LU77436A1 - - Google Patents

Info

Publication number
LU77436A1
LU77436A1 LU77436A LU77436A LU77436A1 LU 77436 A1 LU77436 A1 LU 77436A1 LU 77436 A LU77436 A LU 77436A LU 77436 A LU77436 A LU 77436A LU 77436 A1 LU77436 A1 LU 77436A1
Authority
LU
Luxembourg
Application number
LU77436A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of LU77436A1 publication Critical patent/LU77436A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
LU77436A 1976-05-31 1977-05-27 LU77436A1 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6238476A JPS52145769A (en) 1976-05-31 1976-05-31 Method of surface treating printed circuit copper foil

Publications (1)

Publication Number Publication Date
LU77436A1 true LU77436A1 (en:Method) 1977-09-09

Family

ID=13198566

Family Applications (1)

Application Number Title Priority Date Filing Date
LU77436A LU77436A1 (en:Method) 1976-05-31 1977-05-27

Country Status (4)

Country Link
JP (1) JPS52145769A (en:Method)
DE (1) DE2724074C2 (en:Method)
GB (1) GB1558919A (en:Method)
LU (1) LU77436A1 (en:Method)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS6249735U (en:Method) * 1985-09-14 1987-03-27
TW317575B (en:Method) * 1994-01-21 1997-10-11 Olin Corp
JP4492434B2 (ja) 2005-05-16 2010-06-30 日立電線株式会社 プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
JP4626390B2 (ja) 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
JP4904933B2 (ja) 2005-09-27 2012-03-28 日立電線株式会社 ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔
CN103266335B (zh) 2007-09-28 2016-08-10 Jx日矿日石金属株式会社 印刷电路用铜箔及覆铜箔层压板
EP2351876A1 (en) 2008-11-25 2011-08-03 JX Nippon Mining & Metals Corporation Copper foil for printed circuit
JPWO2011078077A1 (ja) 2009-12-24 2013-05-09 Jx日鉱日石金属株式会社 表面処理銅箔
SG183311A1 (en) 2010-05-07 2012-09-27 Jx Nippon Mining & Metals Corp Copper foil for printed circuit
WO2012132577A1 (ja) 2011-03-30 2012-10-04 Jx日鉱日石金属株式会社 印刷回路用銅箔
JP5654416B2 (ja) 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
US9115441B2 (en) 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
EP2590487B1 (en) 2011-11-03 2014-05-14 Nan-Ya Plastics Corporation Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
JP6236009B2 (ja) 2012-09-28 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔及びキャリア付き銅箔を用いた銅張積層板
JP6422658B2 (ja) * 2014-02-27 2018-11-14 新光電気工業株式会社 電気めっき浴及び電気めっき方法
JP6954345B2 (ja) * 2017-04-17 2021-10-27 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Also Published As

Publication number Publication date
DE2724074A1 (de) 1977-12-15
JPS569028B2 (en:Method) 1981-02-26
JPS52145769A (en) 1977-12-05
DE2724074C2 (de) 1982-05-13
GB1558919A (en) 1980-01-09

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Legal Events

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