (en) 1992-10-27
GB2203387B (en) 1991-04-10
NL8800887A (nl) 1988-11-01
JPS6447884A (en) 1989-02-22
GB8808145D0 (en) 1988-05-11
GB2203387A (en) 1988-10-19
US4880495A (en) 1989-11-14

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