KR970077594A - Lead frame with independent external leads - Google Patents

Lead frame with independent external leads Download PDF

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Publication number
KR970077594A
KR970077594A KR1019960017779A KR19960017779A KR970077594A KR 970077594 A KR970077594 A KR 970077594A KR 1019960017779 A KR1019960017779 A KR 1019960017779A KR 19960017779 A KR19960017779 A KR 19960017779A KR 970077594 A KR970077594 A KR 970077594A
Authority
KR
South Korea
Prior art keywords
lead frame
outer leads
leads
lead
leadframe
Prior art date
Application number
KR1019960017779A
Other languages
Korean (ko)
Inventor
김동국
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960017779A priority Critical patent/KR970077594A/en
Publication of KR970077594A publication Critical patent/KR970077594A/en

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Abstract

본 발명은 반도체 칩이 실장되는 리드 프레임 패드와, 상기 리드 프레임 패드를 지지하는 타이바와, 상기 리드 프레임과 소정의 거리로 이격되어 일정한 간격을 이루고 있는 복수 개의 내부 리드와, 상기 내부 리드와 일체형으로 형성되어 있으며 성형이 되지 않는 복수개의 외부 리드를 갖는 리드 프레임에 있어서, 상기 외부 리드들을 가로지르는 방향으로 상기 외부 리드들을 연결시키는 절연성 지지층이 부착되어 있으며, 상기 외부 리드들이 각각 독립된 것을 특징으로 하는 독립된 외부 리드를 갖는 리드 프레임을 제공함으로써, 고가의 댐바 제거 설비 및 외부 리드 절단 설비가 필요 없으며, 댐바 절단 공정과 외부 리드 절단 공정이 필요 없어 제조 시간을 단축시킬 수 있을 뿐만 아니라, 외관 품질 및 실장 신뢰성이 향상시키는 효과를 나타내는 것을 특징으로 한다.The present invention relates to a semiconductor device comprising a lead frame pad on which a semiconductor chip is mounted, a tie bar supporting the lead frame pad, a plurality of inner leads spaced apart from the lead frame by a predetermined distance, A leadframe having a plurality of outer leads formed and not formed, characterized in that an insulating support layer is attached to connect the outer leads in a direction across the outer leads, and the outer leads are independent of each other By providing a lead frame having an external lead, an expensive dam bar removing facility and an external lid cutting facility are not required, and a damper cutting process and an external lid cutting process are not required, which not only shortens manufacturing time but also improves appearance quality and reliability Indicating the effect of improving .

Description

독립된 외부 리드를 갖는 리드 프레임Lead frame with independent external leads

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명에 따른 리드 프레임의 일 실시 예를 나타낸 평면도.FIG. 2 is a plan view showing an embodiment of a lead frame according to the present invention; FIG.

Claims (4)

반도체 칩이 실장되는 리드 프레임 패드와, 상기 리드 프레임 패드를 지지하는 타이바와, 상기 리드 프레임과 소정의 거리로 이격되어 일정한 간격을 이루고 있는 복수개의 내부 리드와, 상기 내부 리드와 일체형으로 형성되어 있으며 성형이 되지 않는 복수개의 외부 리드를 갖는 리드 프레임에 있어서, 상기 외부 리드들을 가로지르는 방향으로 상기 외부 리드들을 연결시키는 절연성 지지층이 부착되어 있으며, 상기 외부 리드들이 각각 독립된 것을 특징으로 하는 독립된 외부 리드를 갖는 리드 프레임.A lead frame pad on which the semiconductor chip is mounted; a tie bar for supporting the lead frame pad; a plurality of inner leads spaced apart from the lead frame by a predetermined distance and spaced apart from each other by a predetermined distance; A lead frame having a plurality of outer leads which are not formed, characterized in that an insulating supporting layer is attached to connect the outer leads in a direction across the outer leads, and the outer leads are independent of each other Lead frame having. 제1항에 있어서, 상기 절연성 지지층이 수지층인 것을 특징으로 하는 독립된 외부 리드를 갖는 리드 프레임.The lead frame according to claim 1, wherein the insulating supporting layer is a resin layer. 제1항에 있어서, 상기 절연성 지지층이 외부 리드 부분에 형성되어 있는 것을 특징으로 하는 독립된 외부 리드를 갖는 리드 프레임.The lead frame according to claim 1, wherein the insulating support layer is formed on an outer lead portion. 제1항에 있어서, 각각의 상기 외부 리드가 상기 리드 프레임으로 분리된 형태인 것을 특징으로 하는 독립된 외부 리드를 갖는 리드 프레임.The leadframe as claimed in claim 1, characterized in that each of said outer leads is separate from said leadframe. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960017779A 1996-05-23 1996-05-23 Lead frame with independent external leads KR970077594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960017779A KR970077594A (en) 1996-05-23 1996-05-23 Lead frame with independent external leads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960017779A KR970077594A (en) 1996-05-23 1996-05-23 Lead frame with independent external leads

Publications (1)

Publication Number Publication Date
KR970077594A true KR970077594A (en) 1997-12-12

Family

ID=66219803

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017779A KR970077594A (en) 1996-05-23 1996-05-23 Lead frame with independent external leads

Country Status (1)

Country Link
KR (1) KR970077594A (en)

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