KR980006179A - How to remove metal pad stain - Google Patents

How to remove metal pad stain Download PDF

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Publication number
KR980006179A
KR980006179A KR1019960023214A KR19960023214A KR980006179A KR 980006179 A KR980006179 A KR 980006179A KR 1019960023214 A KR1019960023214 A KR 1019960023214A KR 19960023214 A KR19960023214 A KR 19960023214A KR 980006179 A KR980006179 A KR 980006179A
Authority
KR
South Korea
Prior art keywords
metal pad
remove metal
stain
wire bonding
pad stain
Prior art date
Application number
KR1019960023214A
Other languages
Korean (ko)
Inventor
송치화
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019960023214A priority Critical patent/KR980006179A/en
Publication of KR980006179A publication Critical patent/KR980006179A/en

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Abstract

본 발명은 반도체 칩의 조립 공정에서 와이어 본딩을 실시하기 전에 칩 상부면에 있는 노출된 금속 패드의 표면에 형성되는 스테인을 아르곤 스퍼터링 식각 방법으로 제거하는 것이다. 그로 인하여 후속의 와이어 본딩이 제대로 이루어지도록 하는 것이다.The present invention is to remove the stain formed on the surface of the exposed metal pad on the upper surface of the chip by argon sputtering etching method before the wire bonding in the semiconductor chip assembly process. This ensures that subsequent wire bonding is done properly.

Description

금속 패드 스테인 제거방법How to remove metal pad stain

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의해 금속 패드의 표면에 발생된 스테인을 아르곤 스퍼터링 식각 방법으로 제거하는 것을 도시한 단면도.2 is a cross-sectional view showing the removal of the stain generated on the surface of the metal pad by the argon sputter etching method according to the present invention.

Claims (2)

와이어 본딩을 하기 전에 칩 상부면에 있는 금속 패드에 형성된 스테인을 아르곤 스퍼터링 식각 방법으로 제거하는 것을 특징으로 하는 금속 패드 스테인 제거방법.And removing the stain formed on the metal pad on the upper surface of the chip by argon sputtering etching before wire bonding. 제1항에 있어서, 상기 스퍼터링 식각 방법은 RF 500 Watt에서 실시하는 것을 특징으로 하는 금속 패드 스테인 제거방법.The method of claim 1, wherein the sputtering etching method is performed at RF 500 Watt.
KR1019960023214A 1996-06-24 1996-06-24 How to remove metal pad stain KR980006179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960023214A KR980006179A (en) 1996-06-24 1996-06-24 How to remove metal pad stain

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960023214A KR980006179A (en) 1996-06-24 1996-06-24 How to remove metal pad stain

Publications (1)

Publication Number Publication Date
KR980006179A true KR980006179A (en) 1998-03-30

Family

ID=66288296

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960023214A KR980006179A (en) 1996-06-24 1996-06-24 How to remove metal pad stain

Country Status (1)

Country Link
KR (1) KR980006179A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57126149A (en) * 1981-01-30 1982-08-05 Seiko Instr & Electronics Ltd Manufacture of semiconductor device
JPH01111357A (en) * 1987-10-26 1989-04-28 Seiko Epson Corp Semiconductor device
JPH03262122A (en) * 1990-03-13 1991-11-21 Fujitsu Ltd Manufacture of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57126149A (en) * 1981-01-30 1982-08-05 Seiko Instr & Electronics Ltd Manufacture of semiconductor device
JPH01111357A (en) * 1987-10-26 1989-04-28 Seiko Epson Corp Semiconductor device
JPH03262122A (en) * 1990-03-13 1991-11-21 Fujitsu Ltd Manufacture of semiconductor device

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E902 Notification of reason for refusal
E601 Decision to refuse application