KR970070252A - Metal plate plating method and apparatus - Google Patents

Metal plate plating method and apparatus Download PDF

Info

Publication number
KR970070252A
KR970070252A KR1019970040524A KR19970040524A KR970070252A KR 970070252 A KR970070252 A KR 970070252A KR 1019970040524 A KR1019970040524 A KR 1019970040524A KR 19970040524 A KR19970040524 A KR 19970040524A KR 970070252 A KR970070252 A KR 970070252A
Authority
KR
South Korea
Prior art keywords
plating
metal plate
plated
electrode device
plating solution
Prior art date
Application number
KR1019970040524A
Other languages
Korean (ko)
Other versions
KR100247317B1 (en
Inventor
이상진
Original Assignee
이상진
권영자
주식회사 현대기업
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이상진, 권영자, 주식회사 현대기업 filed Critical 이상진
Priority to KR1019970040524A priority Critical patent/KR100247317B1/en
Publication of KR970070252A publication Critical patent/KR970070252A/en
Application granted granted Critical
Publication of KR100247317B1 publication Critical patent/KR100247317B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0664—Isolating rolls

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명은 엘리베이터 케이지의 내부나 건축물의 장식용으로 사용되는 스텐레스판 또는 동판 등의 각종 넓은 금속판에 고가의 용해금속을 도금을 하는데 사용되는 금속판 도금방법 및 그 장치에 관한 것으로서, 더욱 상세하게는 도금용액이 담겨지는 도금장치의 도금조를 쟁반이나 당구대 형태로 깊이가 얕게 설치하고, 도금시에는 도금할 금속판을 상기 깊이가 얕은 도금조에 눕혀 놓은 상태로 도금작업을 할 수 있도록 함으로서, 도금용액의 사용량을 대폭 절감시켜 고가의 도금용액에 대한 제고부담을 경감시킬 수 있도록 하기 위한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal plate plating method and apparatus for plating expensive molten metal on various wide metal plates such as stainless plates or copper plates used for decoration of an elevator cage or a building, and more particularly, a plating solution. The plating bath of the plating apparatus to be loaded is installed at a shallow depth in the form of a tray or a billiard table, and during plating, the plating operation can be performed while the metal plate to be plated is laid in the plating tank having a shallow depth, thereby reducing the amount of plating solution used. It is intended to greatly reduce the burden of the expensive plating solution by significantly reducing.

본 발명에 의한 금속판 도금방법은, 깊이가 얕은 당구대 형태의 도금조(11)에 도금용액이 채워진 상태에서 도금할 금속판(1)을 도금조(11)의 내부바닥면에 높혀 놓는 함침단계(100)와, 상기 도금조(11)에 함침된 금속판(1)의 가장자리에 “-” 전극부재(14)로 누르면서 접속시킨 상태에서 도금조(11)의 상측에서는 “+ 전극장치(18)를 수평 이동시켜서 “+” 전극장치(18)의 하측과 “+” 전극장치(18)의 하측과 대응하는 금속판(1)사이에서 전기분해를 일으켜 금속판(1)의 표면에 도금이 되게 하는 도금단계(200)와, 상기 도금단계에서 도금된 금속판(1)을 도금조(11)에서 꺼내면서 금속판(1)에 고압의 에어를 분사시켜 금속판(1)에 묻어있는 도금용액을 제거하는 도금용액 제거단계(300)와, 상기 도금용액에 제거된 금속판(1)을 상하 도금판배출롤러(34)로서 외부로 배출시키는 도금판배출단계(400)로 이루어진다.In the plating method of the metal plate according to the present invention, the impregnation step 100 of raising the metal plate 1 to be plated on the inner bottom surface of the plating bath 11 in a state where the plating solution is filled in the plating tank 11 having a shallow pool table type ) And the + electrode device 18 is horizontally positioned on the upper side of the plating bath 11 while being connected to the edge of the metal plate 1 impregnated by the plating bath 11 by pressing the “-” electrode member 14. A plating step of causing electrolysis between the lower side of the “+” electrode device 18 and the lower side of the “+” electrode device 18 and the corresponding metal plate 1 to cause plating on the surface of the metal plate 1 ( 200) and the plating solution removal step of removing the plating solution on the metal plate 1 by ejecting the metal plate 1 plated in the plating step from the plating bath 11 by spraying high pressure air to the metal plate 1. 300 and the metal plate 1 removed in the plating solution is discharged to the outside as an upper and lower plated plate discharge roller 34. It is formed of a plated plate discharge step 400. The

또한 금속판 도금장치(10)는 도금용액이 담겨지는 도금조(11)가 당구대 형태로 깊이가 얕게 설치되고, 이 도금조(11)의 하측에는 소정길이의 다리(12)가 설치되며, 상기 도금조(11)의 일측 내벽에는 “-” 부스바(13)가 전길이에 걸쳐 설치되고, 상기 “-” 부스바(13)가 설치된 도금조(11)의 내부 소정위치에는 도금할 금속판(1)을 누르면서 “-” 전원을 공급하는 적어도 한개 이상의 “-” 전극부재(14)가 상기 “-” 부스바(13)와 접속된 상태로 설치되며, 상기 도금조(11)의 일측 외부면에는 모터에 의해 구동되는 한쌍의 스프라켓(15)과 체인(16)이 설치되고, 상기 도금조(11)의 타측 외부면에는 “+” 부스바(17)가 전길이에 걸쳐 설치되며, 상기 도금조(11)의 상측에는 일측단이 “+” 부스바(17)와 접속되어 “+” 전원을 공급받고 타측단은 상기 체인(16)과 연결되어 도금조(11)의 상측에서 전후방으로 수평이동하는 “+” 전극장치(18)가 횡단 설치되어 “+” 전극장치(18)의 하측과 “+” 전극장치(18)의 하단부와 대응하는 금속판(1)의 사이에서 전기분해가 일어나면서 금속판(1)에 도금이 되도록 된 것을 특징으로 한다.In addition, the metal plate plating apparatus 10 is provided with a plating tank 11 in which a plating solution is contained in a shallow depth in the form of a billiard table, and a leg 12 of a predetermined length is provided below the plating tank 11, and the plating One side wall of the tank 11 is provided with a “-” bus bar 13 over the entire length, and the metal plate 1 to be plated at a predetermined position inside the plating bath 11 in which the “-” bus bar 13 is installed. At least one “-” electrode member 14 for supplying “-” power while pressing) is installed in a state of being connected to the “-” busbar 13, and on one outer surface of the plating bath 11. A pair of sprockets 15 and a chain 16 driven by a motor are installed, and a “+” busbar 17 is installed on the other outer surface of the plating bath 11 over the entire length of the plating bath. One side end is connected to the "+" busbar (17) at the upper side of the (11) is supplied with "+" power and the other end is connected to the chain (16) A metal plate corresponding to the lower side of the “+” electrode device 18 and the lower end of the “+” electrode device 18 is installed so that the “+” electrode device 18 horizontally moves forward and backward from the upper side of the gold bath 11. Electrolysis occurs between 1) characterized in that the metal plate 1 to be plated.

Description

금속판 도금방법 및 그 장치Metal plate plating method and apparatus

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 금속판 도금장치의 일 실시예를 나타내는 사시도.2 is a perspective view showing an embodiment of a metal plate plating apparatus according to the present invention.

Claims (10)

깊이가 얕은 당구대 형태의 도금조(11)에 도금용액이 채워진 상태에서 도금할 금속판(1)이 도금용액에 잠기도록 도금조(11)의 내부바닥면에 높혀 놓는 함침단계(100)와, 상기 도금조(11)에 함침된 금속판(1)의 가장자리에 “-” 전극부재(14)로 누르면서 접속시킨 상태에서 도금조(11)의 상측에서는 “+ 전극장치(18)를 수평 이동시켜서 “+” 전극장치(18)의 하측과 “+” 전극장치(18)의 하측과 대응하는 금속판(1)사이에서 전기분해를 일으켜 금속판(1)의 표면에 도금이 되게 하는 도금단계(200)와, 상기 도금단계에서 도금된 금속판(1)을 도금조(11)에서 꺼내면서 금속판(1)에 고압의 에어를 분사시켜 금속판(1)에 묻어있는 도금용액을 제거하는 도금용액 제거단계(300)와, 상기 도금용액에 제거된 금속판(1)을 상하 도금판배출롤러(34)로서 외부로 배출시키는 도금판배출단계(400)로 이루어지는 것을 특징으로 하는 금속판 도금방법.An impregnation step (100) of raising the metal plate (1) to be plated on the inner bottom surface of the plating bath (11) so as to be immersed in the plating solution in a state in which the plating solution (11) having a shallow billiard table shape is filled with the plating solution (11); In the state where the electrode plate 14 is connected to the edge of the metal plate 1 impregnated with the plating bath 11 while being pressed, the upper side of the plating bath 11 moves the electrode device 18 horizontally. A plating step 200 which causes electrolysis between the lower side of the electrode device 18 and the lower side of the “+” electrode device 18 and the corresponding metal plate 1 so that the surface of the metal plate 1 is plated; The plating solution removal step 300 of removing the plating solution buried in the metal plate 1 by spraying a high pressure air to the metal plate 1 while taking out the plated metal plate 1 from the plating bath 11 in the plating step; Plated boat to discharge the metal plate (1) removed in the plating solution to the outside as the upper and lower plated plate discharge roller 34 Plated metal plate characterized in that comprising the step (400). 도금용액이 담겨지는 도금조(11)가 당구대 형태로 깊이가 얕게 설치되고, 이 도금조(11)의 하측에는 소정길이의 다리(12)가 설치되며, 상기 도금조(11)의 일측 내벽에는 “-” 부스바(13)가 전길이에 걸쳐 설치되고, 상기 “-” 부스바(13)가 설치된 도금조(11)의 내부 소정위치에는 도금할 금속판(1)을 누르면서 “-” 전원을 공급하는 적어도 한개 이상의 “-” 전극부재(14)가 상기 “-” 부스바(13)와 접속된 상태로 설치되며, 상기 도금조(11)의 일측 외부면에는 모터에 의해 구동되는 한쌍의 스프라켓(15)과 체인(16)이 설치되고, 상기 도금조(11)의 타측 외부면에는 “+” 부스바(17)가 전길이에 걸쳐 설치되며, 상기 도금조(11)의 상측에는 일측단이 “+” 부스바(17)와 접속되어 “+” 전원을 공급받고 타측단은 상기 체인(16)과 연결되어 도금조(11)의 상측에서 전후방으로 수평이동하는 “+” 전극장치(18)가 횡단 설치되어 “+” 전극장치(18)의 하측과 “+” 전극장치(18)의 하단부와 대응하는 금속판(1)의 사이에서 전기분해가 일어나면서 금속판(1)에 도금이 되도록 된 것을 특징으로 하는 금속판 도금장치.The plating bath 11 in which the plating solution is contained is installed at a shallow depth in the form of a billiard table, and a leg 12 of a predetermined length is provided below the plating bath 11, and on one inner wall of the plating bath 11. The “-” busbar 13 is installed over the entire length, and while the metal plate 1 to be plated is pressed at a predetermined position inside the plating bath 11 in which the “-” busbar 13 is installed, the “-” power supply is turned on. At least one or more “-” electrode members 14 to be supplied are installed in a state of being connected to the “-” busbars 13, and a pair of sprockets driven by a motor on one outer surface of the plating bath 11. 15 and the chain 16 is installed, the other side of the plating bath 11 is provided with a "+" busbar 17 over the entire length, one side end on the upper side of the plating bath (11) It is connected to the “+” busbar 17 to receive “+” power, and the other end is connected to the chain 16 so that the front and rear sides of the plating bath 11 are upper and lower. Is installed horizontally, and the electrolysis is performed between the lower side of the “+” electrode device 18 and the lower end of the “+” electrode device 18 and the corresponding metal plate 1. Metal plate plating apparatus, characterized in that the metal plate (1) to be plated while happening. 제2항에 있어서, 상기 도금장치(10)의 도금조(11)의 후방 상측에는, 도금조(11)의 양측 후방에 힌지식으로 설치되는 브라켓트(31)와, 상기 브라켓트 (31)의 전방측에 회전 자유롭게 설치되는 다수개의 금소간 취출안내용 도금판취출 안내롤러(32)와, 상기 도금판취출 안내롤러(32)의 후방측 브라켓트(31)의 상하에 설치되어 고압의 공기를 금속판(1)에 분사시켜 금속판(1)의 양면에 묻어있는 도금용액을 제거하는 송풍기(33)와, 상기 송풍기(33)의 후방측 브라켓트(31)의 상하에 설치되어 도금용액이 제거된 금속판(1)을 후방으로 자동 배출시키는 도금판배출롤러(34)로 이루어지는 도금용액제거장치(30)가 설치된 것을 특징으로 하는 금속판 도금장치.3. The bracket 31 according to claim 2, wherein the bracket 31 is hingedly installed at both rear sides of the plating tank 11, and the front of the bracket 31 is located above and behind the plating tank 11 of the plating apparatus 10. A metal plate (10) is installed above and below the plurality of plated plate guide guide rollers (32) for take-out guides rotatably installed on the side, and the rear bracket (31) of the plate plate guide guide (32). 1) an air blower 33 for spraying the plating solution on both sides of the metal plate 1 by spraying on the metal plate 1, and a metal plate 1 installed above and below the rear bracket 31 of the air blower 33 to remove the plating solution. Metal plate plating apparatus, characterized in that the plating solution removal device consisting of a plating plate discharge roller 34 for automatically discharging the rear). 제2항 또는 제3항에 있어서, 상기 “+” 전극장치(18)는 속이 빈 “+” 전극장치본체(19)의 중앙상부에 가스배기관(20)이 설치되고, “+” 전극장치본체(19)의 전후방에는 다수개의 가스배기공(21)을 구비한 날개부(22)가 외향돌출 형성되며, 도금용액에 잠기는 “+” 전극장치본체(19)의 하단부에는 다수개의 가스배기공(23)이 관총형성되고, “+” 전극장치본체(19)의 양측에는 도금조(11)의 상측에는 “+” 전극장치본체(19)가 원활하게 이동하도록 하는 롤러(24)가 설치되며, 이 “+” 전극장치본체(19)의 일측에는 “+” 부스바(17)와 접속되는 전극접속단자(25)가 설치되어 있고, “+” 전극장치본체(19)의 타측에는 체인(16)이 연결 설치된 것을 특징으로 하는 금속판 도금장치.According to claim 2 or 3, wherein the "+" electrode device 18 is provided with a gas exhaust pipe 20 in the center of the hollow "+" electrode device main body 19, the "+" electrode device main body In front and rear of the (19), the wing portion 22 having a plurality of gas exhaust holes (21) is formed outwardly protruding, the lower end of the "+" electrode device main body 19, which is immersed in the plating solution, 23 is formed in a tube gun, and on both sides of the "+" electrode device body 19, a roller 24 for smoothly moving the "+" electrode device body 19 is installed on the upper side of the plating bath 11, One side of the “+” electrode device body 19 is provided with an electrode connecting terminal 25 connected to the “+” bus bar 17, and the other side of the “+” electrode device body 19 is provided with a chain 16. Metal plate plating apparatus characterized in that the connection is installed. 제2항 또는 제3항에 있어서, 상기 “-” 전극부재(14)는 하측에 플랜지부(41)를 구비하고 중심부에는 실린더로드(45)가 관통될 수직관통공(42)이 형성된 하우징 (44)이 도금조(11)의 내부바닥면에 수직설치되고, 상기 도금조(11)의 하측에는 실린더로드(45)가 수직관통공(42)을 상향 관통한 상태에서 승하강하도록 하는 실린더(46)가 상향 설치되며, 상기 실린더로드(45)의 선단부에는 상기 “-” 부스바(13)와 접속된 “ㄱ”자 형태의 “-” 전극단자(47)가 설치된 것을 특징으로 하는 금속판 도금장치.The housing according to claim 2 or 3, wherein the “-” electrode member 14 has a flange portion 41 at the lower side and a vertical through hole 42 through which the cylinder rod 45 is to be penetrated at the center thereof. 44 is installed vertically on the inner bottom surface of the plating tank 11, the cylinder rod 45 in the lower side of the plating tank 11 to move up and down in a state of passing through the vertical through hole 42 ( 46 is installed upward, the metal plate plating, characterized in that the "-" electrode terminal 47 of the "-" shape connected to the "-" busbar 13 is installed at the front end of the cylinder rod 45 Device. 제2항 또는 제3항에 있어서, 상기 “-” 전극부재(14)는 선단부가 “-” 부스바(13)와 접속되고 말단부는 금속판(1)의 가장자리를 탄력적으로 홀딩시키는 금속판홀딩부(48)가 절곡 형성된 판스프링(49)이 설치된 것을 특징으로 하는 금속판 도금장치.The metal plate holding part of claim 2 or 3, wherein the “-” electrode member 14 has a distal end portion connected to the “-” busbar 13 and a distal end portion elastically holding the edge of the metal plate 1 (4). Metal plate plating apparatus, characterized in that the plate spring 49 is formed bent (48). 제2항 또는 제3항에 있어서, 상기 “-” 전극부재(14)는 상기 도금조(11)의 내벽 소정위치에 “-” 부스바(13)와 접속되는 고정볼트설치구(50)가 설치되고, 이 고정볼트설치구(50)에는 금속판(1)과 접촉하는 고정볼트(51)가 나사식으로 설치된 것을 특징으로 하는 금속판 도금장치.According to claim 2 or 3, wherein the "-" electrode member 14 is a fixed bolt mounting hole 50 is connected to the "-" bus bar 13 at a predetermined position of the inner wall of the plating bath 11 And a fixing bolt (51) in contact with the metal plate (1) is provided in a screw type in the fixing bolt mounting hole (50). 제2항 또는 제3항에 있어서, 상기 도금조(11)의 후방측 바닥면 양측에는 도금용액유입구(27)와 도금용액 배출구(26)가 각각 형성되고, 도금조(11)의 하측에는 도금용액배출구(26)를 통해 배출되는 도금용액을 회수하여 저장하는 도금용액저장탱크(52)가 설치되며, 이 도금용액저장탱크(52)에 형성된 배출구(53)와 상기 도금용액 유입구(27)의 사이에는 순환펌프(54)와 휠터(55)가 설치된 유입관(56)이 연결 설치된 것을 특징으로 하는 금속판 도금장치.The plating solution inlet 27 and the plating solution outlet 26 are formed on both sides of the bottom surface of the rear side of the plating bath 11, respectively, and the plating below the plating bath 11 is performed. Plating solution storage tank 52 for recovering and storing the plating solution discharged through the solution outlet 26 is provided, the discharge port 53 formed in the plating solution storage tank 52 and the plating solution inlet 27 Metal plate plating apparatus, characterized in that the inlet pipe 56 is installed between the circulation pump 54 and the filter 55 is installed. 제2항 또는 제3항에 있어서, 상기 도금조(11)의 전방측 하방에는 도금조(11)의 전방측을 후방측보다 높아지게 상승시키는 틸트실린더(57)가 설치된 것을 특징으로 하는 금속판 도금장치.The metal plate plating apparatus according to claim 2 or 3, wherein a tilt cylinder (57) for raising the front side of the plating tank (11) higher than the rear side is provided below the front side of the plating tank (11). . 제2항 또는 제3항에 있어서, 상기 도금조(11)의 내벽 전체면에는 흘러넘침방지턱(58)이 하향경사지게 설치된 것을 특징으로 하는 금속판 도금장치.The plating apparatus according to claim 2 or 3, wherein the overflow prevention jaw (58) is installed to be inclined downward on the entire inner wall of the plating bath (11). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019970040524A 1997-08-18 1997-08-18 Electroplating method and apparatus of the metal plate KR100247317B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970040524A KR100247317B1 (en) 1997-08-18 1997-08-18 Electroplating method and apparatus of the metal plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970040524A KR100247317B1 (en) 1997-08-18 1997-08-18 Electroplating method and apparatus of the metal plate

Publications (2)

Publication Number Publication Date
KR970070252A true KR970070252A (en) 1997-11-07
KR100247317B1 KR100247317B1 (en) 2000-04-01

Family

ID=19518358

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970040524A KR100247317B1 (en) 1997-08-18 1997-08-18 Electroplating method and apparatus of the metal plate

Country Status (1)

Country Link
KR (1) KR100247317B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100532830B1 (en) * 2002-12-11 2005-12-01 주식회사 메시 A rapid composite plating apparatus
KR100661047B1 (en) * 2006-05-18 2006-12-22 써테크부산(주) Plating method and apparatus for pipe

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101985523B1 (en) 2018-12-25 2019-06-04 김희두 Optical roller plating system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100532830B1 (en) * 2002-12-11 2005-12-01 주식회사 메시 A rapid composite plating apparatus
KR100661047B1 (en) * 2006-05-18 2006-12-22 써테크부산(주) Plating method and apparatus for pipe

Also Published As

Publication number Publication date
KR100247317B1 (en) 2000-04-01

Similar Documents

Publication Publication Date Title
JP2007131869A (en) Plating tank
JP2749453B2 (en) Equipment for processing printed circuit boards
KR970070252A (en) Metal plate plating method and apparatus
KR101704615B1 (en) Plating Equipment
US5985106A (en) Continuous rack plater
CN212713823U (en) Horizontal high-aspect-ratio circuit board micropore copper-plating and tin-plating equipment
CN109161913B (en) Nut acid dip pickle
KR20190014207A (en) Structure For Supporting Clamp Hanger For Base Plate
CN112934816B (en) Circuit board electroplating line circulation water-saving cleaning device
CN211700891U (en) Coaxial connector shell electroplating treatment device
CN115666004A (en) Printed circuit board etching device and method
CN115948788A (en) High-efficient device of electroplating again of coarse cladding material circuit board
JPH0699839B2 (en) Equipment for electrolytic deposition of metal on steel strip
CN210980736U (en) Workpiece surface liquid drying device
KR100311453B1 (en) gild machine for metal plate
KR0135877Y1 (en) Plating jig
CN217203051U (en) Plating bath automatic filtration belt cleaning device
US4969985A (en) Device for transporting agitatable material having a vibrator which is submerged in a liquid
CN218812109U (en) Pickling unit is used in processing of bearing retainer
KR100897441B1 (en) Frame for transfering apparatus and transfering method of painting pretreatment
US20050000421A1 (en) Device for wetting cable-ends
CN211570828U (en) Electrolyte recovery unit for metal mold electroplating processing
CN214496510U (en) Cleaning system for electroplating iron parts
US5195547A (en) Pressurized weir for a fumeless pickling or cleaning system
CN211130808U (en) Hanging soap box

Legal Events

Date Code Title Description
A201 Request for examination
G15R Request for early opening
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20121210

Year of fee payment: 14

FPAY Annual fee payment

Payment date: 20131205

Year of fee payment: 15

FPAY Annual fee payment

Payment date: 20141128

Year of fee payment: 16

FPAY Annual fee payment

Payment date: 20160108

Year of fee payment: 17

FPAY Annual fee payment

Payment date: 20170110

Year of fee payment: 18

EXPY Expiration of term