MX155400A - Mejoras a aparato para montaje y calibracion de presion en semiconductores y radiadores - Google Patents

Mejoras a aparato para montaje y calibracion de presion en semiconductores y radiadores

Info

Publication number
MX155400A
MX155400A MX202431A MX20243184A MX155400A MX 155400 A MX155400 A MX 155400A MX 202431 A MX202431 A MX 202431A MX 20243184 A MX20243184 A MX 20243184A MX 155400 A MX155400 A MX 155400A
Authority
MX
Mexico
Prior art keywords
radiators
semiconductors
mounting
pressure calibration
calibration
Prior art date
Application number
MX202431A
Other languages
English (en)
Inventor
Robert Jouanny
Original Assignee
Jeumont Schneider
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeumont Schneider filed Critical Jeumont Schneider
Publication of MX155400A publication Critical patent/MX155400A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
MX202431A 1983-08-19 1984-08-17 Mejoras a aparato para montaje y calibracion de presion en semiconductores y radiadores MX155400A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8313475A FR2550887B1 (fr) 1983-08-19 1983-08-19 Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance

Publications (1)

Publication Number Publication Date
MX155400A true MX155400A (es) 1988-02-26

Family

ID=9291705

Family Applications (1)

Application Number Title Priority Date Filing Date
MX202431A MX155400A (es) 1983-08-19 1984-08-17 Mejoras a aparato para montaje y calibracion de presion en semiconductores y radiadores

Country Status (8)

Country Link
US (1) US4636917A (es)
BR (1) BR8404003A (es)
CA (1) CA1226619A (es)
CH (1) CH658939A5 (es)
DE (1) DE3430194C2 (es)
FR (1) FR2550887B1 (es)
MX (1) MX155400A (es)
ZA (1) ZA846411B (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954811A (en) * 1988-11-29 1990-09-04 Pennwalt Corporation Penetration sensor
DE4310446C1 (de) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Schaltungsanordnung
DE4426646C2 (de) * 1994-07-16 1997-03-20 Abb Daimler Benz Transp Spannvorrichtung für Scheibenzellenhalbleiter
US5940273A (en) * 1998-06-08 1999-08-17 Inductotherm Corp. Semiconductor clamping device
US6324073B1 (en) 1998-12-22 2001-11-27 S&C Electric Co. Clamping arrangement for compression-mounted power electronic devices
AU2008207931B2 (en) * 2007-01-26 2014-05-22 Inductotherm Corp. Compression clamping of semiconductor components
WO2009115124A1 (en) * 2008-03-20 2009-09-24 Abb Technology Ag A voltage source converter
BR112014005674A2 (pt) * 2011-09-28 2017-03-28 Gen Electric aparelho de conversão de potência, pré-montagem de força nominal, métodos para calibrar uma pré-montagem de força nominal e para aplicar uma força nominal
CN104067501A (zh) * 2012-01-23 2014-09-24 丰田自动车株式会社 电力转换装置及其制造方法
DE202012007280U1 (de) * 2012-07-30 2012-09-26 Abb Technology Ag Leistungshalbleiterspannstapel
US8896023B2 (en) * 2013-02-20 2014-11-25 Alstom Technology Ltd Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
RU2660921C2 (ru) * 2014-03-20 2018-07-11 Сименс Акциенгезелльшафт Электрический модуль с зажимным устройством
JP7099385B2 (ja) * 2019-03-28 2022-07-12 株式会社デンソー 加圧部材
US11776874B2 (en) * 2020-03-24 2023-10-03 Solaredge Technologies Ltd. Apparatus and method for holding a heat generating device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3523215A (en) * 1968-03-19 1970-08-04 Westinghouse Electric Corp Stack module for flat package semiconductor device assemblies
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen
US3864607A (en) * 1972-03-16 1975-02-04 Programmed Power Stackable heat sink assembly
DE2348207A1 (de) * 1973-09-25 1975-04-17 Siemens Ag Thyristorsaeule
FR2415514A1 (fr) * 1978-01-30 1979-08-24 Jeumont Schneider Presse de serrage
JPS54116638A (en) * 1978-03-03 1979-09-11 Hitachi Ltd Semiconductor stack
DE2926403A1 (de) * 1979-06-29 1981-01-08 Siemens Ag Vorrichtung zum einspannen wenigstens eines scheibenfoermigen halbleiterbauelementes
DE2928388C3 (de) * 1979-07-13 1982-01-28 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Auswechseln von Scheibenthyristoren einer Thyristorsäule
DE3007168C2 (de) * 1980-02-26 1984-11-22 Siemens AG, 1000 Berlin und 8000 München Flüssigkeitsgekühlte Halbleitersäule
FR2529387B1 (fr) * 1982-06-29 1985-09-06 Jeumont Schneider Montage de pastilles semi-conductrices de puissance

Also Published As

Publication number Publication date
CA1226619A (fr) 1987-09-08
DE3430194A1 (de) 1985-03-07
FR2550887B1 (fr) 1986-11-07
US4636917A (en) 1987-01-13
DE3430194C2 (de) 1994-06-01
CH658939A5 (fr) 1986-12-15
ZA846411B (en) 1985-05-29
FR2550887A1 (fr) 1985-02-22
BR8404003A (pt) 1985-07-16

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