MD1889G2 - Criotron acustoelectronic cu timpul de comutare restructurabil - Google Patents

Criotron acustoelectronic cu timpul de comutare restructurabil Download PDF

Info

Publication number
MD1889G2
MD1889G2 MDA20010061A MD20010061A MD1889G2 MD 1889 G2 MD1889 G2 MD 1889G2 MD A20010061 A MDA20010061 A MD A20010061A MD 20010061 A MD20010061 A MD 20010061A MD 1889 G2 MD1889 G2 MD 1889G2
Authority
MD
Moldova
Prior art keywords
contacts
yba2cu3o7
deposited
acoustic surface
layer
Prior art date
Application number
MDA20010061A
Other languages
English (en)
Russian (ru)
Other versions
MD1889F1 (ro
Inventor
Павел НИСТИРЮК
Дину ЦУРКАНУ
Анатолие АЛЕКСЕЙ
Еуджен БЕРЕГОЙ
Original Assignee
Технический университет Молдовы
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Технический университет Молдовы filed Critical Технический университет Молдовы
Priority to MDA20010061A priority Critical patent/MD1889G2/ro
Publication of MD1889F1 publication Critical patent/MD1889F1/ro
Publication of MD1889G2 publication Critical patent/MD1889G2/ro

Links

Landscapes

  • Superconductor Devices And Manufacturing Methods Thereof (AREA)

Abstract

Invenţia se referă la domeniul electronicii şi este destinată dispozitivelor de memorie şi de comutare utilizate în tehnica de calcul şi de comutare.Dispozitivul conţine o bază din Pb pe care sunt depuse succesiv un strat de absorbţie a undelor acustice de suprafaţă, un strat redresor din ceramică supraconductoare YBa2Cu3O7, un strat de dirijare din piezocristal GaAs în centrul căruia este depus un traductor interdigital din Cr-Al, iar între straturile redresor şi de dirijare sunt depuse contacte din Cr-Cu. Contactele din Cr-Cu sunt amplasate pe perimetrul unei circumferinţe şi conţin contacte longitudinale, amplasate de-a lungul axei cristalografice c a compusului YBa2Cu3O7, care coincid cu direcţia de propagare a undelor acustice de suprafaţă; contacte transversale, amplasate perpendicular axei cristalografice c a compusului YBa2Cu3O7, care sunt perpendiculare direcţiei de propagare a undelor acustice de suprafaţă; contacte intermediare, amplasate pe perimetrul circumferinţei între contactele longitudinale şi cele transversale.
MDA20010061A 2001-03-14 2001-03-14 Criotron acustoelectronic cu timpul de comutare restructurabil MD1889G2 (ro)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MDA20010061A MD1889G2 (ro) 2001-03-14 2001-03-14 Criotron acustoelectronic cu timpul de comutare restructurabil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MDA20010061A MD1889G2 (ro) 2001-03-14 2001-03-14 Criotron acustoelectronic cu timpul de comutare restructurabil

Publications (2)

Publication Number Publication Date
MD1889F1 MD1889F1 (ro) 2002-03-31
MD1889G2 true MD1889G2 (ro) 2002-10-31

Family

ID=19739770

Family Applications (1)

Application Number Title Priority Date Filing Date
MDA20010061A MD1889G2 (ro) 2001-03-14 2001-03-14 Criotron acustoelectronic cu timpul de comutare restructurabil

Country Status (1)

Country Link
MD (1) MD1889G2 (ro)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MD1481G2 (ro) * 1999-02-17 2000-12-31 Технический университет Молдовы Criotron acustoelectronic

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MD1481G2 (ro) * 1999-02-17 2000-12-31 Технический университет Молдовы Criotron acustoelectronic

Also Published As

Publication number Publication date
MD1889F1 (ro) 2002-03-31

Similar Documents

Publication Publication Date Title
AU2430401A (en) Methods of fabricating gallium nitride layers on textured silicon substrates, and gallium nitride semiconductor structures fabricated thereby
AU5044600A (en) Trench semiconductor device having gate oxide layer with multiple thicknesses and processes of fabricating the same
WO2004059751A3 (en) Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices
JP2003151978A5 (ro)
WO2005015065A3 (en) Valve component with multiple surface layers
WO2004062966A3 (en) Molded lightweight foam acoustical barrier and its method of application
DE60033252D1 (de) Mehrschichtige halbleiter-struktur mit phosphid-passiviertem germanium-substrat
AU2002359741A1 (en) Oxide layer on a gaas-based semiconductor structure and method of forming the same
TWI266396B (en) Semiconductor device
DE69727480D1 (de) Schallisolierungsschicht mit integriertem schutzbalg
MY129570A (en) Semiconductor integrated circuit device and a method of manufacturing the same
TW200614420A (en) Semiconductor structure and semiconductor process
AU2001218182A1 (en) Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts, and gallium nitride semiconductor structures fabricated thereby
AU2001259447A1 (en) Surface acoustic wave devices using non-symmetric optimized cuts of a piezoelectric substrate
MD1889G2 (ro) Criotron acustoelectronic cu timpul de comutare restructurabil
DE60134042D1 (de) Parallelebenensubstrat
AU6157798A (en) Ii-vi semiconductor device with bete buffer layer
WO2002101819A3 (en) Leaky, thermally conductive insulator material (ltcim) in a semiconductor-on-insulator (soi) structure
NO862324D0 (no) Innretning basert paa akustiske overflateboelger. (saw-innretning).
AU7389800A (en) Method of etching a wafer layer using multiple layers of the same photoresistantmaterial and structure formed thereby
DE3481884D1 (de) Wenig reflektierende elektrodenanordnung fuer, mit akustischen oberflaechenwellen, arbeitende halbleitereinrichtungen.
MD1481F1 (ro) Criotron acustoelectronic
TW334632B (en) Field effective semiconductor
AU2002361847A1 (en) Silicon on sapphire structure (devices) with buffer layer
WO2002061181A3 (fr) Electrode de grandes dimensions

Legal Events

Date Code Title Description
KA4A Patent for invention lapsed due to non-payment of fees (with right of restoration)
MM4A Patent for invention definitely lapsed due to non-payment of fees