KR970077189A - Method for forming terminal electrode of multilayer ceramic chip capacitor - Google Patents

Method for forming terminal electrode of multilayer ceramic chip capacitor Download PDF

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Publication number
KR970077189A
KR970077189A KR1019960015432A KR19960015432A KR970077189A KR 970077189 A KR970077189 A KR 970077189A KR 1019960015432 A KR1019960015432 A KR 1019960015432A KR 19960015432 A KR19960015432 A KR 19960015432A KR 970077189 A KR970077189 A KR 970077189A
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KR
South Korea
Prior art keywords
chip capacitor
ceramic
terminal electrode
ceramic chip
electrode
Prior art date
Application number
KR1019960015432A
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Korean (ko)
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KR0177678B1 (en
Inventor
권상훈
김도형
아쯔시 사또
Original Assignee
이형도
삼성전기 주식회사
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Application filed by 이형도, 삼성전기 주식회사 filed Critical 이형도
Priority to KR1019960015432A priority Critical patent/KR0177678B1/en
Publication of KR970077189A publication Critical patent/KR970077189A/en
Application granted granted Critical
Publication of KR0177678B1 publication Critical patent/KR0177678B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements

Abstract

본 발명은 세라믹 전자부품, 특히 적층 세라믹 칩 커패시터의 단자전극을 형성하는 방법에 관한 것이며, 그 목적은 세라믹 칩 커패시터(ceramic chip capacitor)의 내부전극과 단자전극의 결합을 보다 양호하고 완전하게 결합시킬 수 있는 방법을 제공함에 있다. 상기 목적달성을 위한 본 발명은 세라믹 조성물과 비금속(base metal) 내부전극이 적층된 세라믹 소체를 연마하고, 그 양단에 단자전극을 형성시키는 적층 칩 커패시터의 제조방법에 있어서, 상기 세라믹 소체를 연마후 세라믹 소체의 내부전극이 소체의 표면보다 더 돌출되도록 전기도금하고, 이어서 단자전극 페이스트를 도포하고 소성하는 적층 세라믹 칩 커패시터의 단자전극 형성방법에 관한 것을 그 기술적 요지로 한다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a terminal electrode of a ceramic electronic component, particularly a multilayer ceramic chip capacitor, and an object thereof is to provide a ceramic chip capacitor which is capable of bonding a connection between an internal electrode and a terminal electrode of a ceramic chip capacitor To provide a way to do so. According to another aspect of the present invention, there is provided a method of manufacturing a multilayer chip capacitor in which a ceramic body having a ceramic composition and a base metal internal electrode laminated is polished and terminal electrodes are formed on both ends of the ceramic body, The present invention relates to a method of forming a terminal electrode of a multilayer ceramic chip capacitor in which an inner electrode of a ceramic body is electroplated so as to protrude more than a surface of a body, followed by applying a terminal electrode paste and firing.

Description

적층 세라믹 칩 커패시터의 단자전극 형성방법Method for forming terminal electrode of multilayer ceramic chip capacitor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제4도는 본 발명에 의한 적층 칩 커패시터 소체의 상세도.FIG. 4 is a detailed view of a laminated chip capacitor element according to the present invention. FIG.

Claims (4)

세라믹 조성물과 비금속(base metal) 내부전극이 적층된 세라믹 소체를 연마하고, 그 양단에 단자전극을 형성시키는 적층 칩 커패시터의 제조방법에 있어서, 상기 세라믹 소체를 연마후 세라믹 소체의 내부전극이 소체의 표면보다 더 돌출되도록 전기도금하고, 이어서 단자전극 페이스트를 도포하고 소성함을 특징으로 하는 적층 세라믹 칩 커패시터의 단자전극 형성방법.A method of manufacturing a multilayer chip capacitor in which a ceramic body having a ceramic composition and a base metal internal electrode laminated is polished and a terminal electrode is formed on both ends of the ceramic body, characterized in that the internal electrode of the ceramic body is polished, Electroplating so as to protrude more than the surface of the laminated ceramic chip capacitor, and then applying and firing the terminal electrode paste. 제1항에 있어서, 상기 내부전극은 Ni, Cu 또는 이들의 합금인 것을 특징으로 하는 적층 세라믹 칩 커패시터의 단자전극 형성방법.The method of forming a terminal electrode of a multilayer ceramic chip capacitor according to claim 1, wherein the internal electrode is Ni, Cu or an alloy thereof. 제1항에 있어서, 상기 단자전극 페이스트는 내부전극과 동재질이거나 내부전극과 합금화가 가능한 금속 또는 이들의 혼합물, 합금을 이루는 것을 특징으로 하는 적층 세라믹 칩 커패시터의 단자전극 형성방법.The method as claimed in claim 1, wherein the terminal electrode paste is made of a copper material, a metal alloyable with the internal electrode, or a mixture or alloy thereof. 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 세라믹 소체의 표면에 노출되는 돌출부의 두께는 0.5-10㎛임을 특징으로 하는 적층 세라믹 칩 커패시터의 단자전극 형성방법.The method as claimed in any one of claims 1 to 3, wherein the thickness of the projecting portion exposed on the surface of the ceramic body is 0.5 to 10 占 퐉. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임※ Note: It is disclosed by the contents of the first application.
KR1019960015432A 1996-05-10 1996-05-10 Ceramic chip capacitor KR0177678B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960015432A KR0177678B1 (en) 1996-05-10 1996-05-10 Ceramic chip capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960015432A KR0177678B1 (en) 1996-05-10 1996-05-10 Ceramic chip capacitor

Publications (2)

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KR970077189A true KR970077189A (en) 1997-12-12
KR0177678B1 KR0177678B1 (en) 1999-04-15

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KR1019960015432A KR0177678B1 (en) 1996-05-10 1996-05-10 Ceramic chip capacitor

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100349124B1 (en) * 1999-12-18 2002-08-17 삼성전기주식회사 Manufacturing method for chip parts
US9514884B2 (en) 2013-11-15 2016-12-06 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board having the same mounted thereon

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100349124B1 (en) * 1999-12-18 2002-08-17 삼성전기주식회사 Manufacturing method for chip parts
US9514884B2 (en) 2013-11-15 2016-12-06 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board having the same mounted thereon

Also Published As

Publication number Publication date
KR0177678B1 (en) 1999-04-15

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