MD529G2 - Electrolit pentru electrosedimentarea aliajelor de nichel - fosfor - Google Patents
Electrolit pentru electrosedimentarea aliajelor de nichel - fosforInfo
- Publication number
- MD529G2 MD529G2 MD95-0217A MD950217A MD529G2 MD 529 G2 MD529 G2 MD 529G2 MD 950217 A MD950217 A MD 950217A MD 529 G2 MD529 G2 MD 529G2
- Authority
- MD
- Moldova
- Prior art keywords
- nickel
- electrodeposition
- electrolyte
- phosphor
- alloys
- Prior art date
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Invenţia se referă la domeniul galvanotehnicii, în particular, la electrosedimentarea aliajelor nichel-fosfor pe suprafeţe de oţel, cupru şi aliajele lui, şi poate fi utilizată la întreprinderile industriei constructoare de maşini, industriei radiotehnice, în radioelectronică.Esenţa invenţiei constă în faptul că se propune un electrolit pentru electrosedimentarea aliajului nichel-fosfor, care conţine clorură de nichel, acetat de sodiu, hipofosfit de sodiu şi generator de luciu - ditio-bis-benzendisulfonat de sodiu, în următorul raport al componentelor, g/l:Regimul de electroliză: ic - 0.5-3 A/dm2, T°C - 40-70, pH - 4.2-5.2.Rezultatul tehnic al invenţiei constă în obţinerea învelişurilor lucioase din aliaj nichel-fosfor cu microduritate înaltă.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MD95-0217A MD529G2 (ro) | 1995-04-04 | 1995-04-04 | Electrolit pentru electrosedimentarea aliajelor de nichel - fosfor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MD95-0217A MD529G2 (ro) | 1995-04-04 | 1995-04-04 | Electrolit pentru electrosedimentarea aliajelor de nichel - fosfor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MD529F1 MD529F1 (ro) | 1996-04-30 |
| MD529G2 true MD529G2 (ro) | 1996-11-30 |
Family
ID=19738662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MD95-0217A MD529G2 (ro) | 1995-04-04 | 1995-04-04 | Electrolit pentru electrosedimentarea aliajelor de nichel - fosfor |
Country Status (1)
| Country | Link |
|---|---|
| MD (1) | MD529G2 (ro) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4673468A (en) * | 1985-05-09 | 1987-06-16 | Burlington Industries, Inc. | Commercial nickel phosphorus electroplating |
-
1995
- 1995-04-04 MD MD95-0217A patent/MD529G2/ro active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4673468A (en) * | 1985-05-09 | 1987-06-16 | Burlington Industries, Inc. | Commercial nickel phosphorus electroplating |
Non-Patent Citations (2)
| Title |
|---|
| Гальванотехника и обработка поверхностей. Moscova, nr 3, vol. 2, 1993, р. 30. * |
| Ямпольский А.М., Меднение и никелирование. Машиностроение, 1977, р. 71. * |
Also Published As
| Publication number | Publication date |
|---|---|
| MD529F1 (ro) | 1996-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2107967A1 (es) | Baños alcalinos y procedimentos de plaqueado galvanico con zinc y aleaciones de zinc. | |
| CA2156407A1 (en) | Process and arrangement for the electrolytic deposition of metal layers | |
| ES8307933A1 (es) | Un bano de electrodeposicion. | |
| CA2215338A1 (en) | Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys | |
| EP0037535A3 (en) | Plating bath for depositing coatings of gold and gold alloys | |
| CA2166503A1 (en) | Brightening Additive for Tungsten Alloy Electroplate | |
| EP1091023A3 (en) | Alloy composition and plating method | |
| MD529G2 (ro) | Electrolit pentru electrosedimentarea aliajelor de nichel - fosfor | |
| ES8407118A1 (es) | Un metodo de electrochapar un deposito de paladio sobre una pieza de trabajo | |
| GB1498212A (en) | Electroplating bath for producing zinc-copper alloys | |
| JPS5741389A (en) | Cathode for electrolyzing aqueous alkali metal halide and its manufacture | |
| AU2305483A (en) | Cyanide-free copper plating process and alloy anode | |
| CA2093924A1 (en) | Acid bath for copper plating | |
| AU7320996A (en) | Electroplating processes compositions and deposits | |
| DE3262272D1 (en) | Process for the galvanic deposit of a zinc-nickel-alloy layer on a metal object, in particular on steel strip | |
| JPS5770286A (en) | Plating bath composition and plating method | |
| MY114710A (en) | Electrolytic desilvering agents and electrolytic desilvering method | |
| EP0147463A4 (en) | Zn-Ni ALLOY PLATING SOLUTION BASED ON A CHLORIDE BATH. | |
| Tolkmit | MP 4 Plating: Mechanical Plating in the Acids Range | |
| Pushpavanam et al. | Electrodeposition of Nickel-- Iron Alloy From Sulfosalicylate Bath | |
| Campbell et al. | Some uses of pyrophosphates in metal finishing: Part III. Nickel and nickel alloys | |
| CA1053603A (en) | Electrodeposition of gold | |
| BG100165A (en) | Method for producing iron and iron-alloyed nitrogen-containing layers | |
| Lyakhov et al. | Hydrogen Adsorption and Hydrogen Embrittlement of Steel During Electrodeposition of a Titanium--Cadmium Alloy From Stabilized Cyanide--Pertitanate Electrolyte | |
| JPH07252679A (ja) | アルミニウム合金の電食を防止する方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG3A | Granted patent for invention | ||
| IF99 | Valid patent on 19990615 |
Free format text: EXPIRES: 20150404 |