LU56200A1 - - Google Patents
Info
- Publication number
- LU56200A1 LU56200A1 LU56200DA LU56200A1 LU 56200 A1 LU56200 A1 LU 56200A1 LU 56200D A LU56200D A LU 56200DA LU 56200 A1 LU56200 A1 LU 56200A1
- Authority
- LU
- Luxembourg
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US643405A US3373095A (en) | 1967-06-05 | 1967-06-05 | Electroplating of copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| LU56200A1 true LU56200A1 (en:Method) | 1968-09-16 |
Family
ID=24580675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LU56200D LU56200A1 (en:Method) | 1967-06-05 | 1968-06-04 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3373095A (en:Method) |
| AT (1) | AT278464B (en:Method) |
| BE (1) | BE716104A (en:Method) |
| DE (1) | DE1771447C2 (en:Method) |
| ES (1) | ES354519A1 (en:Method) |
| FR (1) | FR1569546A (en:Method) |
| LU (1) | LU56200A1 (en:Method) |
| NL (1) | NL6807883A (en:Method) |
| NO (1) | NO120960B (en:Method) |
| SE (1) | SE345879B (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| CN111593375A (zh) * | 2020-05-15 | 2020-08-28 | 电子科技大学 | 一种用于电子电路电镀铜填孔的整平剂及电镀铜浴 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2424887A (en) * | 1941-10-11 | 1947-07-29 | Houdaille Hershey Corp | Method and electrolyte for the electrodeposition of metals |
| US2805194A (en) * | 1955-07-18 | 1957-09-03 | Dayton Bright Copper Company | Bright copper plating |
| US2931760A (en) * | 1957-09-25 | 1960-04-05 | Leon R Westbrook | Acid copper plating |
| DE1133610B (de) * | 1959-06-06 | 1962-07-19 | Dehydag Gmbh | Saure galvanische Kupferbaeder |
| NL291575A (en:Method) * | 1962-04-16 | |||
| US3252987A (en) * | 1964-03-09 | 1966-05-24 | Eastman Kodak Co | Tetrazolium compound electroplating leveling agent and method of preparation |
-
1967
- 1967-06-05 US US643405A patent/US3373095A/en not_active Expired - Lifetime
-
1968
- 1968-05-22 SE SE6974/68A patent/SE345879B/xx unknown
- 1968-05-25 DE DE1771447A patent/DE1771447C2/de not_active Expired
- 1968-05-27 AT AT505968A patent/AT278464B/de not_active IP Right Cessation
- 1968-05-30 ES ES354519A patent/ES354519A1/es not_active Expired
- 1968-06-04 BE BE716104D patent/BE716104A/xx unknown
- 1968-06-04 NO NO2173/68A patent/NO120960B/no unknown
- 1968-06-04 LU LU56200D patent/LU56200A1/xx unknown
- 1968-06-05 NL NL6807883A patent/NL6807883A/xx unknown
- 1968-06-26 FR FR1569546D patent/FR1569546A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| SE345879B (en:Method) | 1972-06-12 |
| AT278464B (de) | 1970-02-10 |
| DE1771447B1 (de) | 1972-05-04 |
| FR1569546A (en:Method) | 1969-05-30 |
| ES354519A1 (es) | 1970-01-01 |
| DE1771447C2 (de) | 1974-08-22 |
| BE716104A (en:Method) | 1968-11-04 |
| NL6807883A (en:Method) | 1968-12-06 |
| US3373095A (en) | 1968-03-12 |
| NO120960B (en:Method) | 1970-12-28 |