BR8404003A - Elemento pre-tarado para manter em posicao e cerrar semicondutores e radiadores dispostos alternadamente em uma coluna - Google Patents
Elemento pre-tarado para manter em posicao e cerrar semicondutores e radiadores dispostos alternadamente em uma colunaInfo
- Publication number
- BR8404003A BR8404003A BR8404003A BR8404003A BR8404003A BR 8404003 A BR8404003 A BR 8404003A BR 8404003 A BR8404003 A BR 8404003A BR 8404003 A BR8404003 A BR 8404003A BR 8404003 A BR8404003 A BR 8404003A
- Authority
- BR
- Brazil
- Prior art keywords
- tared
- radiators
- semiconductors
- keep
- column
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8313475A FR2550887B1 (fr) | 1983-08-19 | 1983-08-19 | Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8404003A true BR8404003A (pt) | 1985-07-16 |
Family
ID=9291705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8404003A BR8404003A (pt) | 1983-08-19 | 1984-08-09 | Elemento pre-tarado para manter em posicao e cerrar semicondutores e radiadores dispostos alternadamente em uma coluna |
Country Status (8)
Country | Link |
---|---|
US (1) | US4636917A (pt) |
BR (1) | BR8404003A (pt) |
CA (1) | CA1226619A (pt) |
CH (1) | CH658939A5 (pt) |
DE (1) | DE3430194C2 (pt) |
FR (1) | FR2550887B1 (pt) |
MX (1) | MX155400A (pt) |
ZA (1) | ZA846411B (pt) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4954811A (en) * | 1988-11-29 | 1990-09-04 | Pennwalt Corporation | Penetration sensor |
DE4310446C1 (de) * | 1993-03-31 | 1994-05-05 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
DE4426646C2 (de) * | 1994-07-16 | 1997-03-20 | Abb Daimler Benz Transp | Spannvorrichtung für Scheibenzellenhalbleiter |
US5940273A (en) * | 1998-06-08 | 1999-08-17 | Inductotherm Corp. | Semiconductor clamping device |
US6324073B1 (en) | 1998-12-22 | 2001-11-27 | S&C Electric Co. | Clamping arrangement for compression-mounted power electronic devices |
JP2010517308A (ja) * | 2007-01-26 | 2010-05-20 | インダクトサーム・コーポレイション | 半導体製品のコンプレッションクランプ |
CN101978494B (zh) * | 2008-03-20 | 2013-08-14 | Abb技术有限公司 | 电压源转换器 |
EP2761654A4 (en) * | 2011-09-28 | 2015-05-20 | Gen Electric | TENSION MECHANISM AND METHOD FOR THE APPLICATION OF NOMINAL POWER TO A PERFORMANCE TRANSFORMATION DEVICE |
WO2013111261A1 (ja) * | 2012-01-23 | 2013-08-01 | トヨタ自動車株式会社 | 電力変換装置及びその製造方法 |
DE202012007280U1 (de) * | 2012-07-30 | 2012-09-26 | Abb Technology Ag | Leistungshalbleiterspannstapel |
US8896023B2 (en) * | 2013-02-20 | 2014-11-25 | Alstom Technology Ltd | Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly |
CN106068683B (zh) * | 2014-03-20 | 2018-12-21 | 西门子公司 | 具有夹紧装置的电气的模块及夹紧方法 |
JP7099385B2 (ja) * | 2019-03-28 | 2022-07-12 | 株式会社デンソー | 加圧部材 |
US11776874B2 (en) * | 2020-03-24 | 2023-10-03 | Solaredge Technologies Ltd. | Apparatus and method for holding a heat generating device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3523215A (en) * | 1968-03-19 | 1970-08-04 | Westinghouse Electric Corp | Stack module for flat package semiconductor device assemblies |
DE1914790A1 (de) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen |
US3864607A (en) * | 1972-03-16 | 1975-02-04 | Programmed Power | Stackable heat sink assembly |
DE2348207A1 (de) * | 1973-09-25 | 1975-04-17 | Siemens Ag | Thyristorsaeule |
FR2415514A1 (fr) * | 1978-01-30 | 1979-08-24 | Jeumont Schneider | Presse de serrage |
JPS54116638A (en) * | 1978-03-03 | 1979-09-11 | Hitachi Ltd | Semiconductor stack |
DE2926403A1 (de) * | 1979-06-29 | 1981-01-08 | Siemens Ag | Vorrichtung zum einspannen wenigstens eines scheibenfoermigen halbleiterbauelementes |
DE2928388C3 (de) * | 1979-07-13 | 1982-01-28 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum Auswechseln von Scheibenthyristoren einer Thyristorsäule |
DE3007168C2 (de) * | 1980-02-26 | 1984-11-22 | Siemens AG, 1000 Berlin und 8000 München | Flüssigkeitsgekühlte Halbleitersäule |
FR2529387B1 (fr) * | 1982-06-29 | 1985-09-06 | Jeumont Schneider | Montage de pastilles semi-conductrices de puissance |
-
1983
- 1983-08-19 FR FR8313475A patent/FR2550887B1/fr not_active Expired
-
1984
- 1984-08-07 CA CA000460452A patent/CA1226619A/fr not_active Expired
- 1984-08-08 CH CH3806/84A patent/CH658939A5/fr not_active IP Right Cessation
- 1984-08-09 BR BR8404003A patent/BR8404003A/pt not_active IP Right Cessation
- 1984-08-13 US US06/640,394 patent/US4636917A/en not_active Expired - Fee Related
- 1984-08-16 DE DE3430194A patent/DE3430194C2/de not_active Expired - Fee Related
- 1984-08-17 ZA ZA846411A patent/ZA846411B/xx unknown
- 1984-08-17 MX MX202431A patent/MX155400A/es unknown
Also Published As
Publication number | Publication date |
---|---|
DE3430194C2 (de) | 1994-06-01 |
US4636917A (en) | 1987-01-13 |
MX155400A (es) | 1988-02-26 |
DE3430194A1 (de) | 1985-03-07 |
ZA846411B (en) | 1985-05-29 |
CH658939A5 (fr) | 1986-12-15 |
FR2550887A1 (fr) | 1985-02-22 |
CA1226619A (fr) | 1987-09-08 |
FR2550887B1 (fr) | 1986-11-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Lapse due to non-payment of fees (art. 50) |