MX166210B - PROCEDURE FOR OBTAINING A LAMINATE AND THE LAMINATE SO OBTAINED - Google Patents
PROCEDURE FOR OBTAINING A LAMINATE AND THE LAMINATE SO OBTAINEDInfo
- Publication number
- MX166210B MX166210B MX1883789A MX1883789A MX166210B MX 166210 B MX166210 B MX 166210B MX 1883789 A MX1883789 A MX 1883789A MX 1883789 A MX1883789 A MX 1883789A MX 166210 B MX166210 B MX 166210B
- Authority
- MX
- Mexico
- Prior art keywords
- substrate
- obtaining
- laminate
- conductive film
- polynorbornene
- Prior art date
Links
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
La presente invención se refiere a procedimiento para obtener un laminado, caracterizado porque comprende: a) proveer una solución de polímero conteniendo un polímero de polinorborneno disuelto en un solvente; b) impregnar un substrato no-celulósico con la solución de polímero para obtener un substrato impregnado; c) secar el substrato impregnado para remover el solvente y obtener un substrato impregnado para remover el solvente y obtener un substrato de polinorborneno; d) proveer una película conductiva y tratar cuando menos una superficie de la película conductiva con una solución de un compuesto de silano apropiado para incrementar la resistencia de enlace entre el substrato de polinorborneno y la película conductiva y e) laminar la película conductiva tratada con silano a una superficie del substrato de polinorborneno a una presión por encima de aproximadamente 51.5 Kg/cm 2 y a una temperatuva desde la ambienta hasta 250 grados c.The present invention relates to a process for obtaining a laminate, characterized in that it comprises: a) providing a polymer solution containing a polynorbornene polymer dissolved in a solvent; b) impregnating a non-cellulosic substrate with the polymer solution to obtain an impregnated substrate; c) drying the impregnated substrate to remove the solvent and obtaining an impregnated substrate to remove the solvent and obtaining a polynorbornene substrate; d) providing a conductive film and treating at least one surface of the conductive film with a solution of an appropriate silane compound to increase the bond strength between the polynorbornene substrate and the conductive film and e) laminating the silane treated conductive film to a polynorbornene substrate surface at a pressure above approximately 51.5 Kg / cm 2 and at a temperature from ambient to 250 degrees c.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/288,999 US4923734A (en) | 1988-12-23 | 1988-12-23 | Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers |
| US07/302,206 US4902556A (en) | 1989-01-27 | 1989-01-27 | Multi-layer polynorbornene and epoxy laminates and process for making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX166210B true MX166210B (en) | 1992-12-23 |
Family
ID=26965380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX1883789A MX166210B (en) | 1988-12-23 | 1989-12-21 | PROCEDURE FOR OBTAINING A LAMINATE AND THE LAMINATE SO OBTAINED |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN1043662A (en) |
| MX (1) | MX166210B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614324A (en) * | 1995-07-24 | 1997-03-25 | Gould Electronics Inc. | Multi-layer structures containing a silane adhesion promoting layer |
| JP5138267B2 (en) * | 2007-04-18 | 2013-02-06 | 日立化成工業株式会社 | Prepreg, multilayer substrate and electronic component using the same |
| US8541523B2 (en) * | 2010-04-05 | 2013-09-24 | Promerus, Llc | Norbornene-type polymers, compositions thereof and lithographic process using such compositions |
| US10844164B2 (en) * | 2016-05-24 | 2020-11-24 | Industrial Technology Research Institute | Oligomer, composition and composite material employing the same |
| CN107417891A (en) * | 2016-12-29 | 2017-12-01 | 财团法人工业技术研究院 | Oligomer, the composition and composite for including it |
| US11059938B2 (en) | 2018-10-05 | 2021-07-13 | Industrial Technology Research Institute | Film composition and a film prepared thereby |
| CN109616421A (en) * | 2018-11-21 | 2019-04-12 | 杰群电子科技（东莞）有限公司 | A kind of intelligent power module processing method and intelligent power module |
| CN113473749A (en) * | 2020-03-31 | 2021-10-01 | 深南电路股份有限公司 | Preparation method of printed circuit board and printed circuit board |
-
1989
- 1989-12-21 MX MX1883789A patent/MX166210B/en unknown
- 1989-12-23 CN CN 89109476 patent/CN1043662A/en active Pending
-
1993
- 1993-12-24 CN CN 93121073 patent/CN1089213A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN1089213A (en) | 1994-07-13 |
| CN1043662A (en) | 1990-07-11 |
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