KR970073241A - Copper foil on printed circuit board - Google Patents

Copper foil on printed circuit board Download PDF

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Publication number
KR970073241A
KR970073241A KR1019960013459A KR19960013459A KR970073241A KR 970073241 A KR970073241 A KR 970073241A KR 1019960013459 A KR1019960013459 A KR 1019960013459A KR 19960013459 A KR19960013459 A KR 19960013459A KR 970073241 A KR970073241 A KR 970073241A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
copper foil
external electrode
land
Prior art date
Application number
KR1019960013459A
Other languages
Korean (ko)
Inventor
김원규
Original Assignee
구자홍
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 구자홍, 엘지전자 주식회사 filed Critical 구자홍
Priority to KR1019960013459A priority Critical patent/KR970073241A/en
Publication of KR970073241A publication Critical patent/KR970073241A/en

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발면은 외부 전극 리드가 미세한 고밀도 집적회로를 용이하게 실장하기 위하여 제공되는 인쇄회로기판의 동박 패튼에 관한 것으로서, 본 발명은 일측이 원형 돌기부로 인해 폭 방향으로 확대된 형상을 한 랜드와, 상기 랜드와 점대칭을 이루는 형상을 한 랜드가 교번하게 형성된 인쇄회로기판의 동박 패튼을 형성하여, 상기 인쇄회로기판에 도포된 크림솔더가 용융되면서 상기 원형 돌기부로 모이게 함으로 고밀도 집적회로의 외부 전극 리드가 휘어지더라도 완전한 납땜을 할 수 있게 되는 효과가 있다.The present invention relates to a copper foil pattern for a printed circuit board provided with an external electrode lead for easily mounting a high density integrated circuit having a fine external electrode lead. The solder paste applied to the printed circuit board is melted and collected into the circular protrusions so that the external electrode leads of the high-density integrated circuit are bent It is possible to achieve complete soldering.

Description

인쇄회로기판의 동박 패튼Copper foil on printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제6도는 본 발명에 의한 인쇄회로기판의 동박 패튼도, 제7도는 제6도의 랜드의 부분 확대도, 제8도는 본 발명에 의한 인쇄회로기판에 고밀도 집적회로를 실장할 때 완전한 납땜이 이루어지는 상태를 도시한 도면이다.FIG. 6 is a partly enlarged view of a land of a printed circuit board according to the present invention, FIG. 7 is a partially enlarged view of a land of FIG. 6, FIG. 8 is a view showing a state where complete soldering is performed when a high density integrated circuit is mounted on a printed circuit board according to the present invention Fig.

Claims (2)

전체적으로 고밀도 집적회로의 외관 형상을 이루면서 국부적으로 볼록한 형상을 한 다수의 랜드로 이루어진 것을 특징으로 하는 인쇄회로기판의 동박 패튼.Wherein the copper foil is made of a plurality of lands having an outer appearance of the high-density integrated circuit as a whole and having a locally convex shape. 제 1 항에 있어서, 일측이 원형 돌기부로 인해 폭 방향으로 확대된 형상을 한 랜드와, 상기 랜드와 점대칭을 이루는 형상을 한 랜드가 교번되게 형성된 것을 특징으로 하는 인쇄회로기판의 동박 패튼.The copper foil pattern of a printed circuit board according to claim 1, wherein one land has a shape that is enlarged in the width direction due to the circular protruding portion, and a land that has a shape of point-symmetry with the land are alternately formed. ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960013459A 1996-04-29 1996-04-29 Copper foil on printed circuit board KR970073241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960013459A KR970073241A (en) 1996-04-29 1996-04-29 Copper foil on printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960013459A KR970073241A (en) 1996-04-29 1996-04-29 Copper foil on printed circuit board

Publications (1)

Publication Number Publication Date
KR970073241A true KR970073241A (en) 1997-11-07

Family

ID=66216842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960013459A KR970073241A (en) 1996-04-29 1996-04-29 Copper foil on printed circuit board

Country Status (1)

Country Link
KR (1) KR970073241A (en)

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E902 Notification of reason for refusal
E902 Notification of reason for refusal
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