KR970073241A - Copper foil on printed circuit board - Google Patents
Copper foil on printed circuit board Download PDFInfo
- Publication number
- KR970073241A KR970073241A KR1019960013459A KR19960013459A KR970073241A KR 970073241 A KR970073241 A KR 970073241A KR 1019960013459 A KR1019960013459 A KR 1019960013459A KR 19960013459 A KR19960013459 A KR 19960013459A KR 970073241 A KR970073241 A KR 970073241A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- copper foil
- external electrode
- land
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발면은 외부 전극 리드가 미세한 고밀도 집적회로를 용이하게 실장하기 위하여 제공되는 인쇄회로기판의 동박 패튼에 관한 것으로서, 본 발명은 일측이 원형 돌기부로 인해 폭 방향으로 확대된 형상을 한 랜드와, 상기 랜드와 점대칭을 이루는 형상을 한 랜드가 교번하게 형성된 인쇄회로기판의 동박 패튼을 형성하여, 상기 인쇄회로기판에 도포된 크림솔더가 용융되면서 상기 원형 돌기부로 모이게 함으로 고밀도 집적회로의 외부 전극 리드가 휘어지더라도 완전한 납땜을 할 수 있게 되는 효과가 있다.The present invention relates to a copper foil pattern for a printed circuit board provided with an external electrode lead for easily mounting a high density integrated circuit having a fine external electrode lead. The solder paste applied to the printed circuit board is melted and collected into the circular protrusions so that the external electrode leads of the high-density integrated circuit are bent It is possible to achieve complete soldering.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제6도는 본 발명에 의한 인쇄회로기판의 동박 패튼도, 제7도는 제6도의 랜드의 부분 확대도, 제8도는 본 발명에 의한 인쇄회로기판에 고밀도 집적회로를 실장할 때 완전한 납땜이 이루어지는 상태를 도시한 도면이다.FIG. 6 is a partly enlarged view of a land of a printed circuit board according to the present invention, FIG. 7 is a partially enlarged view of a land of FIG. 6, FIG. 8 is a view showing a state where complete soldering is performed when a high density integrated circuit is mounted on a printed circuit board according to the present invention Fig.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960013459A KR970073241A (en) | 1996-04-29 | 1996-04-29 | Copper foil on printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960013459A KR970073241A (en) | 1996-04-29 | 1996-04-29 | Copper foil on printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970073241A true KR970073241A (en) | 1997-11-07 |
Family
ID=66216842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960013459A KR970073241A (en) | 1996-04-29 | 1996-04-29 | Copper foil on printed circuit board |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970073241A (en) |
-
1996
- 1996-04-29 KR KR1019960013459A patent/KR970073241A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |