MX166210B - Procedimiento para obtener un laminado y el laminado asi obtenido - Google Patents

Procedimiento para obtener un laminado y el laminado asi obtenido

Info

Publication number
MX166210B
MX166210B MX1883789A MX1883789A MX166210B MX 166210 B MX166210 B MX 166210B MX 1883789 A MX1883789 A MX 1883789A MX 1883789 A MX1883789 A MX 1883789A MX 166210 B MX166210 B MX 166210B
Authority
MX
Mexico
Prior art keywords
substrate
obtaining
laminate
conductive film
polynorbornene
Prior art date
Application number
MX1883789A
Other languages
English (en)
Spanish (es)
Inventor
George M Benedikt
David M Aleksa
Linwood P Tenney
Original Assignee
Goodrich Co B F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/288,999 external-priority patent/US4923734A/en
Priority claimed from US07/302,206 external-priority patent/US4902556A/en
Application filed by Goodrich Co B F filed Critical Goodrich Co B F
Publication of MX166210B publication Critical patent/MX166210B/es

Links

Landscapes

  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
MX1883789A 1988-12-23 1989-12-21 Procedimiento para obtener un laminado y el laminado asi obtenido MX166210B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/288,999 US4923734A (en) 1988-12-23 1988-12-23 Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers
US07/302,206 US4902556A (en) 1989-01-27 1989-01-27 Multi-layer polynorbornene and epoxy laminates and process for making the same

Publications (1)

Publication Number Publication Date
MX166210B true MX166210B (es) 1992-12-23

Family

ID=26965380

Family Applications (1)

Application Number Title Priority Date Filing Date
MX1883789A MX166210B (es) 1988-12-23 1989-12-21 Procedimiento para obtener un laminado y el laminado asi obtenido

Country Status (2)

Country Link
CN (2) CN1043662A (zh)
MX (1) MX166210B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614324A (en) * 1995-07-24 1997-03-25 Gould Electronics Inc. Multi-layer structures containing a silane adhesion promoting layer
JP5138267B2 (ja) * 2007-04-18 2013-02-06 日立化成工業株式会社 プリプレグ、それを用いた多層基配線板及び電子部品
US8541523B2 (en) * 2010-04-05 2013-09-24 Promerus, Llc Norbornene-type polymers, compositions thereof and lithographic process using such compositions
US10844164B2 (en) * 2016-05-24 2020-11-24 Industrial Technology Research Institute Oligomer, composition and composite material employing the same
CN107417891A (zh) * 2016-12-29 2017-12-01 财团法人工业技术研究院 寡聚物、包含其的组合物及复合材料
US11059938B2 (en) 2018-10-05 2021-07-13 Industrial Technology Research Institute Film composition and a film prepared thereby
CN109616421A (zh) * 2018-11-21 2019-04-12 杰群电子科技（东莞）有限公司 一种智能功率模块加工方法及智能功率模块
CN113473749A (zh) * 2020-03-31 2021-10-01 深南电路股份有限公司 印刷电路板的制备方法及印刷电路板

Also Published As

Publication number Publication date
CN1089213A (zh) 1994-07-13
CN1043662A (zh) 1990-07-11

Similar Documents

Publication Publication Date Title
ATE14495T1 (de) Praegefolie zum aufbringen von leiterbahnen.
JPS5643625A (en) Electronic color generation device
TW335503B (en) Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method
EP0368334A3 (en) Etching apparatus and method of using the same
ES2103375T3 (es) Composicion de polimero electricamente conductor, metodo para su preparacion y dispositivo que lo incorpora.
MX166210B (es) Procedimiento para obtener un laminado y el laminado asi obtenido
JPS54568A (en) Semiconductor element
KR900702540A (ko) 전도성 중합체의 박층 형성 방법
IT8348010A0 (it) Procedimento ed apparecchio per applicare in continuo sotto vuoto un rivestimento, in particolare su con tenitori di latta, con ricupero del solvente
TW200517529A (en) Plating method and apparatus
ES2057445T5 (es) Procedimiento para depositar cobre por via quimica.
AU1929288A (en) Production of thin films
DK234787D0 (da) Lagelementer og fremgangsmaade til fremstilling heraf
KR970000547A (ko) 동장 적층판과 그 제조 방법 및 인쇄 기판과 그 제조 방법
ATE44345T1 (de) Elektrische leiterplatten.
JPS5251955A (en) Optical semiconductor device
JPS5784157A (en) Resin seal type semiconductor device
SE8600883D0 (sv) Solderless conection technique and apparatus
JPS53144986A (en) Electrically conductive laminated film
JPS543843A (en) Surface treatment of base material for imparting electrical conductivity
TW256858B (en) Copper foil for printed circuit board
JPS5313239A (en) Manufacturing process of laminated electrical heat plate
JPS6489547A (en) Board for mounting semiconductor element
JPS5630732A (en) Mounting method of semiconductor pellet
FR2407085A2 (fr) Dispositif pour le transfert a sec de signes en encre