KR980006179A - How to remove metal pad stain - Google Patents
How to remove metal pad stain Download PDFInfo
- Publication number
- KR980006179A KR980006179A KR1019960023214A KR19960023214A KR980006179A KR 980006179 A KR980006179 A KR 980006179A KR 1019960023214 A KR1019960023214 A KR 1019960023214A KR 19960023214 A KR19960023214 A KR 19960023214A KR 980006179 A KR980006179 A KR 980006179A
- Authority
- KR
- South Korea
- Prior art keywords
- metal pad
- remove metal
- stain
- wire bonding
- pad stain
- Prior art date
Links
Abstract
본 발명은 반도체 칩의 조립 공정에서 와이어 본딩을 실시하기 전에 칩 상부면에 있는 노출된 금속 패드의 표면에 형성되는 스테인을 아르곤 스퍼터링 식각 방법으로 제거하는 것이다. 그로 인하여 후속의 와이어 본딩이 제대로 이루어지도록 하는 것이다.The present invention is to remove the stain formed on the surface of the exposed metal pad on the upper surface of the chip by argon sputtering etching method before the wire bonding in the semiconductor chip assembly process. This ensures that subsequent wire bonding is done properly.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 의해 금속 패드의 표면에 발생된 스테인을 아르곤 스퍼터링 식각 방법으로 제거하는 것을 도시한 단면도.2 is a cross-sectional view showing the removal of the stain generated on the surface of the metal pad by the argon sputter etching method according to the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960023214A KR980006179A (en) | 1996-06-24 | 1996-06-24 | How to remove metal pad stain |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960023214A KR980006179A (en) | 1996-06-24 | 1996-06-24 | How to remove metal pad stain |
Publications (1)
Publication Number | Publication Date |
---|---|
KR980006179A true KR980006179A (en) | 1998-03-30 |
Family
ID=66288296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960023214A KR980006179A (en) | 1996-06-24 | 1996-06-24 | How to remove metal pad stain |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR980006179A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57126149A (en) * | 1981-01-30 | 1982-08-05 | Seiko Instr & Electronics Ltd | Manufacture of semiconductor device |
JPH01111357A (en) * | 1987-10-26 | 1989-04-28 | Seiko Epson Corp | Semiconductor device |
JPH03262122A (en) * | 1990-03-13 | 1991-11-21 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1996
- 1996-06-24 KR KR1019960023214A patent/KR980006179A/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57126149A (en) * | 1981-01-30 | 1982-08-05 | Seiko Instr & Electronics Ltd | Manufacture of semiconductor device |
JPH01111357A (en) * | 1987-10-26 | 1989-04-28 | Seiko Epson Corp | Semiconductor device |
JPH03262122A (en) * | 1990-03-13 | 1991-11-21 | Fujitsu Ltd | Manufacture of semiconductor device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |