KR970064810A - Tin (Sn) -bismuth (Bi) -antimony (Sb) -Aluminum (Al) alloy for solder not containing lead (Pb) - Google Patents

Tin (Sn) -bismuth (Bi) -antimony (Sb) -Aluminum (Al) alloy for solder not containing lead (Pb) Download PDF

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Publication number
KR970064810A
KR970064810A KR1019960008426A KR19960008426A KR970064810A KR 970064810 A KR970064810 A KR 970064810A KR 1019960008426 A KR1019960008426 A KR 1019960008426A KR 19960008426 A KR19960008426 A KR 19960008426A KR 970064810 A KR970064810 A KR 970064810A
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KR
South Korea
Prior art keywords
alloy
aluminum
tin
solder
antimony
Prior art date
Application number
KR1019960008426A
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Korean (ko)
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KR0182411B1 (en
Inventor
김창주
Original Assignee
서상기
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 서상기, 한국기계연구원 filed Critical 서상기
Priority to KR1019960008426A priority Critical patent/KR0182411B1/en
Priority to US08/770,797 priority patent/US5851482A/en
Publication of KR970064810A publication Critical patent/KR970064810A/en
Application granted granted Critical
Publication of KR0182411B1 publication Critical patent/KR0182411B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

중금속인 납(Pb)이 함유되지 않은 땜질(solder)재로서, 그 합금성분은 비스므스(Bi)를 0.5~30.0wt%(중량 백분률) 함유하고, 여기에 안티몬(Sb)을 0.2~10.0wt%(중량백분율), 여기에 알루미늄(Al)을 0.1~3.0wt%(중량 백분율) 함유하고, 나머지는 주석(Sn)인 것을 특징으로 하는 합금이다.A solder material containing no lead (Pb), which is a heavy metal, contains 0.5 to 30.0 wt% (weight percentage) of Bi as the alloy component, and 0.2 to 10.0 (weight percentage) of aluminum (Al), 0.1 to 3.0 wt% (weight percentage) of aluminum (Al), and the remainder is tin (Sn).

본 발명인 새로운 합금은 종래의 납(Pb)-주석(Sn) 합금과 비교하여 용융상태에서의 점도, 젖음성, 응고속도 및 응고 후 광택 등의 땜질특성에 조금도 손색이 없다.The new alloy of the present invention is in no way inferior to the conventional lead (Pb) -stin (Sn) alloy in terms of viscosity in a molten state, wettability, solidification rate and brazing characteristics such as gloss after solidification.

Description

납(Pb)이함유되지 않은 땜질(solder)용 주석(Sn)-비스미스(Bi)-안티몬(Sb)합금Tin (Sn) for lead solder without lead (Pb) - Bi-antimony (Sb) alloy

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

Claims (1)

동 및 동합금을 땜질하는 땜질재(solder)로서, 그 합금성분은 비스므스(Bi)를 0.5~30.0wt%(중량백분률)함유하고, 여기에 안티몬(Sb)을 0.2~10.0wt%(중량백분률), 여기에 알루미늄(Al)을 0.1~3.0wt%(중량백분률)함유하고, 나머지는 주석(Sn)인 것을 특징으로 하는 합금.A solder for soldering copper and a copper alloy, wherein the alloy component contains Bi to 0.5 to 30.0 wt% (weight percentage), antimony (Sb) to 0.2 to 10.0 wt% (Al) is contained in an amount of 0.1 to 3.0 wt% (weight percentage), and the remainder is tin (Sn). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960008426A 1996-03-22 1996-03-22 Sn-bi-sb-al alloy not containing pb KR0182411B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019960008426A KR0182411B1 (en) 1996-03-22 1996-03-22 Sn-bi-sb-al alloy not containing pb
US08/770,797 US5851482A (en) 1996-03-22 1996-12-20 Tin-bismuth based lead-free solder for copper and copper alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960008426A KR0182411B1 (en) 1996-03-22 1996-03-22 Sn-bi-sb-al alloy not containing pb

Publications (2)

Publication Number Publication Date
KR970064810A true KR970064810A (en) 1997-10-13
KR0182411B1 KR0182411B1 (en) 1999-04-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960008426A KR0182411B1 (en) 1996-03-22 1996-03-22 Sn-bi-sb-al alloy not containing pb

Country Status (1)

Country Link
KR (1) KR0182411B1 (en)

Also Published As

Publication number Publication date
KR0182411B1 (en) 1999-04-01

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