KR970077378A - Multichip structure with chip on lead (COL) technology - Google Patents
Multichip structure with chip on lead (COL) technology Download PDFInfo
- Publication number
- KR970077378A KR970077378A KR1019960017759A KR19960017759A KR970077378A KR 970077378 A KR970077378 A KR 970077378A KR 1019960017759 A KR1019960017759 A KR 1019960017759A KR 19960017759 A KR19960017759 A KR 19960017759A KR 970077378 A KR970077378 A KR 970077378A
- Authority
- KR
- South Korea
- Prior art keywords
- chip structure
- col
- chip
- bonding pads
- bonded
- Prior art date
Links
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- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 멀티 칩 구조에 관한 것으로, 적어도 둘 이상의 접착 테이프들이 각기 이격·형성된 리드들의 상부면에 각기 이격·접착된 리드프레임; 그 각 접착 테이프의 상부면에 각기 접착되어 있으며, 상부면에 복수개의 본딩 패드들을 갖는 적어도 둘 이상의 칩; 및 상기 본딩 패드들과 각기 대응된 리드들을 각기 전기적 연결하는 수단;을 포함하는 것을 특징으로 하는 COL기술을 적용한 멀티 칩 구조를 제공함으로써, 통상적인 멀티 칩 구조에 사용되는 패턴닝된 기판을 적용치 않기 때문에 제조 단가가 낮고, COL구조를 이룸으로써 패키지의 두께가 박형화되는 장점과 후속 공정에 사용되는 반도체 제조 장치의 규격에 맞추어 제작될 수 있기 때문에 신규 장비 구입이 요구치 않는 장점을 갖는 특징이 있다.The present invention relates to a multi-chip structure, and more particularly, to a multi-chip structure in which at least two adhesive tapes are respectively separated and bonded to the upper surface of each of spaced and formed leads; At least two chips each bonded to an upper surface of each adhesive tape and having a plurality of bonding pads on an upper surface thereof; And means for electrically connecting leads corresponding to the bonding pads to each other. By providing the multi-chip structure using the COL technology, it is possible to provide a multi-chip structure in which a patterned substrate used in a conventional multi- Therefore, it is advantageous in that the thickness of the package is reduced by forming the COL structure at a low manufacturing cost, and it can be manufactured in accordance with the standard of a semiconductor manufacturing apparatus used in a subsequent process.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제3도는 본 발명에 의한 COL기술을 적용한 멀티 칩 구조를 나타내는 결합 사시도.FIG. 3 is a combined perspective view showing a multi-chip structure using the COL technique according to the present invention; FIG.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960017759A KR970077378A (en) | 1996-05-23 | 1996-05-23 | Multichip structure with chip on lead (COL) technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960017759A KR970077378A (en) | 1996-05-23 | 1996-05-23 | Multichip structure with chip on lead (COL) technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077378A true KR970077378A (en) | 1997-12-12 |
Family
ID=66220288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960017759A KR970077378A (en) | 1996-05-23 | 1996-05-23 | Multichip structure with chip on lead (COL) technology |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077378A (en) |
-
1996
- 1996-05-23 KR KR1019960017759A patent/KR970077378A/en not_active Application Discontinuation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |