MX166118B - Resinas epoxi modificadas con imida - Google Patents
Resinas epoxi modificadas con imidaInfo
- Publication number
- MX166118B MX166118B MX012286A MX1228688A MX166118B MX 166118 B MX166118 B MX 166118B MX 012286 A MX012286 A MX 012286A MX 1228688 A MX1228688 A MX 1228688A MX 166118 B MX166118 B MX 166118B
- Authority
- MX
- Mexico
- Prior art keywords
- epoxy resins
- modified epoxy
- imida
- epoxy resin
- monoimide
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
La presente invención se refiere a una resina epoxi sólida, modificada, caracterizada porque tiene un punto de ablandamiento de Mettler de cuando menos 85 grados C, que es el resultado de hacer reaccionar una resina epoxi que tiene un promedio de más de un grupo epóxido vecinal por molécula, con una monoimida de un ácido dicarboxílico que está esencialmente libre de grupos alilo y metalilo en una cantidad suficiente para elevar el punto de ablandamiento de Mettler a por lo menos 85 grados C cuando la resina, antes de la modificación, tiene un punto de ablandamiento de Mettler inferior a 85 grados C, o cuando el punto de ablandamiento de la resina no modificada es de más de 85 grados C, una cantidad suficiente para elevar el punto de ablandamiento por lo menos 2 grados C. Una composición curable, caracterizada porque comprende: (A) por lo menos una resina epoxi sólida, modificada; B) cantidad curadora de cuando menos un agente curador para el componente (A); seleccionado de una poliamina alifática primaria, una poliamina alifática secundaria, amina terciaria, ácido carboxílico o anhídrido de ácido carboxílico, compuesto fenólico que contiene hidroxilo, guanidina, biguanida, resina de ure-formaldehido, resina de melamina-aldehido, poliamina aromática, sulfanilamida, ácido de fosfato, éster fosfato, fosfito, ácido de Lewis y una combinación de ellos.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7412887A | 1987-07-17 | 1987-07-17 | |
US07/203,353 US4847348A (en) | 1987-07-17 | 1988-06-06 | Imide Modified epoxy resins |
Publications (1)
Publication Number | Publication Date |
---|---|
MX166118B true MX166118B (es) | 1992-12-21 |
Family
ID=26755283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX012286A MX166118B (es) | 1987-07-17 | 1988-07-15 | Resinas epoxi modificadas con imida |
Country Status (12)
Country | Link |
---|---|
US (1) | US4847348A (es) |
EP (1) | EP0299421B1 (es) |
JP (1) | JP2680355B2 (es) |
KR (1) | KR910008331B1 (es) |
AT (1) | ATE135381T1 (es) |
AU (1) | AU610605B2 (es) |
BR (1) | BR8803965A (es) |
DE (1) | DE3855087T2 (es) |
MX (1) | MX166118B (es) |
MY (1) | MY103317A (es) |
NZ (1) | NZ225363A (es) |
PT (1) | PT88001B (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5023303A (en) * | 1988-01-29 | 1991-06-11 | Pappas S Peter | α, β-diacid/N,N-substituted diamine adduct catalyst for epoxy resin and acid polyester |
US4946911A (en) * | 1989-05-22 | 1990-08-07 | The Dow Chemical Company | Epoxy resin and water borne coatings therefrom |
ES2210701T3 (es) * | 1997-02-07 | 2004-07-01 | Vantico Ag | Pintura en polvo. |
KR100501798B1 (ko) * | 2002-02-09 | 2005-07-20 | 서해조 | 전자부품 피복성형용 에폭시 수지 조성물 및 제조 방법 |
WO2013091575A1 (en) * | 2011-12-22 | 2013-06-27 | Dow Global Technologies Llc | Compositions and methods for making cross-linked polyolefins |
US9462689B2 (en) | 2012-11-30 | 2016-10-04 | Lg Innotek Co., Ltd. | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition |
KR101973685B1 (ko) | 2012-12-12 | 2019-08-26 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
KR101984791B1 (ko) | 2012-12-12 | 2019-09-03 | 엘지이노텍 주식회사 | 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판 |
KR101973686B1 (ko) | 2012-12-12 | 2019-08-26 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
KR102012311B1 (ko) | 2012-12-12 | 2019-08-20 | 엘지이노텍 주식회사 | 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
KR102034228B1 (ko) | 2012-12-14 | 2019-10-18 | 엘지이노텍 주식회사 | 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판 |
CN114853981A (zh) * | 2022-05-26 | 2022-08-05 | 洛阳双瑞防腐工程技术有限公司 | 一种水溶性聚酰亚胺改性环氧树脂及其合成方法、水性环氧耐热防腐涂料及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3962182A (en) * | 1972-11-21 | 1976-06-08 | Aerojet-General Corporation | Imide oxirane reactions |
AU6263273A (en) * | 1972-11-21 | 1975-05-22 | Aerojet General Co | Catalytic reactions |
JPS5846136B2 (ja) * | 1977-07-05 | 1983-10-14 | 三菱電機株式会社 | 耐熱性エポキシ樹脂組成物 |
US4552935A (en) * | 1983-01-13 | 1985-11-12 | Ciba-Geigy Corporation | Heat-curable epoxy resin mixtures containing imide compounds and condensation products of phenols, amines and aldehydes or ketones |
US4579916A (en) * | 1983-11-15 | 1986-04-01 | Ciba-Geigy Corporation | Curable mixtures containing an epoxide resin, an imide and a curing catalyst |
US4632971A (en) * | 1985-07-15 | 1986-12-30 | The Dow Chemical Company | Thermally stable capped thermoplastic phenolic resin |
CA1272345A (en) * | 1986-02-24 | 1990-07-31 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
-
1988
- 1988-06-06 US US07/203,353 patent/US4847348A/en not_active Expired - Lifetime
- 1988-07-11 NZ NZ225363A patent/NZ225363A/en unknown
- 1988-07-11 AU AU18947/88A patent/AU610605B2/en not_active Ceased
- 1988-07-12 DE DE3855087T patent/DE3855087T2/de not_active Expired - Lifetime
- 1988-07-12 EP EP88111104A patent/EP0299421B1/en not_active Expired - Lifetime
- 1988-07-12 AT AT88111104T patent/ATE135381T1/de active
- 1988-07-15 JP JP63175271A patent/JP2680355B2/ja not_active Expired - Lifetime
- 1988-07-15 BR BR8803965A patent/BR8803965A/pt not_active Application Discontinuation
- 1988-07-15 MY MYPI88000786A patent/MY103317A/en unknown
- 1988-07-15 PT PT88001A patent/PT88001B/pt not_active IP Right Cessation
- 1988-07-15 MX MX012286A patent/MX166118B/es unknown
- 1988-07-16 KR KR1019880008876A patent/KR910008331B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU1894788A (en) | 1989-01-19 |
AU610605B2 (en) | 1991-05-23 |
DE3855087D1 (de) | 1996-04-18 |
EP0299421B1 (en) | 1996-03-13 |
EP0299421A3 (en) | 1990-12-12 |
EP0299421A2 (en) | 1989-01-18 |
PT88001A (pt) | 1989-06-30 |
BR8803965A (pt) | 1989-03-07 |
JPS6487615A (en) | 1989-03-31 |
KR910008331B1 (ko) | 1991-10-12 |
NZ225363A (en) | 1991-05-28 |
PT88001B (pt) | 1995-03-31 |
KR890002265A (ko) | 1989-04-10 |
MY103317A (en) | 1993-05-29 |
DE3855087T2 (de) | 1996-10-31 |
JP2680355B2 (ja) | 1997-11-19 |
ATE135381T1 (de) | 1996-03-15 |
US4847348A (en) | 1989-07-11 |
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