LU501996B1 - Method for Preparing Cu@ZrC Core-shell Multiphase Granular Material by Electroless Plating - Google Patents
Method for Preparing Cu@ZrC Core-shell Multiphase Granular Material by Electroless Plating Download PDFInfo
- Publication number
- LU501996B1 LU501996B1 LU501996A LU501996A LU501996B1 LU 501996 B1 LU501996 B1 LU 501996B1 LU 501996 A LU501996 A LU 501996A LU 501996 A LU501996 A LU 501996A LU 501996 B1 LU501996 B1 LU 501996B1
- Authority
- LU
- Luxembourg
- Prior art keywords
- zrc
- core
- granular material
- treatment
- powder
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Powder Metallurgy (AREA)
Claims (10)
1. Ein Verfahren zur Herstellung von Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie durch stromloses Plattieren, das dadurch gekennzeichnet ist, dass es die folgenden Schritte umfasst: Entfetten, Vergrôbern, Sensibilisieren, Aktivieren und Dispergieren von ZrC-Pulver nacheinander, um mit Kupfer zu beschichtendes ZrC-Pulver zu erhalten, und anschlieBende stromlose Verkupferung des ZrC-Pulvers, um die Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie zu erhalten.
2. Das Verfahren zur Herstellung von Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie durch stromloses Plattieren nach Anspruch 1, das dadurch gekennzeichnet ist, dass die Entfettungsbehandlung die folgenden Schritte umfasst: Einweichen des ZrC-Pulvers in NaOH-Losung, Filtrieren, Reinigen und Trocknen; die Vergroberungsbehandlung umfasst die folgenden Schritte: die Ultraschallbehandlung des entfetteten ZrC-Pulvers in HNOs-Losung, Filtrieren, Reinigen und Trocknen, wobei die Konzentration der HNOs-Losung 40Vol.-% beträgt.
3. Das Verfahren zur Herstellung von Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie durch stromloses Plattieren nach Anspruch 1, das dadurch gekennzeichnet ist, dass die Sensibilisierungsbehandlung die folgenden Schritte umfasst: Ultraschallbehandlung, Reinigung und Filterung des vergroberten ZrC-Pulvers in der Sensibilisierungslôsung; und die Sensibilisierungslôsung ist eine Mischlôsung aus SnCl2 und HCI.
4. Das Verfahren zur Herstellung von Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie durch stromloses Plattieren nach Anspruch 3, das dadurch gekennzeichnet ist, dass die Konzentration von SnCl2 und HCI in der Sensibilisierungslosung 20 g/l bzw. 20 g/l beträgt.
5. Das Verfahren zur Herstellung von Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie durch stromloses Plattieren nach Anspruch 1, das dadurch gekennzeichnet ist, dass die Aktivierungsbehandlung die folgenden Schritte umfasst: Ultraschallbehandlung des sensibilisierten ZrC-Pulvers in AgNOz;-Lôsung, Filtrierung und Reinigung bis zur Neutralität, wobei die Konzentration der AgNOs-Losung 5 g/l beträgt.
6. Das Verfahren zur Herstellung von Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie durch stromloses Plattieren nach Anspruch 1, das dadurch gekennzeichnet ist, dass die Dispersionsbehandlung die folgenden Schritte umfasst: Dispergieren des aktivierten ZrC-Pulvers mit einem Dispersionsmittel, um mit Kupfer zu beschichtendes ZrC-Pulver zu erhalten, wobei das Dispergiermittel eine gemischte Losung aus Natriumpyrophosphat und Wasserglas ist und 50 1996 die Konzentration von Natriumpyrophosphat in dem Dispergiermittel 0,5 Gew.-% beträgt.
7. Das Verfahren zur Herstellung von Cu(@ZrC Kern-Schale-Mehrphasen-Granulare Materie durch stromloses Plattieren nach Anspruch 1, das dadurch gekennzeichnet ist, dass die stromlose Verkupferungsbehandlung wie folgt umfasst: Zugabe von Kupfersulfat, Komplexbildner, Puffermittel und Katalysator in Wasser, um eine gemischte Losung zu erhalten, Einstellung des pH-Werts der gemischten Lôsung auf 11, und dann Zugabe von mit Kupfer zu beschichtendem ZrC-Pulver und von Reduktionsmittel, um ein Reaktionssystem fiir stromlose Verkupferung zu erhalten, wobei das Reaktionssystem fiir stromlose Verkupferung bei einer Temperatur von 60°C reagiert, Filtrieren nach Beendigung der Reaktion, Reinigen und Trocknen, um die Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie zu erhalten.
8. Das Verfahren zur Herstellung von Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie durch stromloses Plattieren nach Anspruch 1, das dadurch gekennzeichnet ist, dass der Komplexbildner Trinatriumcitrat ist, das Puffermittel Borsäure ist, der Katalysator Nickelchloridhexahydrat ist und das Reduktionsmittel Natriumhypophosphit ist, und das Massenverhältnis von Kupfersulfat zu mit Kupfer zu beschichtendem ZrC-Pulver zu Natriumhypophosphit beträgt 40:20:15; während des gesamten Reaktionsprozesses wurde der pH-Wert des Reaktionssystems für stromlose Verkupferung bei 10,5-11,5 gehalten.
9. Fine Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie, hergestellt nach dem stromlosen Plattierungsverfahren zur Herstellung von Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie nach einem der Anspriiche 1-8.
10. Eine Anwendung der Cu@ZrC Kern-Schale-Mehrphasen-Granulare Materie, hergestellt durch stromloses Plattieren, in Metallmatrix-Verbundwerkstoffen nach Anspruch 9.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210250800.3A CN114606482A (zh) | 2022-03-15 | 2022-03-15 | 一种化学镀制备Cu@ZrC核壳复相颗粒材料的方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| LU501996B1 true LU501996B1 (en) | 2022-11-03 |
Family
ID=81863220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LU501996A LU501996B1 (en) | 2022-03-15 | 2022-05-03 | Method for Preparing Cu@ZrC Core-shell Multiphase Granular Material by Electroless Plating |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114606482A (de) |
| LU (1) | LU501996B1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115445615B (zh) * | 2022-09-13 | 2023-06-13 | 中南大学 | 一种纳米金属核-壳结构的制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3858971B2 (ja) * | 2001-05-16 | 2006-12-20 | 上村工業株式会社 | 微粒子の無電解めっき方法 |
| CN101758230A (zh) * | 2009-09-24 | 2010-06-30 | 温州宏丰电工合金有限公司 | 颗粒表面化学镀覆金属的方法 |
| CN103436728B (zh) * | 2013-08-27 | 2016-11-23 | 西北工业大学 | 强韧化金属基复合材料的制备方法 |
| CN104651815A (zh) * | 2014-12-11 | 2015-05-27 | 裴洁 | 一种制备ZrB2-Cu复合粉末的方法 |
| CN107177839B (zh) * | 2017-05-17 | 2019-05-10 | 河南科技大学 | 一种在TiB2颗粒表面镀铜的方法 |
| CN108080644B (zh) * | 2017-12-08 | 2021-06-25 | 中国科学院金属研究所 | 一种高强韧化金属基复合材料的粉末冶金制备方法 |
| CN108118315A (zh) * | 2018-02-24 | 2018-06-05 | 唐山师范学院 | 一种镀层均匀稳定的碳化硅粉体表面化学镀镍的方法 |
| CN108385090B (zh) * | 2018-02-27 | 2020-05-08 | 北京交通大学 | 一种核/壳结构的Ti3C2烯/Cu粉体及其制备方法 |
-
2022
- 2022-03-15 CN CN202210250800.3A patent/CN114606482A/zh active Pending
- 2022-05-03 LU LU501996A patent/LU501996B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN114606482A (zh) | 2022-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109706438B (zh) | 一种表面改性zta陶瓷颗粒增强钢铁基复合材料的制备方法 | |
| KR0180769B1 (ko) | 고강도 및 고내마모성 다이아몬드 소결체 및 이의 제조방법 | |
| Pang et al. | Significance of sensitization process in electroless deposition of Ni on nanosized Al2O3 powders | |
| LU501996B1 (en) | Method for Preparing Cu@ZrC Core-shell Multiphase Granular Material by Electroless Plating | |
| Agarwala et al. | Electroless Ni‐P Based Nanocoating Technology—A Review | |
| CN110195167B (zh) | 一种镍合金骨架增强金属基复合材料及其制备方法 | |
| Xu et al. | Preparation of nickel-coated graphite by electroless plating under mechanical or ultrasonic agitation | |
| Pal et al. | Characterization of the interface between ceramics reinforcement and lead-free solder matrix | |
| CN110699676A (zh) | 一种高强度高电导率的金属玻璃复合材料及其制备方法 | |
| Xi et al. | Effect of phosphorus content on the properties of Ni-P coated diamond | |
| CN101161841A (zh) | 一种超细硬质合金复合粉末及其制造方法 | |
| Li et al. | Microstructure and mechanical properties investigation of WCu composites prepared from dual-layer coated powders | |
| CN109676130A (zh) | 一种铜元素改性铜基石墨耐磨液压柱塞泵缸体的制备方法 | |
| Guo et al. | Kinetic study of electroless cobalt deposition on WC particles | |
| Ru et al. | Preparation and characterization of Ni-Cu dual coated ZTA particles by ionic liquid-assisted electroless plating as reinforcement of metal-based composites | |
| Chee et al. | Preparation and characterization of copper/copper coated silicon carbide composites | |
| CN113649566B (zh) | 一种W-Ni-Sn-P-Cu基复合粉体及其制备方法和应用 | |
| Hu et al. | Preparation of spherical WC–W2C composite powder via noble metal-free catalytic electroless nickel plating for selective laser melting | |
| CN113199024B (zh) | 三元层状化合物、金属基复合材料及其制作方法和原料 | |
| KR100545107B1 (ko) | 무전해니켈도금법에 의한 니켈-다이아몬드 복합분말제조방법 | |
| CN101439404A (zh) | 一种钴包覆铜复合粉末及其制备 | |
| Li et al. | Preparation of metal matrix nanocomposite powder using electroless plating | |
| CN108486553B (zh) | 碳化硅粉体镀镍方法 | |
| Yönetken et al. | The effect of microwave sintering on the properties of electroless Ni plated WC-Fe-Ni composites | |
| CN107974675A (zh) | 一种高强铝合金及其制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Patent granted |
Effective date: 20221103 |