LU101694B1 - Semiconductor piezoresistive icing detector and workling method thereof - Google Patents
Semiconductor piezoresistive icing detector and workling method thereof Download PDFInfo
- Publication number
- LU101694B1 LU101694B1 LU101694A LU101694A LU101694B1 LU 101694 B1 LU101694 B1 LU 101694B1 LU 101694 A LU101694 A LU 101694A LU 101694 A LU101694 A LU 101694A LU 101694 B1 LU101694 B1 LU 101694B1
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- Prior art keywords
- semiconductor
- icing
- piezoresistive
- icing detector
- fixing frame
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000010586 diagram Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 241000160771 Erebia rossii Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D15/00—De-icing or preventing icing on exterior surfaces of aircraft
- B64D15/20—Means for detecting icing or initiating de-icing
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- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geophysics And Detection Of Objects (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention relates to a semiconductor piezoresistive icing detector and a working method. The icing detector comprises a semiconductor fixing frame, the semiconductor fixing frame is fixedly connected to a skin of a wing to be tested, a semiconductor capable of axially sliding up and down is disposed inside the semiconductor fixing frame, the bottom of the semiconductor is in contact with one end of an insulating ball inside the skin, the other end of the insulating ball is in contact with a pressure sensor, the pressure sensor is fixed to the tip of an ejector pin inside the skin, and the other end of the ejector pin is connected to the wing to be tested through a spring. The icing detector has simple structure, high precision and high reliability, and meets the requirements of flight safety guarantee, flight reference and the like of airplanes.
Description
SEMICONDUCTOR PIEZORESISTIVE ICING DETECTOR AND LU101694 f Field of the Invention | The present invention relates to the field of aeronautic technology, and in particular to | a semiconductor piezoresistive icing detector and a working method thereof. | Background of the Invention ; Icing on the surface of an aircraft, such as an airplane, occurs in an arctic-alpine zone or a high-latitude region with high humidity, which will seriously affect the flight } ! performance and even cause the aircraft to lose control.
Therefore, it is necessary to } design an icing detection system and improve the precision of an icing detector. | The existing airplane icing sensor, which mainly detects icing by using optical fibers | and the pneumatic principle, has certain defects and problems in structural design.
For | example, the conventional pneumatic icing signal sensor cannot distinguish icing | blockage from foreign matters such as dust.
As a result, when dust blocks an air inlet, | an icing detection signal is given to alarm, causing a high false alarm rate of the | conventional icing signal sensor.
Therefore, it is urgently needed to improve the 3 adaptability and improve the precision of icing detection, and it is necessary to design | and invent a device that can monitor the icing status and icing thickness on the surface | of an airplane on line. | Summary of the Invention | The present invention aims to overcome the above shortcomings in the prior art and | provide a semiconductor piezoresistive icing detector, which has simple structure, Î high precision and strong reliability, can be used for monitoring and warning ice on 2 the surface of an airplane wing, can obtain the thickness of the ice by calibration and | calculation, and can meet the requirements of flight safety guarantee, flight reference | and the like of airplanes. | In order to achieve the above objective, the present invention adopts the following | eee eTfechnica] Solution. EN, nn. 107690 A semi AN py Micondactoy i . ) a 1 the semicong F Meludes à sem | “ N Uctor fixin & . Semiconducto, . tested, à sem: 8 frame is fixed] \, > Semicondy Y connected . ctor Capable . fo a Skin of semi of axially slidin aw, Miconductor fixing f $ UP and down is dis : Tame, the poy, Posed inside n ; PR ; Sulating bal] inside the skin, ıh In contact with one | contact with » the other end of the insulat; KA à pressure sensor. the pressure lating ball is in / [ ; Sensor is fixed to the 1 A | ; et i ; : / Inside the skin, and the other end of the ei : * of an ejector pin ) of the ejector pin is co . < nnected to the wing to b © tested through a spring. e | Further, the semicond ay | uctor is cylin, ; . | ylindrical, a plurality of sliders are uniformly A | distri i ; . | buted on the lateral circumferential surface of the semiconductor, semiconductor | wires are connected to the bottom of the semiconductor, and the semiconductor wires : are used for forming a closed circuit together with an external system. | | Further, the semiconductor fixing frame is of a cylindrical structure matching the | shape of the semiconductor, the inner circumferential surface fixedly connected to the ; | semiconductor is provided with a plurality of chutes matching the sliders, the chutes | . are longer than the sliders, the bottom surface of the semiconductor fixing frame is | . provided with an opening, and the opening is used for the contact between the bottom | / / of the semiconductor and the insulating ball. | Further, the spring is a light spring. ; . Further, the ejector pin includes a cylindrical section and a conical section, the | pressure sensor is fixed to the tip of the conical section, one end of the cylindrical ; | section is fixedly connected to the conical section and the other end is provided with a ; sleeve section, the diameter of the sleeve section is smaller than that of the cylindrical | .
section, the light spring is sleeved on the sleeve section, one end of the light spring is | connected to the end face of the cylindrical section and the other end is connected to | _ the internal structure of the wing to be tested. Ë . Further, a through hole penetrates the cylindrical section, the conical section and the | sleeve section, and a sensor wire connected to the pressure sensor is disposed in the | through hole. |
The present invention also discloses a working method of the semiconductor LU101694 piezoresistive icing detector, including the following steps: Step 1: calibrating the semiconductor piezoresistive icing detector before an airplane flies, and setting an electrical signal threshold for alarm in the circuit of the semiconductor. Step 2: mounting a plurality of semiconductor piezoresistive icing detectors on a wing to be tested, and detecting the current change value and icing thickness in the semiconductor connection circuit in real time when the airplane flies. Further, in step 1, the semiconductor piezoresistive icing detector is calibrated in an icing wind tunnel environment. Further, the specific working method of step 2 is: when the surface of the airplane wing is iced, the resistance of the semiconductor changes under the pressure, the current in the circuit connected to the semiconductor changes, the ice thickness is ; calculated in real time according to the change value of the acquired current signal, ; 15 and an alarm is given when the current change value exceeds the threshold. | Further, when the ice thickness is calculated, the pressure value detected by the pressure sensor is used to compensate for changes in the resistance of the | semiconductor caused by external factors. | 20 Beneficial effects of the invention: | 1. The semiconductor piezoresistive icing detector of the present invention has a simple structure. The ice thickness on the surface of the aircraft wing is calculated by | using the piezoresistive characteristics of the semiconductor, which solves the | problem of high false alarm rate of the existing airplane icing sensor, and has high ) 25 reliability. | 2. The semiconductor piezoresistive icing detector of the present invention compensates for changes in the resistance of the semiconductor caused by external factors by means of the pressure sensor, has accurate detection result and high precision, and meets the requirements of flight safety guarantee, flight reference and the like of airplanes.
Brief Description of the Drawings The accompanying drawings constituting a part of the present application are used for providing a further understanding on the present application, and the schematic embodiments of the present application and the descriptions thereof are used for interpreting the present application, rather than constituting improper limitations to the present application. Fig. 1 is a schematic assembly diagram of an icing detector and a skin according to the present invention; Fig. 2 is a schematic structural diagram of a semiconductor according to the present | invention; | Fig. 3 is a schematic structural diagram of a semiconductor fixing frame according to ! the present invention; Fig. 4 is a schematic structural diagram of an ejector pin according to the present | 15 invention; Fig. 5 is a schematic diagram of the present invention in a usage state. | In the figures: 1. semiconductor fixing frame, 1-1. chute, 1-2. opening, 2. skin, 3. | semiconductor, 3-1. slider, 3-2. semiconductor wire, 4. insulating ball, 5. pressure | sensor, 5-1. sensor wire, 6. ejector pin, 6-1. cylindrical section, 6-2. conical section, 6-3. sleeve section, 6-4. through hole, 7. spring. | Detailed Description of Embodiments | It should be pointed out that the following detailed descriptions are all exemplary and | aim to further illustrate the present application. Unless otherwise specified, all technical and scientific terms used in the descriptions have the same meanings generally understood by those of ordinary skill in the art of the present application. It should be noted that the terms used herein are merely for describing specific embodiments, but are not intended to limit exemplary embodiments according to the present application. As used herein, unless otherwise explicitly pointed out by the context, the singular form is also intended to include the plural form. In addition, it
TTTshould also be understood that when the terms “include” and/or “comprise” are used LU101694 in the specification, they indicate features, steps, operations, devices, components and/or their combination.
For the convenience of description, the terms “upper”, “lower”, “left” and “right” in 5 the present invention only indicate the upper, lower, left and right directions of the drawings, do not limit the structure, are only for the convenience of description and the simplification of description, do not indicate or imply that the devices or elements must have specific directions or be constructed and operated in specific directions, | and therefore cannot be understood as limitations to the present invention. | 10 As described in the background art, the existing airplane icing sensor, which detects icing by using optical fibers and the pneumatic principle, has certain defects and | problems in design.
In view of the problems, the present application proposes a | semiconductor piezoresistive icing detector. ‘ In a typical embodiment of the present application, as shown in Figs. 1-5, a semiconductor piezoresistive icing detector includes a semiconductor fixing frame 1. | During use, the semiconductor fixing frame is fixedly connected to a skin 2 of a wing | to be tested by rivets, the skin is provided with a mounting hole for mounting the | semiconductor piezoresistive icing detector, a semiconductor 3 capable of axially | sliding up and down is disposed inside the semiconductor fixing frame, the bottom of | 20 the semiconductor is in contact with one end of an insulating ball 4 inside the mounting hole on the skin, the other end of the insulating ball is in contact with a pressure sensor 5, the pressure sensor is fixed to the tip of an ejector pin 6 inside the | mounting hole on the skin, and the other end of the ejector pin is connected to the | wing to be tested through a spring 7. | 25 The semiconductor 3 has a cylindrical structure, a plurality of sliders 3-1 are uniformly distributed on the outer circumferential surface of the semiconductor, semiconductor wires 3-2 are disposed at the bottom of the semiconductor, the semiconductor wires pass through the skin and are connected to a control device of an external system to form a closed circuit, the semiconductor moves along chutes under pressure to change the resistance, and a current signal in the closed circuit is ET eeecorrespondingly changed and transmitted to the control device of the external system.
LU101694 The semiconductor fixing frame 1 is of a cylindrical structure matching the shape of the semiconductor, its upper end is not sealed, and its inner cylindrical surface is provided with a plurality of chutes 1-1 matching the sliders, and the chutes are longer than the sliders.
During installation, the semiconductor is placed inside the semiconductor fixing frame, the sliders are embedded into the corresponding chutes, | and the semiconductor can slide up and down along the axis of the semiconductor fixing frame.
The bottom surface of the semiconductor fixing frame is provided with a circular opening 1-2, and the circular opening is used for the contact between the ; 10 bottom surface of the semiconductor and the insulating ball. : The insulating ball is made of an insulating material, which can prevent a | measurement error caused by a short circuit between the semiconductor and the | pressure sensor. | The ejector pin 6 includes a cylindrical section 6-1 and a conical section 6-2 integrally | 15 connected, the pressure sensor is fixed to the tip of the conical section, the pressure | sensor is in contact with the insulating ball, the insulating ball is in approximate point | contact with the ejector pin, and the insulating ball is in point contact with the bottom | surface of the semiconductor.
Through the point contact, the precision of change in | the resistance of the semiconductor is improved.
One end of the cylindrical section is | 20 integrally connected with the conical section, the other end is integrally connected | with a sleeve section 6-3, and the diameter of the sleeve section is smaller than that of the cylindrical section.
The spring 7 is sleeved on the sleeve section, one end of the | spring is connected to the end face of the cylindrical section, and the other end is connected to the internal structure of the wing inside the wing skin.
The spring can ensure the contact between the pressure sensor and the insulating ball and between the insulating ball and the bottom surface of the semiconductor.
The cylindrical section, the conical section and the sleeve section are provided with a through hole 6-4 penetrating the entire ejector pin, and a sensor wire 5-1 connected to the pressure sensor is disposed in the through hole and used to transmit a pressure signal detected by the pressure sensor to the control device of the external system.
The spring is a light spring, so the change of the pressure sensor caused by the flying LU101694 acceleration of the light spring can be ignored, and measurement errors induced by the spring are prevented.
The present invention also discloses a working method of the semiconductor piezoresistive icing detector, including the following steps: Step 1: calibrating the detector in an icing wind tunnel environment before flying, and setting a threshold of a current change signal in the circuit connected to the | semiconductor during alarm. | Step 2: arranging a plurality of icing detectors on a wing of an airplane as required to | 10 monitor the icing status in real time when the airplane flies. ) In step 2, the working method of the icing detector is specifically: when the surface of | the wing is iced, the ice layer on the surface of the wing generates vertical pressure on | the semiconductor, the semiconductor moves within the semiconductor fixing frame | along the chutes, the resistance of the semiconductor changes, current data in the circuit connected to the semiconductor also changes, whether there is ice is judged by | monitoring the change of current in the closed circuit, and the thickness of the ice is | calculated; when the change value of the current exceeds the threshold, an alarm signal is given; and when the thickness of the ice is calculated, the pressure sensor can | also measure changes in the pressure on the semiconductor due to external factors | 20 such as flight acceleration, airplane body vibration and wind resistance, and the | changes in the resistance of the semiconductor caused by the external factors are | compensated, thereby improving the calculation precision of the ice thickness. { The icing detector of the present invention has simple structure, high monitoring | precision and high reliability, can be used for monitoring and warning ice on the surface of the airplane wing, can obtain the thickness of the ice, and can meet the requirements of flight safety guarantee, flight reference and the like of airplanes.
Although the specific embodiments of the present invention are described above in combination with the accompanying drawings, the protection scope of the present invention is not limited thereto. It should be understood by those skilled in the art that various modifications or variations could be made by those skilled in the art based on
. . . . . . LU101694 the technical solution of the present invention without any creative effort, and these modifications or variations shall fall into the protection scope of the present invention.
Claims (10)
1. À semiconductor piezoresistive icing detector, comprising a semiconductor fixing frame, wherein the semiconductor fixing frame is fixedly connected to a skin of a wing to be tested, a semiconductor capable of axially sliding up and down is disposed inside the semiconductor fixing frame, the bottom of the semiconductor is in contact | with one end of an insulating ball inside the skin, the other end of the insulating ball is | in contact with a pressure sensor, the pressure sensor is fixed to the tip of an ejector | pin inside the skin, and the other end of the ejector pin is connected to the wing to be | tested through a spring. |
2. The semiconductor piezoresistive icing detector according to claim 1, wherein the Ë semiconductor is cylindrical, a plurality of sliders are uniformly distributed on the 3 lateral circumferential surface of the semiconductor, and semiconductor wires are | connected to the bottom of the semiconductor. ;
3. The semiconductor piezoresistive icing detector according to claim 2, wherein the È semiconductor fixing frame is of a cylindrical structure matching the shape of the F semiconductor, the inner circumferential surface fixedly connected to the | semiconductor is provided with a plurality of chutes matching the sliders, the chutes | are longer than the sliders, the bottom surface of the semiconductor fixing frame is © provided with an opening, and the opening is used for the contact between the bottom ; of the semiconductor and the insulating ball. i
4. The semiconductor piezoresistive icing detector according to claim 1, wherein the } spring is a light spring. 1
5. The semiconductor piezoresistive icing detector according to claim 4, wherein the ; ejector pin comprises a cylindrical section and a conical section, the pressure sensor is | ; fixed to the tip of the conical section, one end of the cylindrical section is fixedly : connected to the conical section and the other end is provided with a sleeve section, .
the diameter of the sleeve section is smaller than that of the cylindrical section, the f light spring is sleeved on the sleeve section, one end of the light spring is connected to .
the end face of the cylindrical section and the other end is connected to the internal 2 9 I amm Tm | 10 structure of the wing to be tested. LU101694
6. The semiconductor piezoresistive icing detector according to claim 5, wherein a through hole penetrates the cylindrical section, the conical section and the sleeve section, and a sensor wire connected to the pressure sensor is disposed in the through hole.
7. A working method of the semiconductor piezoresistive icing detector according to any one of claims 1-6, comprising the following steps: step 1: calibrating the semiconductor piezoresistive icing detector before an airplane flies, and setting an electrical signal threshold for alarm in the circuit of the | semiconductor; and | step 2: mounting a plurality of semiconductor piezoresistive icing detectors on a wing / to be tested, and detecting the current change value and icing thickness in the | semiconductor connection circuit in real time when the airplane flies. |
8. The working method according to claim 7, wherein in step 1, the semiconductor | piezoresistive icing detector is calibrated in an icing wind tunnel environment. '
9. The working method according to claim 7, wherein the specific working method of : step 2 is: when the surface of the airplane wing is iced, the resistance of the Ë semiconductor changes under the pressure, the current in the circuit connected to the ' semiconductor changes, the ice thickness is calculated in real time according to the ; change value of the acquired current signal, and an alarm is given when the current | change value exceeds the threshold. ]
10. The working method according to claim 9, wherein when the ice thickness is | calculated, the pressure value detected by the pressure sensor is used to compensate ; for changes in the resistance of the semiconductor caused by external factors. | bo a a a a EEE ESS
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811131681.XA CN109141210B (en) | 2018-09-27 | 2018-09-27 | A kind of semiconductor pressure resistance icing detector and working method |
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| LU101694A1 LU101694A1 (en) | 2020-03-31 |
| LU101694B1 true LU101694B1 (en) | 2020-08-03 |
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| LU101694A LU101694B1 (en) | 2018-09-27 | 2019-09-20 | Semiconductor piezoresistive icing detector and workling method thereof |
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| CN (1) | CN109141210B (en) |
| LU (1) | LU101694B1 (en) |
| WO (1) | WO2020063491A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109141210B (en) * | 2018-09-27 | 2019-10-15 | 山东大学 | A kind of semiconductor pressure resistance icing detector and working method |
| CN109781017B (en) * | 2019-03-21 | 2020-09-01 | 四川嘉瑞丰科技有限公司 | Rapid calibration method of optical fiber type icing sensor |
| CN115628876B (en) * | 2022-12-08 | 2023-03-14 | 中国航空工业集团公司沈阳空气动力研究所 | Icing wind tunnel icing and substrate material adhesion force measuring device |
| CN117006003A (en) * | 2023-03-29 | 2023-11-07 | 哈尔滨理工大学 | Intelligent ultrasonic deicing method for wind driven generator blade |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5559302A (en) * | 1978-10-30 | 1980-05-02 | Mayekawa Mfg Co Ltd | Freezing thickness detector |
| GB2475553A (en) * | 2009-11-24 | 2011-05-25 | Qinetiq Ltd | A sensor arrangement for determining the rate of ice formation |
| CN103512484B (en) * | 2013-09-29 | 2016-08-17 | 华北水利水电大学 | Brill formula ice layer thickness automatic measuring instrument and measuring method thereof |
| CN103954209A (en) * | 2014-05-13 | 2014-07-30 | 湖南大学 | Ice coating monitoring system and method for fan blade based on piezoelectric materials |
| US9714876B2 (en) * | 2015-03-26 | 2017-07-25 | Sensata Technologies, Inc. | Semiconductor strain gauge |
| CN108061534A (en) * | 2017-10-30 | 2018-05-22 | 哈尔滨理工大学 | A kind of novel electric power circuit Snow Thickness monitors system |
| CN108195282B (en) * | 2017-12-22 | 2020-11-03 | 太原理工大学 | Ice layer thickness measuring device based on piezoresistive sensor |
| CN108180819B (en) * | 2017-12-22 | 2019-10-15 | 太原理工大学 | A kind of ice layer thickness measuring device based on magnetoelastic material |
| CN108444375B (en) * | 2018-02-05 | 2020-01-17 | 哈尔滨工程大学 | Real-time measuring device and measuring system for ice layer thickness of ice water pool |
| CN109141210B (en) * | 2018-09-27 | 2019-10-15 | 山东大学 | A kind of semiconductor pressure resistance icing detector and working method |
-
2018
- 2018-09-27 CN CN201811131681.XA patent/CN109141210B/en active Active
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2019
- 2019-09-20 LU LU101694A patent/LU101694B1/en active IP Right Grant
- 2019-09-20 WO PCT/CN2019/107110 patent/WO2020063491A1/en active Application Filing
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| Publication number | Publication date |
|---|---|
| WO2020063491A1 (en) | 2020-04-02 |
| CN109141210A (en) | 2019-01-04 |
| LU101694A1 (en) | 2020-03-31 |
| CN109141210B (en) | 2019-10-15 |
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