CN115948788A

CN115948788A - High-efficient device of electroplating again of coarse cladding material circuit board

Info

Publication number: CN115948788A
Application number: CN202211606554.7A
Authority: CN
Inventors: 唐川; 黄灿; 黄光明
Original assignee: MFS TECHNOLOGY (HUNAN) CO LTD
Current assignee: MFS TECHNOLOGY (HUNAN) CO LTD
Priority date: 2022-12-13
Filing date: 2022-12-13
Publication date: 2023-04-11

Abstract

The invention relates to a high-efficiency re-electroplating device for a rough-plated circuit board, which comprises a supporting base plate and a clamping assembly, wherein the outer side of the upper end of the supporting base plate is connected with a protective frame, the lower end of a moving assembly is connected with a connecting assembly, the lower end of a connecting slide block is connected with a connecting plate, and the left side and the right side of the lower end of the connecting plate are respectively provided with a telescopic pushing block. The invention has the beneficial effects that: this device is electroplated again to high efficiency of coarse cladding layer circuit board, it slides to drive the slip chuck through the dwang, to the circuit board centre gripping, the machining efficiency is improved, the connection of electronic slide rail and rolling subassembly, reducing wear, the service life is prolonged, the spliced eye is connected with the slip spliced pole, carry out convenient tearing open and trade to the electroplating box, the maintenance efficiency of improve equipment, the extension subassembly is to keeping off the extension of liquid case, prevent to electroplate the circuit board solution drippage of taking out and corrode other equipment, stoving subassembly and the subassembly that induced drafts can make the circuit board of electroplating or having washed and accelerate drying rate, avoid influencing subsequent processing progress.

Description

High-efficient device of electroplating again of coarse cladding material circuit board

Technical Field

The invention relates to the technical field of circuit board re-electroplating, in particular to a high-efficiency re-electroplating device for a rough-plated circuit board.

Background

After the circuit board is electroplated, the phenomenon that a plating layer is rough may occur, then, a hole is drilled on the circuit board, the hole wall is not conductive, the circuit board needs to be electroplated after copper deposition to realize communication between the circuit boards, a copper layer is plated on the whole circuit board by a chemical method, the reliability of interconnection between the circuit boards is ensured, and an electroplating device is needed in the processing process.

The existing electroplating device still needs to manually clamp a circuit board to be electroplated on the placing frame in the using process, and then the circuit board is soaked in solution and transmitted by current, so that electroplating is performed.

Therefore, it is necessary to design an efficient re-plating apparatus for a rough-plated circuit board in view of the above problems.

Disclosure of Invention

The invention aims to provide a high-efficiency re-electroplating device for a rough-plated circuit board, which solves the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a device is electroplated again to high efficiency of coarse cladding material circuit board, includes supporting baseplate and centre gripping subassembly, the upper end outside of supporting baseplate is connected with the protective frame, and the inboard of protective frame is provided with removes the subassembly, the lower extreme that removes the subassembly is connected with coupling assembling, and coupling assembling includes link block and connecting plate, link block's lower extreme is connected with the connecting plate, and is provided with the fixing clip subassembly in the middle part of the lower extreme of connecting plate, the lower extreme left and right sides of connecting plate all is provided with flexible promotion piece, and the inboard of flexible promotion piece is connected with the removal joint board, the centre gripping subassembly sets up in the inside that removes the joint board.

Further, the fixing clamping assembly comprises a fixing clamping plate and a clamping groove, the fixing clamping plate drives the lower end to be connected with a bottom supporting plate, and the clamping groove is formed in the fixing clamping plate.

Further, the centre gripping subassembly includes fixed plate, slip chuck, swivelling joint spare and dwang, the inboard of fixed plate is connected with the slip chuck, and the one end that the fixed plate horizontal center line was kept away from to the slip chuck is connected with swivelling joint spare, swivelling joint spare's internal connection has the dwang.

Furthermore, the moving assembly comprises a vertical sliding block and a moving slide rail, and the inner side of the vertical sliding block is connected with the moving slide rail.

Furthermore, the outside of protection frame is provided with electronic slide rail, and the lower extreme of electronic slide rail is connected with the rolling subassembly, the rolling subassembly includes installation piece and gyro wheel, and the lower extreme of installation piece is connected with the gyro wheel.

Furthermore, a jack hole is formed in the supporting base plate, an electroplating box is arranged in the middle of the upper end of the supporting base plate, and a position adjusting assembly is connected to the lower end of the interior of the electroplating box.

Further, the position control subassembly includes the bottom guard plate, is taken turns board, buffer block and slip peg graft pole even, and the inside of bottom guard plate is provided with even the wheel board, the front end of bottom guard plate is connected with slip peg graft pole, and the rear end of bottom guard plate is provided with the buffer block.

Further, the inside back wall of protective frame is connected with the fender liquid case, and keeps off the inside diapire of liquid case and be connected with the slide, the upper end of slide is connected with the extension subassembly, and the extension subassembly includes sliding connection piece, oblique baffle and stopper, sliding connection piece's upper end is connected with oblique baffle, and the outside of oblique baffle is connected with the stopper, the inside drain subassembly that is provided with of lower wall of fender liquid case.

Further, the liquid discharge assembly comprises a collecting tank and an extension pipe, and the rear end of the collecting tank is connected with the extension pipe.

Furthermore, the left wall internally mounted of protecting frame has the stoving subassembly, and the stoving subassembly includes hair-dryer and hot plate, the right-hand member of hair-dryer is connected with the hot plate, the right wall internally mounted of protecting frame has the subassembly that induced drafts, and induced drafts the subassembly and include air exhauster and extension fill, the left end of air exhauster is connected with the extension and fights.

Compared with the prior art, the invention has the beneficial effects that: through the extrusion of flexible promotion piece to the dwang, let rotate and drive the slip chuck and slide, and then realize the automatic centre gripping to the circuit board, the machining efficiency is improved, sliding fit through electronic slide rail and rolling subassembly connects, increase gliding convenience, reducing wear, the service life is prolonged, be connected through spliced eye and slip spliced pole, can carry out convenient taking and fixing to electroplating box, can improve equipment's maintenance efficiency, through the extension of extension subassembly to keeping off the liquid case, prevent to electroplate the circuit board solution that has taken out and drip at will and corrode other equipment, cooperation through drying assembly and the subassembly that induced drafts is used, can make the circuit board of electroplating or washing up accelerate drying rate, and then avoid influencing subsequent processing progress.

1. When the circuit board is clamped, the circuit board is firstly placed in the fixed clamping plate, then the telescopic pushing block is pushed, the telescopic pushing block extrudes the rotating rod, and due to the rotation property of the rotating rod, the sliding clamping heads connected to the inner sides of the rotating connecting pieces can be pushed to move close to each other in the rotating process, and then the circuit board is clamped and fixed, so that the automatic clamping of the circuit board can be realized, and the processing efficiency is improved.

2. In the operation process, the circuit board is soaked and electroplated through the longitudinal adjustment of the vertical sliding block and the movement adjustment of the connecting sliding block at the lower end of the movable sliding rail, when the electroplating process is completed by the movement of the protective frame, the electric sliding rail is used as main power to move, in order to prevent the gravity extrusion of the protective frame from influencing the sustainable sliding of the electric sliding rail, the roller is arranged for sliding connection and support, the sliding convenience is improved, the abrasion is reduced, and the service life is prolonged.

3. In the using process, the most important equipment is the electroplating box which is the main bearing equipment of the electroplating circuit board, the existing electroplating box is fixed and is not beneficial to replacement after being damaged inside, therefore, a bottom protection plate is arranged at the lower end of the electroplating box, then the electroplating box is connected with a wheel connecting plate to move, position limiting extrusion can be carried out through a buffer block, then a sliding insertion rod is inserted into an insertion hole to be fixed, and the maintenance and replacement efficiency of the equipment can be improved by conveniently taking and fixing the electroplating box.

4. In the using process of the invention, after the circuit board is taken out from the electroplating box, the surface of the circuit board still adheres with the electroplating solution, because the electroplating solution generally adopts sulfate solution and is acidic, the bottom of the taken-up circuit board is blocked by arranging the liquid blocking box, the solution is dripped through the top of the liquid blocking box, and the automatic sliding connecting block of the equipment slides on the slideway, so that two sides of the inclined baffle plate are opened to form expanded receiving solution, and finally the expanded receiving solution is collected in the collecting tank and is discharged and collected through the extension pipe, and the situation that the circuit board solution taken out after electroplating is randomly dripped to corrode other equipment and influence the sustainable use of the equipment can be prevented through the arrangement.

5. In the electroplating process, liquid can be attached to the circuit board taken out of the electroplating tank or other washing tanks, in order to prevent the liquid from being dried, the next operation is carried out, the air can be blown by the blower, then the heat on the heating plate is driven to be blown onto the circuit board, then the solution is vaporized through the evaporation of the heat, the collection area is enlarged through the funnel-shaped expansion hopper, and the vaporized air is discharged to other spaces through the exhaust fan, so that the drying speed of the electroplated or washed circuit board can be accelerated, and the subsequent processing progress is prevented from being influenced.

Drawings

FIG. 1 is a schematic diagram of a front view of an efficient re-electroplating apparatus for a rough-plated circuit board according to the present invention;

FIG. 2 is a schematic view of a partial three-dimensional structure of a fixing clamping assembly of the efficient re-electroplating device for a rough-plated circuit board according to the present invention;

FIG. 3 is a schematic view of a partially enlarged top view of a clamping assembly of an efficient re-electroplating apparatus for a rough-plated circuit board according to the present invention;

FIG. 4 is an enlarged schematic view of the high-efficiency re-electroplating device for a rough-plated circuit board shown in FIG. 1;

FIG. 5 is a schematic diagram of a partial side view of a cross-sectional structure of a plating tank and a position adjustment assembly of the efficient re-plating apparatus for a rough-plated circuit board according to the present invention;

FIG. 6 is a schematic diagram of a partial side view of a liquid baffle box of an efficient re-electroplating device for a rough-plated circuit board according to the present invention.

In the figure: 1. a support base plate; 2. a protective frame; 3. a moving assembly; 301. a vertical slide block; 302. moving the slide rail; 4. a connecting assembly; 401. connecting the sliding block; 402. a connecting plate; 5. fixing the clamping component; 501. fixing the clamping and connecting plate; 502. a bottom support plate; 503. a clamping groove; 6. a mobile clamping and connecting plate; 7. a telescopic pushing block; 8. a clamping assembly; 801. a fixing plate; 802. a sliding chuck; 803. a rotating connector; 804. rotating the rod; 9. an electric slide rail; 10. a rolling assembly; 1001. mounting a block; 1002. a roller; 11. inserting holes; 12. electroplating box; 13. a position adjustment assembly; 1301. a bottom guard plate; 1302. a wheel connecting plate; 1303. a buffer block; 1304. sliding the insertion rod; 14. a liquid blocking tank; 15. a slideway; 16. an expansion component; 1601. a sliding connection block; 1602. an inclined baffle plate; 1603. a limiting block; 17. a liquid draining assembly; 1701. collecting tank; 1702. an extension pipe; 18. a drying assembly; 1801. a blower; 1802. heating plates; 19. an air suction assembly; 1901. an exhaust fan; 1902. and (5) expanding the bucket.

Detailed Description

As shown in fig. 1 to 3, the present invention provides a technical solution: a high-efficiency re-electroplating device for a rough-plated circuit board comprises a supporting base plate 1 and a clamping assembly 8, wherein the outer side of the upper end of the supporting base plate 1 is connected with a protective frame 2, the inner side of the protective frame 2 is provided with a moving assembly 3, the lower end of the moving assembly 3 is connected with a connecting assembly 4, the connecting assembly 4 comprises a connecting slide block 401 and a connecting plate 402, the lower end of the connecting slide block 401 is connected with the connecting plate 402, the middle part of the lower end of the connecting plate 402 is provided with a fixed clamping assembly 5, the left side and the right side of the lower end of the connecting plate 402 are both provided with telescopic pushing blocks 7, the inner side of each telescopic pushing block 7 is connected with a moving clamping plate 6, the clamping assembly 8 is arranged inside the moving clamping plate 6, the fixed clamping assembly 5 comprises a fixed clamping plate 501 and a clamping groove 503, the fixed clamping plate 501 drives the lower end to be connected with a bottom supporting plate 502, the clamping groove 503 is arranged inside the fixed clamping plate 501, the clamping assembly 8 comprises a fixed plate 801, a sliding chuck 802, a rotating connecting piece 803 and a rotating rod 804, the inner side of the fixed plate 801 is connected with a sliding chuck 802, one end of the sliding chuck 802 far away from the horizontal central line 801 is connected with a rotating connecting piece 804;

the specific operation is as follows, when carrying out the centre gripping to the circuit board, place the inside at fixed joint board 501 with the circuit board earlier, support the circuit board bottom through bottom sprag board 502, then the border card is on joint groove 503, then promote flexible promotion piece 7, it is spacing to the circuit board to remove joint board 6 along with it removes, when removing joint board 6 stop moving, flexible promotion piece 7 extrudees dwang 804, because the rotatability of dwang 804, can be in the rotation in-process promote the inboard sliding chuck 802 of connecting of swivel connected coupler 803 and be close to each other and remove, then carry out automatic centre gripping fixed to the circuit board.

As shown in fig. 1 and 4, the moving assembly 3 includes a vertical slider 301 and a moving slide rail 302, the moving slide rail 302 is connected to the inner side of the vertical slider 301, an electric slide rail 9 is arranged outside the protective frame 2, the lower end of the electric slide rail 9 is connected with a rolling assembly 10, the rolling assembly 10 includes a mounting block 1001 and a roller 1002, and the lower end of the mounting block 1001 is connected with the roller 1002;

the specific operation is as follows, in the operation process, through the vertical regulation of vertical slider 301 to and link block 401 carries out the soaking of circuit board and electroplates in the removal regulation of removal slide rail 302 lower extreme, at the removal of protection frame 2, when accomplishing the electroplating process, moves as main power through electronic slide rail 9, for the gravity extrusion that prevents protection frame 2, influences the sustainable slip of electronic slide rail 9, sets up gyro wheel 1002 and carries out sliding connection support.

As shown in fig. 5, a jack 11 is formed inside the support base plate 1, an electroplating tank 12 is arranged in the middle of the upper end of the support base plate 1, a position adjusting assembly 13 is connected to the lower end inside the electroplating tank 12, the position adjusting assembly 13 includes a bottom protection plate 1301, a wheel connecting plate 1302, a buffer block 1303 and a sliding plug rod 1304, the wheel connecting plate 1302 is arranged inside the bottom protection plate 1301, the sliding plug rod 1304 is connected to the front end of the bottom protection plate 1301, and the buffer block 1303 is arranged at the rear end of the bottom protection plate 1301;

the operation is as follows, in the use process, the most important equipment is the electroplating box 12 which is the main bearing equipment of the electroplating circuit board, the bottom protection plate 1301 is arranged at the lower end of the electroplating box 12, then the wheel connecting plate 1302 is connected to move, the position can be limited and extruded through the buffer block 1303, and then the sliding insertion rod 1304 is inserted into the insertion hole 11 to be fixed.

As shown in fig. 6, a liquid blocking box 14 is connected to the inner rear wall of the protective frame 2, a slide way 15 is connected to the inner bottom wall of the liquid blocking box 14, an expansion assembly 16 is connected to the upper end of the slide way 15, the expansion assembly 16 includes a sliding connection block 1601, an inclined baffle 1602 and a limiting block 1603, the inclined baffle 1602 is connected to the upper end of the sliding connection block 1601, the limiting block 1603 is connected to the outer side of the inclined baffle 1602, a liquid drainage assembly 17 is arranged inside the lower wall of the liquid blocking box 14, the liquid drainage assembly 17 includes a collection tank 1701 and an extension pipe 1702, and the extension pipe 1702 is connected to the rear end of the collection tank 1701;

the specific operation is as follows, after the circuit board is taken out from the electroplating tank 12, the surface still adheres to the electroplating solution, because the electroplating solution generally adopts sulfate radical solution, and is acidic, the bottom of the circuit board after being taken up is blocked by arranging the liquid blocking tank 14, so that the solution drops through the top of the liquid blocking tank 14, and the automatic sliding connection block 1601 of the equipment slides on the slideway 15, so as to open the two sides of the inclined baffle 1602, form an expanded receiving solution, finally collect in the collecting tank 1701, and discharge and collect through the extension pipe 1702.

As shown in fig. 1, a drying assembly 18 is installed inside a left wall of a protection frame 2, the drying assembly 18 includes a blower 1801 and a heating plate 1802, the heating plate 1802 is connected to a right end of the blower 1801, an air suction assembly 19 is installed inside a right wall of the protection frame 2, the air suction assembly 19 includes an exhaust fan 1901 and an expansion bucket 1902, and the expansion bucket 1902 is connected to a left end of the exhaust fan 1901;

the specific operation is as follows, in the electroplating process, liquid can be attached to the circuit board taken out of the electroplating tank 12 or other water washing tanks, in order to prevent the next operation from being carried out before the liquid is dried, air can be blown through the blower 1801, then heat on the heating plate 1802 is driven to be blown to the circuit board, then the solution is vaporized through the evaporation of the heat, the collection area is enlarged through the funnel-shaped expansion bucket 1902, and the vaporized air is discharged to other spaces through the exhaust fan 1901.

The working principle is as follows: firstly, when a rough plating circuit board is electroplated again, the circuit board is clamped firstly, the circuit board is placed inside the fixed clamping plate 501, then the telescopic pushing block 7 is pushed, the telescopic pushing block 7 is made to extrude the rotating rod 804, because of the rotating property of the rotating rod 804, the sliding chuck 802 connected with the inner side of the rotating connecting piece 803 can be pushed to move close to each other in the rotating process, then the circuit board is clamped and fixed, then the circuit board is placed in the electroplating box 12 for immersion electroplating through the longitudinal adjustment of the vertical sliding block 301 and the movement adjustment of the connecting sliding block 401 at the lower end of the movable sliding rail 302, when the electroplating process is completed, the circuit board is moved by taking the electric sliding rail 9 as the main force, in order to prevent the gravity extrusion of the protection frame 2 from influencing the sustainable sliding of the electric sliding rail 9, the sliding connection support is carried out through the arrangement of the roller 1002, and the convenience of sliding is increased, after the circuit board is taken out from the electroplating tank 12, the surface still adheres with electroplating solution, because the electroplating solution generally adopts sulfate solution, is acidic, the bottom of the circuit board after being taken up is blocked by arranging the liquid blocking tank 14, the solution is allowed to drip through the top of the liquid blocking tank 14, the automatic sliding connecting block 1601 of the equipment slides on the slideway 15, so that two sides of the inclined baffle 1602 are opened to form an expanded receiving solution, the expanded receiving solution is finally collected in the collecting tank 1701 and is discharged and collected through the extension pipe 1702, at the moment, in order to prevent the liquid on the surface of the circuit board from drying, the next operation is carried out, air can be blown through the blower 1801, then the heat on the heating plate 1802 is driven to blow onto the circuit board, then the solution is vaporized through the evaporation of the heat, the collecting area is enlarged through the funnel-shaped expansion hopper 1902, and the vaporized air is discharged to other spaces through the exhaust fan 1901, the most important equipment of electroplating is exactly electroplating tank 12, is the main equipment that bears of electroplating circuit board, and current electroplating tank 12 is all immovable, produces the damage back in inside, is unfavorable for changing, for this reason, is provided with bottom guard plate 1301 at electroplating tank 12's lower extreme, then connects and link wheel board 1302 and remove, can carry out the position through buffer block 1303 and prescribe a limit to the extrusion, then fixes inserting slip peg 1304 in spliced eye 11.

Claims

1. The utility model provides a device is electroplated again to high efficiency of coarse cladding layer circuit board, a serial communication port, including supporting baseplate (1) and centre gripping subassembly (8), the upper end outside of supporting baseplate (1) is connected with protecting frame (2), and the inboard of protecting frame (2) is provided with removes subassembly (3), the lower extreme that removes subassembly (3) is connected with coupling assembling (4), and coupling assembling (4) are including link block (401) and connecting plate (402), the lower extreme of link block (401) is connected with connecting plate (402), and the lower extreme middle part of connecting plate (402) is provided with fixed joint subassembly (5), the lower extreme left and right sides of connecting plate (402) all is provided with flexible promotion piece (7), and the inboard that stretches out and draws back promotion piece (7) is connected with removal joint board (6), centre gripping subassembly (8) set up in the inside that removes joint board (6).

2. The efficient re-electroplating device for the rough-plated circuit board as recited in claim 1, wherein the fixed clamping component (5) comprises a fixed clamping plate (501) and a clamping groove (503), the fixed clamping plate (501) drives the lower end to be connected with the bottom support plate (502), and the clamping groove (503) is arranged inside the fixed clamping plate (501).

3. The high-efficiency re-electroplating device for the rough-plated circuit board according to claim 1, wherein the clamping assembly (8) comprises a fixing plate (801), a sliding chuck (802), a rotating connector (803) and a rotating rod (804), the sliding chuck (802) is connected to the inner side of the fixing plate (801), the rotating connector (803) is connected to one end, away from the horizontal center line of the fixing plate (801), of the sliding chuck (802), and the rotating rod (804) is connected to the inside of the rotating connector (803).

4. The efficient replating device for rough-plated circuit boards as claimed in claim 1, wherein the moving assembly (3) comprises a vertical sliding block (301) and a moving slide rail (302), and the moving slide rail (302) is connected to the inner side of the vertical sliding block (301).

5. The efficient re-electroplating device for the rough-plated circuit board as recited in claim 1, wherein an electric slide rail (9) is arranged outside the protective frame (2), a rolling assembly (10) is connected to the lower end of the electric slide rail (9), the rolling assembly (10) comprises a mounting block (1001) and a roller (1002), and the roller (1002) is connected to the lower end of the mounting block (1001).

6. The efficient re-electroplating device for the rough-plated circuit board as claimed in claim 1, wherein the support base plate (1) is provided with a plug-in hole (11) therein, the middle of the upper end of the support base plate (1) is provided with an electroplating box (12), and the lower end of the interior of the electroplating box (12) is connected with a position adjusting assembly (13).

7. The efficient re-electroplating device for the rough-plated circuit board as recited in claim 6, wherein the position adjusting assembly (13) comprises a bottom protection plate (1301), a wheel connecting plate (1302), a buffer block (1303) and a sliding insertion rod (1304), the wheel connecting plate (1302) is arranged inside the bottom protection plate (1301), the sliding insertion rod (1304) is connected to the front end of the bottom protection plate (1301), and the buffer block (1303) is arranged at the rear end of the bottom protection plate (1301).

8. The efficient re-electroplating device for the rough-plated circuit board as recited in claim 1, wherein a liquid blocking box (14) is connected to the inner rear wall of the protective frame (2), a slide way (15) is connected to the inner bottom wall of the liquid blocking box (14), an expansion component (16) is connected to the upper end of the slide way (15), the expansion component (16) comprises a sliding connection block (1601), an inclined baffle (1602) and a limiting block (1603), the upper end of the sliding connection block (1601) is connected with the inclined baffle (1602), the outer side of the inclined baffle (1602) is connected with the limiting block (1603), and a liquid leakage component (17) is arranged inside the lower wall of the liquid blocking box (14).

9. The apparatus for efficiently replating a rough-plated circuit board according to claim 8, wherein said drain assembly (17) comprises a collection tank (1701) and an extension pipe (1702), and the extension pipe (1702) is connected to the rear end of the collection tank (1701).

10. The efficient re-electroplating device for the rough-plated circuit board according to claim 1, wherein a drying component (18) is mounted inside the left wall of the protective frame (2), the drying component (18) comprises a blower (1801) and a heating plate (1802), the heating plate (1802) is connected to the right end of the blower (1801), an air suction component (19) is mounted inside the right wall of the protective frame (2), the air suction component (19) comprises an exhaust fan (1901) and an expansion bucket (1902), and the expansion bucket (1902) is connected to the left end of the exhaust fan (1901).