MX166210B - PROCEDURE FOR OBTAINING A LAMINATE AND THE LAMINATE SO OBTAINED - Google Patents

PROCEDURE FOR OBTAINING A LAMINATE AND THE LAMINATE SO OBTAINED

Info

Publication number
MX166210B
MX166210B MX1883789A MX1883789A MX166210B MX 166210 B MX166210 B MX 166210B MX 1883789 A MX1883789 A MX 1883789A MX 1883789 A MX1883789 A MX 1883789A MX 166210 B MX166210 B MX 166210B
Authority
MX
Mexico
Prior art keywords
substrate
obtaining
laminate
conductive film
polynorbornene
Prior art date
Application number
MX1883789A
Other languages
Spanish (es)
Inventor
George M Benedikt
David M Aleksa
Linwood P Tenney
Original Assignee
Goodrich Co B F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/288,999 external-priority patent/US4923734A/en
Priority claimed from US07/302,206 external-priority patent/US4902556A/en
Application filed by Goodrich Co B F filed Critical Goodrich Co B F
Publication of MX166210B publication Critical patent/MX166210B/en

Links

Landscapes

  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

La presente invención se refiere a procedimiento para obtener un laminado, caracterizado porque comprende: a) proveer una solución de polímero conteniendo un polímero de polinorborneno disuelto en un solvente; b) impregnar un substrato no-celulósico con la solución de polímero para obtener un substrato impregnado; c) secar el substrato impregnado para remover el solvente y obtener un substrato impregnado para remover el solvente y obtener un substrato de polinorborneno; d) proveer una película conductiva y tratar cuando menos una superficie de la película conductiva con una solución de un compuesto de silano apropiado para incrementar la resistencia de enlace entre el substrato de polinorborneno y la película conductiva y e) laminar la película conductiva tratada con silano a una superficie del substrato de polinorborneno a una presión por encima de aproximadamente 51.5 Kg/cm 2 y a una temperatuva desde la ambienta hasta 250 grados c.The present invention relates to a process for obtaining a laminate, characterized in that it comprises: a) providing a polymer solution containing a polynorbornene polymer dissolved in a solvent; b) impregnating a non-cellulosic substrate with the polymer solution to obtain an impregnated substrate; c) drying the impregnated substrate to remove the solvent and obtaining an impregnated substrate to remove the solvent and obtaining a polynorbornene substrate; d) providing a conductive film and treating at least one surface of the conductive film with a solution of an appropriate silane compound to increase the bond strength between the polynorbornene substrate and the conductive film and e) laminating the silane treated conductive film to a polynorbornene substrate surface at a pressure above approximately 51.5 Kg / cm 2 and at a temperature from ambient to 250 degrees c.

MX1883789A 1988-12-23 1989-12-21 PROCEDURE FOR OBTAINING A LAMINATE AND THE LAMINATE SO OBTAINED MX166210B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/288,999 US4923734A (en) 1988-12-23 1988-12-23 Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers
US07/302,206 US4902556A (en) 1989-01-27 1989-01-27 Multi-layer polynorbornene and epoxy laminates and process for making the same

Publications (1)

Publication Number Publication Date
MX166210B true MX166210B (en) 1992-12-23

Family

ID=26965380

Family Applications (1)

Application Number Title Priority Date Filing Date
MX1883789A MX166210B (en) 1988-12-23 1989-12-21 PROCEDURE FOR OBTAINING A LAMINATE AND THE LAMINATE SO OBTAINED

Country Status (2)

Country Link
CN (2) CN1043662A (en)
MX (1) MX166210B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614324A (en) * 1995-07-24 1997-03-25 Gould Electronics Inc. Multi-layer structures containing a silane adhesion promoting layer
JP5138267B2 (en) * 2007-04-18 2013-02-06 日立化成工業株式会社 Prepreg, multilayer substrate and electronic component using the same
US8541523B2 (en) * 2010-04-05 2013-09-24 Promerus, Llc Norbornene-type polymers, compositions thereof and lithographic process using such compositions
US10844164B2 (en) * 2016-05-24 2020-11-24 Industrial Technology Research Institute Oligomer, composition and composite material employing the same
CN107417891A (en) * 2016-12-29 2017-12-01 财团法人工业技术研究院 Oligomer, the composition and composite for including it
US11059938B2 (en) 2018-10-05 2021-07-13 Industrial Technology Research Institute Film composition and a film prepared thereby
CN109616421A (en) * 2018-11-21 2019-04-12 杰群电子科技(东莞)有限公司 A kind of intelligent power module processing method and intelligent power module
CN113473749A (en) * 2020-03-31 2021-10-01 深南电路股份有限公司 Preparation method of printed circuit board and printed circuit board

Also Published As

Publication number Publication date
CN1089213A (en) 1994-07-13
CN1043662A (en) 1990-07-11

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