KR980007882A - V cutting test method of printed circuit board - Google Patents

V cutting test method of printed circuit board Download PDF

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Publication number
KR980007882A
KR980007882A KR1019960022605A KR19960022605A KR980007882A KR 980007882 A KR980007882 A KR 980007882A KR 1019960022605 A KR1019960022605 A KR 1019960022605A KR 19960022605 A KR19960022605 A KR 19960022605A KR 980007882 A KR980007882 A KR 980007882A
Authority
KR
South Korea
Prior art keywords
printed circuit
circuit board
light
cutting
thin film
Prior art date
Application number
KR1019960022605A
Other languages
Korean (ko)
Other versions
KR100203666B1 (en
Inventor
권이장
고형석
Original Assignee
김연혁
대덕산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김연혁, 대덕산업 주식회사 filed Critical 김연혁
Priority to KR1019960022605A priority Critical patent/KR100203666B1/en
Publication of KR980007882A publication Critical patent/KR980007882A/en
Application granted granted Critical
Publication of KR100203666B1 publication Critical patent/KR100203666B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

본 발명은 소정의 크기를 금속박막을 인쇄회로기판의 V커팅 절단면에 절단면보다 크게 형성한 후 V커팅을 실시하고, 상기 절단된 금속박막에 광학에 의한 빛을 조사한 후 반사되는 빛을 감지하여 반사되는 빛의 양이 적거나 많게 된 경우 불량처리하며, 반사된 빛의 양이 적당할 경우 합격품으로 처리하여 다양한 패턴을 갖는 인쇄회로기판에 대응할 수 있어서 검사장비에 대한 별도의 가공비가 필요없으며, 어긋나게 가공된 V커팅도 검사가 가능하도록 한 것이다.According to the present invention, a metal thin film having a predetermined size is formed on the V-cutting cut surface of the printed circuit board to be larger than the cut surface, and then V-cutting is performed. After the irradiated light by the optical to the cut metal thin film, the reflected light is sensed and reflected. If the amount of light is small or too large, it is treated badly, and if the amount of reflected light is appropriate, it can be treated as a pass product to cope with printed circuit boards having various patterns, so that no separate processing cost for inspection equipment is required. Machined V-cutting is also available for inspection.

Description

인쇄회로기판의 V커팅 검사방법V cutting test method of printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명을 나타낸 평면도.2 is a plan view showing the present invention.

제3도는 본 발명에서 정확히 가공된 상태를 나나낸 평면도.3 is a plan view showing a state accurately processed in the present invention.

제4도는 본 발명에서 잘못 가공된 상태를 나타낸 평면도로서.4 is a plan view showing a state incorrectly processed in the present invention.

제4a도는 가공깊이가 적은 경우를 나타낸 평면도.4A is a plan view showing a case where the processing depth is small.

제4b도는 가공이 일측으로 기울어진 경우를 나타낸 평면도.Figure 4b is a plan view showing a case where the processing is inclined to one side.

Claims (1)

인쇄회로기판(6)의 불량을 검사하는 인쇄회로기판의 불량검사방법에 있어서, 회로를 인쇄한 인쇄회로기판에 금속박막을 V커팅되는 위치에 형성하는 단계와, 상기 인쇄회로기판을 V커팅 한 후 절단된 금속박막에 빛을 조사하는 단계와, 조사된 빛이 반사되어 감지부에 반사량이 인식되는 단계와, 빛이 감지부에 인식되어 마이컴이 불량품과 정상품을 판단하는 단계와, 상기 마이컴에 의하여 판단된 신호를 출력하는 단계로 구성한 것을 특징으로 하는 인쇄회로기판의 V커팅 검사방법.A defect inspection method of a printed circuit board for inspecting a defect of a printed circuit board (6), comprising the steps of: forming a metal thin film on the printed circuit board at the position where the printed circuit board is V-cutted; And then irradiating light to the cut metal thin film, reflecting the irradiated light to recognize the amount of reflection on the sensing unit, and detecting the defective and genuine products by the microcomputer as the light is recognized on the sensing unit; The V-cutting inspection method of the printed circuit board, characterized in that configured to output the signal determined by.
KR1019960022605A 1996-06-20 1996-06-20 V cutting detection method of pcb KR100203666B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960022605A KR100203666B1 (en) 1996-06-20 1996-06-20 V cutting detection method of pcb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960022605A KR100203666B1 (en) 1996-06-20 1996-06-20 V cutting detection method of pcb

Publications (2)

Publication Number Publication Date
KR980007882A true KR980007882A (en) 1998-03-30
KR100203666B1 KR100203666B1 (en) 1999-06-15

Family

ID=19462684

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960022605A KR100203666B1 (en) 1996-06-20 1996-06-20 V cutting detection method of pcb

Country Status (1)

Country Link
KR (1) KR100203666B1 (en)

Also Published As

Publication number Publication date
KR100203666B1 (en) 1999-06-15

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