KR970060472A - DEFLECTING DEVICE AND METHOD FOR SEMICONDUCTOR PACKAGE - Google Patents

DEFLECTING DEVICE AND METHOD FOR SEMICONDUCTOR PACKAGE Download PDF

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Publication number
KR970060472A
KR970060472A KR1019960001986A KR19960001986A KR970060472A KR 970060472 A KR970060472 A KR 970060472A KR 1019960001986 A KR1019960001986 A KR 1019960001986A KR 19960001986 A KR19960001986 A KR 19960001986A KR 970060472 A KR970060472 A KR 970060472A
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KR
South Korea
Prior art keywords
grind
lead frame
molded
rotating shaft
semiconductor package
Prior art date
Application number
KR1019960001986A
Other languages
Korean (ko)
Other versions
KR0177403B1 (en
Inventor
차기본
최신
Original Assignee
문정환
Lg 반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 문정환, Lg 반도체주식회사 filed Critical 문정환
Priority to KR1019960001986A priority Critical patent/KR0177403B1/en
Publication of KR970060472A publication Critical patent/KR970060472A/en
Application granted granted Critical
Publication of KR0177403B1 publication Critical patent/KR0177403B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 발명은 저면에 몰딩된 수지 사이로 리드가 노출된 패키지 타입의 리드에 형성된 프레쉬를 제거하는 반도체 패키지의 디플레쉬장치 및 그 방법에 있어서, 회전축과, 회전축을 에워싸면서 형성되어, 회전축이 회전함에 따라 회전되는 그라인드와, 그라인드 상에서 상하구동되어, 상기 몰딩된 리드프레임을 고정하는 고정수단을 포함하여 이루어지는 것을 특징으로 하는 반도체 패키지의 디플레쉬장치와 저면이 그라인드에 안착되고, 상면이 고정수단에 의해 고정되는 몰딩된 리드프레임은 그라인드가 회전함에 따라, 몰딩된 수지 사이에 노출된 리드에 형성된 프레쉬가 그라인딩되는 것을 특징으로 하는 반도체 패키지의 디플레쉬 방법에 관한 것이다.The present invention relates to a deflection device for a semiconductor package which removes a freshness formed on a lead of a package type in which a lead-molded resin lid is exposed, and a method of defraping the semiconductor package, comprising a rotating shaft and a rotating shaft, And a fixing means for vertically driving the grind and rotating the molded lead frame so as to fix the molded lead frame. The deflection device and the bottom surface of the semiconductor package are seated on the grind, and the upper surface is fixed by the fixing means The fixed molded lead frame is characterized in that as the grind rotates, the fresh formed on the leads exposed between the molded resin is ground.

Description

반도체 패키지의 디플레쉬장치 및 그 방법DEFLECTING DEVICE AND METHOD FOR SEMICONDUCTOR PACKAGE

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명의 반도체 패키지의 디플레쉬장치 및 그 방법을 설명하기 위한 도면이다.FIG. 2 is a view for explaining a deflection apparatus and a method of the semiconductor package of the present invention.

Claims (6)

저면에 몰딩된 수지 사이로 리드가 노출된 패키지 타입의 리드에 형성된 프레쉬를 제거하는 디플레쉬장치에 있어서, 회전축과, 상기 회전축을 에워싸면서 형성되어, 상기 회전축이 회전함에 따라 회전되는 그라인드와, 상기 그라인드 상에서 상하구동되어, 상기 몰딩된 리드프레임을 고정하는 고정수단을 포함하여 이루어지는 것을 특징으로 하는 반도체 패키지의 디플레쉬장치.A deflashing apparatus for removing a fresh formed on a lead of a package type in which a lead-molded resin is exposed on a bottom surface, the deflection apparatus comprising: a rotating shaft; a grind formed around the rotating shaft and rotated as the rotating shaft rotates; And fixing means for vertically driving on the grind and fixing the molded lead frame. 제1항에 있어서, 상기 고정수단으로는 상부에는 프레스판과, 하부에는 스폰지가 형성되어, 상기 스폰지의 저면과 상기 몰딩된 리드프레임의 상면이 접촉되면서 고정되는 것을 특징으로 하는 반도체 패키지의 디플레쉬장치.The semiconductor package according to claim 1, wherein the fixing means comprises a press plate at the upper portion and a sponge at the lower portion, wherein the lower surface of the sponge and the upper surface of the molded lead frame are fixed while being in contact with each other. Device. 제2항에 있어서, 상기 프레스판은 고무재질로 형성되는 것을 특징으로 하는 반도체 패키지의 디플레쉬장치.The apparatus of claim 2, wherein the press plate is made of a rubber material. 제1항에 있어서, 상기 그라인드로는 조도가 50에서 2400인 번호의 사포가 사용되는 것을 특징으로 하는 반도체 패키지의 디플레쉬장치.The deflection device of claim 1, wherein a number of sandpaper having an illuminance of 50 to 2400 is used in the grinding furnace. 제1항에 있어서, 상기 디플레쉬장치의 상부에 세정액을 분사하는 노즐이 부가되어, 상기 몰딩된 리드프레임의 상기 리드에서 그라인딩된 프레쉬를 제거는 것을 특징으로 하는 반도체 패키지의 디플레쉬장치.2. The deflection device of claim 1, wherein a nozzle for injecting a cleaning liquid is provided on the upper portion of the deflashing device to remove the grinding freshness from the lead of the molded lead frame. 회전축과, 회전축을 에워싸면서 형성되어, 회전축이 회전함에 따라 회전되는 그라인드와, 그라인드 상에서 상하구동되어, 상기 몰딩된 리드프레임을 고정하는 고정 수단을 포함하여 이루어지는 반도체 패키지의 디플레쉬장치를 이용한 반도체 패키지의 디플레쉬 방법에 있어서, 저면이 상기 그라인드에 안착되고, 상면이 고정수단에 의해 고정되는 상기 몰딩된 리드프레임은 상기 그라인드가 회전됨에 따라, 몰딩된 수지 사이에 노출된 상기 리드에 형성된 프레쉬가 그라인딩되는 것을 특징으로 하는 반도체 패키지의 디플레쉬방법.A grind formed around the rotary shaft and rotated as the rotary shaft rotates; and fixing means for being vertically driven on the grind and fixing the molded lead frame, the semiconductor device comprising: A method of defragmenting a package, the method comprising the steps of: a) forming a bottom surface on the grind, the top surface of which is secured by means of securing means, as the grind is rotated, Wherein the semiconductor wafer is grounded. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960001986A 1996-01-30 1996-01-30 Deflash apparatus of package and the method thereof KR0177403B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960001986A KR0177403B1 (en) 1996-01-30 1996-01-30 Deflash apparatus of package and the method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960001986A KR0177403B1 (en) 1996-01-30 1996-01-30 Deflash apparatus of package and the method thereof

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KR970060472A true KR970060472A (en) 1997-08-12
KR0177403B1 KR0177403B1 (en) 1999-03-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100453692B1 (en) * 1997-12-30 2005-02-24 앰코 테크놀로지 코리아 주식회사 Apparatus for removing flash of leadframe for semiconductor package to remove flash of material passing through guide rail

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100453692B1 (en) * 1997-12-30 2005-02-24 앰코 테크놀로지 코리아 주식회사 Apparatus for removing flash of leadframe for semiconductor package to remove flash of material passing through guide rail

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Publication number Publication date
KR0177403B1 (en) 1999-03-20

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